Panasonic Corporation

Matsushita Electric Industrial Co., Ltd.

Sharp Kabushiki Kaisha Corporation

Toshio Fujii

Seiichi Nakatani

Takashi Ichiryu

Yoshihisa Yamashita

Seiji Karashima

Satoru Tomekawa

Hiroki Yabe

Koichi Hirano

Yoshihiro Tomita

Masaru Sasago

Yoshihiro Mori

Toshiyuki Fukuda

Yasuhiro Sugaya

Toshiyuki Asahi

Yutaka Taguchi

Nobuo Aoi

Takeshi Kawabata

Tatsuo Mifune

Naofumi Kondo

Takashi Yui

Satoru Kishimoto

Wataru Horie

Takayoshi Nagayasu

Yutaka Harada

Hiroto Ohsaki

A lamination structure includes a first semiconductor chip and a second semiconductor chip stacked via a bonding section so that a rear surface of the first semiconductor chip faces the main surface of the second semiconductor chip. At least a part of a side surface of the first semiconductor chip are covered with a first resin, a distribution layer is formed on the plane formed of the main surface of the first semiconductor chip and a surface of the first resin. At least part of electrodes existing in the main surface of the second semiconductor chip is electrically connected to at least part of first external electrodes formed on the distribution layer via the penetration electrodes that penetrate the first semiconductor chip.

Semiconductor device having stacked chips, a re-distribution layer, and penetration electrodes

A light-emitting device includes a light-emitting element and a wavelength conversion layer. The light-emitting device further includes the translucent member having a translucent base and the wavelength conversion layer formed on the translucent base. The wavelength conversion layer does not contact the light-emitting element, and is sealed in the light-emitting device.

Light-emitting device

The present invention provides a liquid crystal display panel and a liquid crystal display device presenting a reduced color addition and an improved bright room contrast. The liquid crystal display panel of the present invention includes wirings made of a metal having at least 90% reflection over a wavelength region within the visible light region, where the reflectance of the liquid crystal panel over a wavelength range of 600 to 700 nm at the display surface is no greater than 150% of the reflectance at the wavelength of 550 nm at the display surface.

Liquid crystal display panel, and liquid crystal display device

A liquid crystal display device () according to the present invention has a pixel (P), which includes red, green, blue and yellow subpixels (R, G, B and Y). The chromaticity of the yellow subpixel (Y) is outside of a triangle that is defined by connecting together the respective chromaticities of the red, green and blue subpixels (R, G and B). And the respective aperture areas S, S, Sand Sof the red, green, blue, and yellow subpixels (R, G, B and Y) and the respective transmittances T, T, Tand Tof their associated red, green, blue, and yellow color filters (CR, CG, CB and CY) satisfy the inequality T&#x3e;[(S+S+S+S)(T+T+T)&#x2212;3(S&#xd7;T+S&#xd7;T+S&#xd7;T)]/3S.

Liquid crystal display device

A flexible substrate includes: (i) a film; (ii) an insulating resin layer formed on each of a front face of the film and a rear face of the film, which rear face is opposite to the front face; (iii) a front-sided wiring pattern embedded in the insulating resin layer formed on the front face of the film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on the rear face of the film; and (iv) a via which is located between the front-sided wiring pattern and the rear-sided wiring pattern and serves to electrically interconnect the front-sided wiring pattern and the rear-sided wiring pattern, wherein the insulating resin layer formed on each of the front face and the rear face of the film is thicker than the film.

Flexible substrate, multilayer flexible substrate

In a flip chip mounted body in which a semiconductor chip () having a plurality of electrode terminals () is disposed so as to be opposed to a wiring board () having a plurality of connection terminals (), with the connection terminals () and the electrode terminals () being connected electrically, a resin () containing electrically conductive particles () is supplied between the connection terminals () and the electrode terminals (), the electrically conductive particles () and the resin () are heated and melted, and vibrations are applied so as to make them flow. The molten electrically conductive particles () are allowed to self-assemble between the connection terminals () and the electrode terminals (), thereby forming connectors () that connect them electrically. It becomes more likely that the molten electrically conductive particles in the resin contact the connection terminals or the electrode terminals, whereby the molten electrically conductive particles self-assemble between the electrode terminals and the connection terminals that have a high wettability, making it possible to form connectors for establishing an electric connection between these terminals in a uniform manner.

