Hitachi, Ltd.

Hitachi Industrial Equipment Systems Co., Ltd.

Toshio Haba

Haruo Akahoshi

Hitoshi Suzuki

Masahiko Ogino

Akihiro Miyauchi

Mitsuru Hasegawa

Takeyuki Itabashi

Kenya Ohashi

Shinichi Fukada

Hiroshi Yoshida

Kinya Kobayashi

Akihiro Sano

The fine pattern mold that includes a roll, a buffer tube with inner peripheral surface is in contact with an outer peripheral surface of the roll, and a stamper tube in which its inner peripheral surface is in contact with an outer peripheral surface of the buffer tube and a fine concave/convex pattern is formed on its outer peripheral surface, wherein the buffer tube has a larger coefficient of linear expansion and a smaller elastic modulus than those of the stamper tube.

Fine pattern mold

The fine pattern mold comprises: that includes a roll, a buffer tube with inner peripheral surface is in contact with an outer peripheral surface of the roll, and a stamper tube in which its inner peripheral surface is in contact with an outer peripheral surface of the buffer tube and a fine concave/convex pattern is formed on its outer peripheral surface, wherein the buffer tube has a larger coefficient of linear expansion and a smaller elastic modulus than those of the stamper tube.

The present invention provides a method for producing a metal structure comprising a substrate and a metal film formed on the substrate; comprising the steps of providing surface having irregularities made of a electrical conductor in the area of the substrate where the metal body or film is to be formed; and preferentially forming the metal body or film by electroplating in the area provided with the conductive surface having irregularities. The plating bath may preferably contain an additive compound such as a cyanine dye which is capable of suppressing the plating reaction, and which loses such plating-suppressing effect with the progress of the plating reaction. The metal film can be produced by electroplating in the area provided with the surface having irregularities.

Metal structure and method of its production

Plating method using an additive

Semiconductor device and method of manufacturing the same

Growing community of inventors

Tokai, Japan

Toshio Haba