Nippon Shokubai Kagaku Kogyo Co., Ltd.

Nippon Shokubai Co., Ltd.

Matsushita Electric Works, Ltd.

Toshio Awaji

Kenichi Ueda

Daisuke Atobe

Motohiro Arakawa

Nobuaki Otsuki

Nobuaki Ohtsuki

Takao Omi

Hiromichi Tanaka

Keiji Yurugi

Akihiko Fukada

Hidekazu Takano

Koji Takabatake

Shigehiro Okada

Masaaki Bundo

Katsuaki Shindo

Tetsuo Kunitomi

Kaoru Mori

It is an object of the present invention to provide a compound having a (meth)acryloyl group that is suitably used in various applications, a process for producing such compound simply and under mild conditions, and an useful photo-curable composition and aqueous photo-curable composition comprising such compound. The present invention is related to a process for producing a compound having a (meth)acryloyl group

(Meth) acryloyl group-containing compound and method for producing the same

Multilayer material

The present invention provides a radically polymerizable curable resin obtained by modifying an epoxy resin by reacting a phenol compound having an alcoholic hydroxyl group; and an unsaturated monobasic acid, to the epoxy resin having two or more epoxy groups in a molecule. The epoxy resin is reacted with the phenol compound and the unsaturated monobasic acid. The curable resin is subjected to polymerization curing with heat or light to form a cured product having excellent heat resistance, moisture resistance, and adhesion to substrates. The present invention also provides a curable resin composition containing the curable resin, as well as an alkaline-developable curable resin capable of forming a coating layer having excellent tack-free property, quick developability and excellent properties of cured layer.

Curable resin and resin composition

The photo-curable liquid solder resist ink composition of the present invention mainly comprises a photo-polymerizable resin having sufficient molecular weight and (meth)acryloyl groups which are imparted by both of introduction of (meth)acryloyl groups into a novolak-type epoxy resin having 4 or more of benzene nuclei and polymerization using a chain-extension agent. The composition is useful for a photo-curable type resist, since it can produce a coated film excellent in tack free characteristic and resolution, and can produce a cured film excellent in heat resistance, adhesiveness, and chemical resistance. In addition, by reacting with an acid anhydride, development with alkalis becomes possible.

Solder resist ink composition of a novolak-epoxy resin

Production method for photo-sensitive resin and liquid photo-sensitive

A resin composition useful as a matrix resin for a composite material comprises (A) from 30-80% by weight of an amino group-containing unsaturated ester compound obtained by ring-opening addition reacting an epoxy group-containing unsaturated compound (c) with an aromatic polyamine (a) or diamine (b) in an equivalent weight ratio of compound (c) to amino hydrogen atom of polyamine (a) or diamine (b) of from 0.25-0.9:1, (B) from 10-60% by weight of a polyepoxy compound, and (C) from 5-60% by weight of a radically polymerizable cross-linking agent such as p-methyl styrene.

Resin composition

A thermosetting resin composition of highly satisfactory storage stability comprises 100 parts by weight of a thermosetting resin composition, 0.0001 to 2.0 parts by weight of a thiuram compound possessing at least one atomic group represented by the following formula: ##STR1## wherein p stands for an integer in the range of 1 to 8, and 0.00001 to 0.1 part by weight (as copper metal) of a copper-containing compound.

Resin composition of high storage stability

A heat-resistant resin composition, comprising (A) 30 to 95% by weight of at least oen unsaturated ester compound selected from the group consisting of (I) unsaturated ester compounds represented by the formula I: ##STR1## wherein R.sup.1 s independently stand for one member selected from the class consisting of ##STR2## wherein R.sup.3 and R.sup.4 independently stand for a hydrogen atom or a methyl group, and a hydrogen atom, and at least one R.sup.1 stands for ##STR3## wherein R.sup.3 and R.sup.4 independently stand for a hydrogen atom or a methyl group, and R.sup.2 s independently stand for an atom or an organic group selected from the class consisting of a hydrogen atom, halogen atoms, a methoxy group, and alkyl groups of 1 to 5 carbon atoms, and m stands for 0 or an integer in the range of 1 to 10, and (II) unsaturated ester compounds represented by the formula II; ##STR4## wherein R.sup.5 s independently stand for one member selected from the class consisting of ##STR5## wherein R.sup.3 and R.sup.4 independently stand for a hydrogen atom or a methyl group, and a hydrogen atom, at least one R.sup.5 stands for ##STR6## wherein R.sup.3 and R.sup.4 independently stand for a hydrogen atom or a methyl group, R.sup.6 s independently stand for an atom or an organic group selected from the class consisting of a hydrogen atom, halogen atoms, a methoxy group, and alkyl groups of 1 to 5 carbon atoms, n stands for 0 or an integer in the range of 1 to 10, and X stands for a divalent organic group selected from the class consisting of ##STR7## where n is 0 or X's independently stand for a divalent organic group selected from the class consisting of ##STR8## wherein n is an integer in the range of 1 to 10, (B) 70 to 5% by weight of a polymerizable crosslinking agent, and (C) 0.,5 to 15 parts by weight, based on 100 parts by weight of a vinyl ester resin composed of (A) said unsaturated ester compound and (B) said polymerizable crosslinking agent, of a butadiene-acrylonitrile copolymer having at least one (meth)acryloyl group in the molecular unit thereof.

Composition of unsaturated ester, polymerizable crosslinking agent and

An electric metal foil-plated laminate sheet which is obtained by laminating a cured layer of a thermosetting resin composition with electroconductive foils, said thermosetting resin composition comprising 30-85% by weight of (A) a rubber-modified vinyl ester obtained by reacting,

Laminate with layer of rubber-modified vinyl ester and unsaturated

Curable resin composition with a thiuram and a copper compound as

A method for improving storage stability of a thermosetting resin, which comprises adding a thiuram compoound to the thermosetting resin comprising a reaction product of an epoxy resin with an .alpha.,.beta.-unsaturated monocarboxylic acid dissolved in a polymerizable olefinic unsaturated compound, said thiuram compound having in one molecule thereof at least one atomic group expressed by the following general formula I: ##STR1## wherein p is an integer of 1 to 4, and being used in an amount of 0.0001 to 2.0 parts by weight per 100 parts by weight of said reaction product.

Growing community of inventors

Kawanishi, Japan

Toshio Awaji