Fuji Machine Mfg. Co., Ltd.

Fuji Corporation

Toshinori Shimizu

Masaki Murai

Toshihiko Yamasaki

Hiroyasu Ohashi

Manabu Mizuno

Jun Adachi

Shigeto Oyama

Takeyoshi Isogai

Mamoru Tsuda

Tosuke Kawada

Toshiya Ito

Fumitaka Maeda

Masashi Hayakawa

Takahiro Otsuki

Satoshi Shioya

Nobumichi Ishida

Isao Tsuzuki

Akinobu Ito

An image analysis section executes instruction processing to image electronic component while changing a shutter speed of measurement camera between a predetermined lower limit speed and a predetermined upper limit speed calculation processing of comparing an image of lower surface of each lead included in each of multiple imaging data acquired from the measurement camera with an ideal image of lower surface of each lead included in ideal imaging data to calculate a missing rate at which the image of lower surface of each lead is missing with respect to the ideal image for each of the multiple imaging data, detection processing of detecting imaging data having a missing rate equal to or less than a predetermined first threshold among multiple missing rates calculated by the calculation processing, and selection processing of selecting a shutter speed used for capturing the imaging data detected by the detection processing.

Recognition device and recognition method

A component mounting device moves a board height sensor horizontally to multiple measuring points and measures heights of the front surface of the board at the multiple measuring points. Subsequently, the component mounting device obtains a positional deviation in the horizontal direction of a target mounting position on the front surface of the board based on the heights of the front surface of the board so measured. In addition, the component mounting device obtains a positional deviation in a vertical direction of the target mounting position based on a measured height in the vertical direction of the front surface of the board. Then, the component mounting device corrects the target mounting position based on the positional deviation in the horizontal direction and the positional deviation in the vertical direction that are so obtained and mounts a component in the target mounting position so corrected.

Component mounting device

A component mounting device includes a heater unit which heats along a range which is narrower than a movement range of a head and which is a partial length of a board, in which the head is controlled to mount components onto the board using a heating range of the heater as a mounting range, the board is conveyed to shift the mounting range every time mounting of components in the mounting range is completed such that an unmounted range in which components are not mounted on the board becomes the mounting range, and components are mounted in a new mounting range.

A component mounting machine mounts components having a component mark for positioning on an upper face on a circuit board. The component mounting machine has a first suction nozzle that sucks a component, a transfer head that mounts the component on a circuit board, an optical path conversion device disposed above a suction surface and converts the optical path of light from the upper face of the component to the side, a camera that receives light that is changed in an optical path, a camera moving device that moves the camera, and a control device controlling operation of the transfer head and the camera moving device. The camera moving device moves the camera in a first direction orthogonal to an optical axis of the camera, and an imaging region of the camera moves in a second direction when the camera moves in the first direction.

Component mounting machine

An electronic component bonding device includes multiple pressing tools that apply pressure to a die on the bonding section of a circuit board, the multiple pressing tools are supported on a support block via a following mechanism so as to be able to be inclined in any direction around 360 degrees, and a driving mechanism that moves the support blocks vertically is provided. The multiple support blocks are arranged in a width direction of the circuit board, and when the circuit board is conveyed by a conveyor such that the die on the bonding section of the circuit board has reached below one of the multiple support blocks, conveyance of the circuit board is stopped, the support block is lowered by the support block driving mechanism, and the die is bonded to the bonding section of the circuit board using the pressing tool of the support block.

Electronic component bonding device and electronic component mounter

A panel device including a panel for performing at least one of input and output of information related to operation of a work machine, a panel-side support axis fixed to the panel, a connecting arm that is swingably held by the two support axes, a guide rail formed on the work machine side, a bolt that moves along the guide rail, and a regulating arm attached to the bolt and held so as to be oscillatable by the panel-side support axis. When the connecting arm is oscillated, the oscillation of the connecting arm and the angle of the panel is regulated by the regulating arm.

Panel device including a panel and a support mechanism

A cover device which covers an upper part of a mounting work space of a component mounting machine includes: an openable/closable cover including a first cover portion swingable around a first swinging shaft line and a second cover portion attached to a free end of the first cover portion to be swingable around a second swinging shaft line; and a guiding device which stably holds the openable/closable cover in a half-opened state and in an entirely opened state. To hold the half-opened state of the openable/closable cover, a guide rail is provided with a downwardly curved portion at an intermediate portion of the guide rail, and a flip-up type guide provided above the curved portion.

