Shinko Electric Industries Co., Ltd.

Toshio Gomyo

Yukiharu Takeuchi

Hidenori Takayanagi

Takaharu Yamano

Mitsutoshi Higashi

Kei Murayama

Masahiro Sunohara

Hiroki Toyazaki

There is provided a semiconductor device which includes a primary semiconductor chip, a secondary semiconductor chipstacked on the primary semiconductor chip, primary external connecting terminalswhich are electrically connected with the primary semiconductor chipvia wires, secondary external connecting terminalswhich are electrically connected with the secondary semiconductor chipvia wiresand primary and secondary low-elasticity resinswhich seal the primary and secondary semiconductor chipsin such a manner as to cover them.

Semiconductor device, electronic apparatus and semiconductor device fabricating method

A method of manufacturing an electronic parts packaging structure including the steps of preparing a plurality of sheet-like units each of which is constructed by a first insulating layer, a wiring formed on one surface of the first insulating layer, electronic parts connected to the wiring, a second insulating layer formed on an one surface side of the first insulating layer to cover the electronic parts, and a connecting portion for connecting electrically the wiring, and stacking mutually the units to arrange directions of unit adjacent in a thickness direction alternately oppositely, and bonding the units such that electronic parts of respective units are electrically connected mutually via connecting portions.

Method of manufacturing an electronic parts packaging structure

In an electronic parts packaging structure of the present invention constructed by stacking a plurality of sheet-like units in a thickness direction, each of the units includes a first insulating layer, wirings formed on one surface of the first insulating layer, a semiconductor chip (electronic parts) connected to the wirings, a second insulating layer formed on an one surface side of the first insulating layer to cover the semiconductor chip, and connecting portions (terminals and contact vias) for connecting electrically the wirings and wirings of other unit, wherein arrangement of the first insulating layer, the semiconductor chip, the wirings, and the second insulating layer is symmetrical between units adjacent in a thickness direction.

Electronic parts packaging structure

In a capacitor-mounted wiring board, a plurality of wiring layers each patterned in a required shape are stacked with insulating layers interposed therebetween and are connected to each other via conductors formed to pierce the insulating layers in the direction of thickness. A decoupling capacitor is electrically connected to a wiring layer used as a power supply line or a ground line in the vicinity of the wiring layer, and mounted such that, when a current is passed through the capacitor, the direction of the current is reversed to that of the current flowing through the relevant wiring layer.

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Nagano, Japan

Toshio Gomyo