Flip chip mounting body and method for mounting such flip chip mounting body and bump forming method

A flip chip mounting process or a bump-forming process according to the present invention is characterized in that electrically-conductive particles are fixed on electrodes formed on an electronic component. A composition comprising solder powder, a convection additive and a resin component is supplied onto a surface of the electronic component, the surface is provided with the electrodes. The supplied composition is heated up to a temperature enabling the solder powder to melt. As a result, the convection additive boils or is decomposed so as to generate a gas. The generated gas produces a convection phenomenon within the supplied composition. Since the convection phenomenon promotes the movement of the solder powder, the solder powder can move freely within the composition. The electrically-conductive particles serve as nuclei for the solder powder to self-assemble and grow. As a result, the molten solder powder is allowed to self-assemble and grow in the vicinity of the electrically-conductive particles, which leads to a formation of connections or bumps.

Flip chip mounting process and bump-forming process using electrically-conductive particles as nuclei

A flexible substrate comprises a film, a first insulating resin layer on a front face of the film, a second insulating resin layer on a rear face of the film, a front-sided wiring pattern embedded in the first insulating resin layer, and a rear-sided wiring pattern embedded in the second insulating resin layer. A surface of the front-sided wiring pattern is flush with a surface of the first insulating resin layer, and a surface of the rear-sided wiring pattern is flush with a surface of the second insulating resin layer. A part of at least one of the front-sided wiring pattern and the rear-sided wiring pattern is dented toward a part of the other of the at least one of the front-sided wiring pattern and the rear-sided wiring pattern such that a portion of the front-sided wiring pattern and a portion of the rear-sided wiring pattern are jointed to each other to form a junction.

Flexible substrate having interlaminar junctions, and process for producing the same

A flexible substrate comprises: a film; an insulating resin layer formed on each of a front face of the film and a rear face of the film, which rear face is opposite to the front face; a front-sided wiring pattern embedded in the insulating resin layer formed on the front face of the film, and a rear-sided wiring pattern embedded in the insulating resin layer formed on the rear face of the film; and a via which is located between the front-sided wiring pattern and the rear-sided wiring pattern and serves to electrically interconnect the front-sided wiring pattern and the rear-sided wiring pattern, wherein the insulating resin layer formed on each of the front face and the rear face of the film is thicker than the film.

Flexible substrate, multilayer flexible substrate and process for producing the same

A module with a built-in circuit component of the present invention includes an electric insulating layer, a pair of wiring layers provided on both principal planes of the electric insulating layer, a plurality of via conductors electrically connecting the pair of wiring layers and passing through the electric insulating layer in a thickness direction thereof, and a circuit component buried in the electric insulating layer, wherein the plurality of via conductors are disposed in a circumferential portion of the electric insulating layer in accordance with a predetermined rule. The plurality of via conductors are placed at an interval, for example, so as to form at least one straight line, in a cut surface of the electric insulating layer in a direction parallel to a principal plane thereof.

Module with built-in circuit component and method for producing the same

A liquid crystal display apparatus is produced by the steps of arranging pixel electrodes, TFT devices and signal wiring on one surface of one substrate, arranging a transparent layer on a portion of one surface of a transparent substrate which portion is to be a display portion, bonding the one substrate and the transparent substrate to each other while the one surface having the pixel electrodes formed thereon faces the one surface having the transparent layer formed thereon, and injecting a liquid crystal between the substrates to form a liquid crystal layer. A fluidization path of the liquid crystal can be secured in a non-display portion, too, in which the TFT devices and the signal wiring are disposed when the liquid crystal is injected. Therefore, it is possible to shorten the injection time by increasing the liquid crystal injection speed and to improve productivity.

Liquid crystal display apparatus and production method thereof

A material usable for the electrodes and the dielectric layer plasma display panels and capable of reducing the occurrence of yellowing and a high-image-quality plasma display panel using the material are provided. Using glass powder containing 25 to 50 wt % of Bi O , 5 to 35 wt % of B O , 10 to 20 wt % of ZnO, 5 to 20 wt % of BaO, 0 to 15 wt % of SiO and 0 to 10 wt % of Al O , the electrodes and the dielectric layer of a plasma display panel are formed.

Electrode material, dielectric material and plasma display panel using them

The liquid crystal display device of this invention includes a first substrate, a second substrate opposing the first substrate, and a liquid crystal layer sandwiched between the first and the second substrates, wherein the liquid crystal layer includes a polymer region and a liquid crystal domain surrounded by the polymer region in which liquid crystal molecules are oriented in an axial symmetrical manner, the first substrate includes a dry film having a concave portion on a surface facing the liquid crystal layer, and a symmetric axis in the liquid crystal domain substantially extends through the concave portion and is substantially perpendicular to the first substrate.

Growing community of inventors

Osaka, Japan

Toshio Fujii