Openable/closeable cover device of a circuit board work machine

A board held by a board holding plate is heated by a heater, and after performing mounting processing of components in a region of the mounting regions of the board, a pressing process of using a pressing head to apply pressure to all the components mounted in the region at once while heating the board is performed, and a next mounting process of mounting components in a next region is performed while performing the pressing process. By performing the pressing process and the mounting process in parallel, waiting time for each process in the cycle of the mounting process and the pressing process is reduced, such that overall work time is reduced.

Component mounter

A substrate working machine that performs mounting work on a circuit substrate is provided. The machine includes a receiving section that receives a first mounting work-correspondence device and a mounting stand on which a second mounting work-correspondence device is detachably mounted. The mounting work-correspondence device includes at least one of a device supplying an item necessary for the mounting work, a device discharging an item unnecessary in the mounting work, and a device performing processing required for the mounting work. The receiving section and the mounting stand are disposed at a predetermined edge portion of a base.

Substrate working machine

A component supply device is arranged adjacent to a mounter which mounts components on a board and supplies components to the mounter. This component supply device includes a replenishment section provided with a magazine which houses a component carrying member on which multiple components are arranged on a base material, and a conveyance section which conveys a component carrying member housed in the magazine and which is equipped with side surface number one to which the replenishment section is attached and side surface number two which is arranged adjacent to the mounter. The replenishment section is slidably attached with respect to side surface number one of the conveyance section.

Component supply device

The component supply device includes a table on which a wafer sheet is carried and a pickup head which picks up a component on the wafer sheet carried on the table. The pickup head includes multiple component supply side suction nozzles, and a switching mechanism which switches the multiple component supply side suction nozzles between a pickup position at which the tip of the multiple component supply side suction nozzles faces down and a transfer position at which the tip of the multiple component supply side suction nozzles faces up. The arrangement of the multiple component supply side suction nozzles corresponds to the arrangement of multiple mounter side suction nozzles equipped on the mounting head of the mounter.

A component supply device which includes a moving slider for moving between a position near a wafer sheet replenishment section and a position near a mounter, a table supported on the moving slider, and a rotating mechanism for rotating the table around a specific rotation axis. The table is supported on the moving slider by a number one support point, a number two support point, and a number three support point which are provided on a circumference with the rotation axis at the center. The rotating mechanism includes a number one guide for moving number one support point in an arc with respect to the rotation axis, and driven guides for moving number two support point and number three support point in an arc with respect to the rotation axis.

A chip supplying apparatus supplies a chip to a mounting machine which mounts the chip on a substrate is disclosed. The chip supplying apparatus includes wafer table which holds a wafer sheet at a position where an operation head of the mounting machine can receive the chip. In the chip supplying apparatus, the wafer table is provided with a frame, a stopper which is fixed to the center of a front portion of the frame and abuts against a front end of the wafer sheet, and a pair of clamp mechanisms which is supported by the frame and which clamps both side ends of the wafer sheet. In the chip supplying apparatus, a position of the pair of clamp mechanisms in a right-and-left direction with respect to the frame can be changed in multiple steps.

Chip supplying apparatus

A method of changing a width of a variable-width substrate conveyor including a feeding device for feeding a circuit substrate along the guide rails, a pair of guide rails having guide surfaces for guiding the circuit substrate being fed by the feeding device, in a longitudinal direction of the guide rails, and a width changing device for moving the guide rails relative to each other toward or away from each other, to change a distance between the guide rails, wherein an image-taking device is operated to take an image of a portion of at least one of the guide rails, and the width changing device is controlled on the basis of the image taken by the image-taking device.

Variable-width substrate conveyor, method of changing width of the same, and method of matching widths of two adjacent substrate conveyors

A printing-agent replenishing device including a replenisher which has a container for accommodating a printing agent and a delivery nozzle disposed at one end of the container and which is operable to delivery the printing agent from the delivery nozzle, for replenishing a printing-agent replenishment object in a screen printer, the device further including a cutting wire for cutting off a mass of the printing agent which extends from a free end of the delivery nozzle, and a cutting-wire holding device which holds the cutting wire such that the cutting wire is held in contact with or in close proximity to the free end face of the delivery nozzle, so as to traverse an opening in the free end face, and such that the cutting wire is rotatable about an axis substantially aligned with an axis of the delivery nozzle.

Growing community of inventors

Kariya, Japan

Toshinori Shimizu