Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Toshinori Mimura

Hiroaki Onishi

Masahiro Taniguchi

Kazumi Ishimoto

Kimihito Kuwabara

Youichi Nakamura

Ken Takahashi

Toshiaki Yamauchi

Hiroshi Yamauchi

Kurayasu Hamasaki

Kenichi Nakano

Naoichi Chikahisa

Toshiyuki Murakami

Hitoshi Nakahira

Kazue Okanoue

Sadayuki Nagashima

Manabu Ando

Osamu Yamazaki

Wataru Hirai

Koichi Nagai

Nobuya Matsumura

Minoru Yamamoto

Muneyoshi Fujiwara

Osamu Hikita

Yoshiyuki Nagai

Shinji Yoshino

Syoji Sato

Noriyuki Inagaki

Jun Shirai

Toru Hattori

A solder drawing member () is detachably attached on the outer side of a jet nozzle () that jets molten solder pumped from a solder tank () storing the molten solder. The solder drawing member () is made of a material having higher wettability to the molten solder than the surface material of the jet nozzle (). Thus a force of separating the solder from a point to be soldered can be increased by a surface tension of the molten solder flowing on the solder drawing member (), thereby reducing bridge phenomena and icicle phenomena.

Soldering apparatus

A viscous material application apparatus includes a main body having a pressurized chamber which connects through to a discharge port and stores a viscous material, a viscous material supply device for transferring the viscous material to the pressurized chamber, and a discharge pressure regulating device for regulating the discharge pressure of the viscous material when the viscous material inside the pressurized chamber is pressurized and discharged by increasing or decreasing the capacity of the pressurized chamber, the discharge pressure regulating device being provided either inside the pressurized chamber or facing the pressurized chamber.

Viscous material application apparatus

A printing screen cleaning apparatus and a method for cleaning a printing screen by employing the cleaning apparatus which includes a cleaning head having a wiping member and a backup member for sucking the paste via a wiping member while sliding the wiping member on a lower surface of the printing screen. The backup member includes a suction port provided in a suction region of a backup surface of the backup member. The backup member also has a groove that extends parallel to the suction region and approximately perpendicular to the sliding direction of the wiping member. The groove partially releases the backup of the wiping member.

Printing screen cleaning method and apparatus

When solder paste passes through a first gap located between a pressurizing member and a printing mask during solder paste printing, a pressure directed toward the printing mask is applied from the pressurizing member to the solder paste.

Solder paste printing apparatus and printing method

By using an application unit having: a storage chamber for a viscous material; a discharge hole, for the viscous material, provided so as to communicate with the storage chamber, where a viscous-material feeding device for feeding the viscous material to the storage chamber is coupled to the application unit; and a discharge-pressure adjusting device for imparting a discharge pressure to the viscous material stored in the storage chamber, a screen mask having openings corresponding to the application object or the application object itself and the discharge hole of the application unit are brought into contact with each other, either the application unit and the screen mask or the application unit and the application object are moved relative to each other while the discharge pressure is imparted to the viscous material in the storage chamber, and the viscous material is applied onto the application object while the storage chamber is replenished at all times with the viscous material by the viscous-material feeding device with a pressure smaller than the discharge pressure imparted by the discharge-pressure adjusting device.

Method and apparatus for applying viscous material

The temperature of a portion that belongs to a stencil and is located in the vicinity of a portion retaining a printing paste is increased to reduce the viscosity of printing paste that adheres to the portion retaining the printing paste, thereby allowing the printing paste to be easily separated from the retaining portion for the achievement of easy printing on an object on which a print is to be formed.

Printing method and printing apparatus

A printing apparatus includes a loading section for guiding wiring boards into the apparatus, a printing section equipped with a mask for printing a conductive material onto each of the wiring boards, a position detecting device for detecting a position of the wiring board held by the holding device, an alignment section for positionally correcting the mask or wiring board held by the holding device on the basis of an output signal from the position detecting device, and a transfer device having holding device for holding the wiring boards and turning to transfer the holding device and stop the holding device at the loading, printing, and alignment sections at the same time so that loading, printing, and alignment operations are simultaneously performed.

Printing apparatus and method

In a printing apparatus and method, printing material is printed on to-be-printed circuit boards in a predetermined pattern and a printing state of the material is inspected. The apparatus includes the following devices. A board supporting device has a rotary body supporting a plurality of board-fixed tables to which the boards are secured, and turns the rotary body together with the board-fixed tables intermittently at predetermined angular intervals so as to stop the board-fixed tables at each of a fixing, recognizing, printing, and inspecting position. A board feed device feeds the boards to the board-fixed tables arranged at the fixing position. A board discharge device discharges the boards from the board-fixed tables arranged at the fixing position. A recognizing device recognizes fixed positions of the boards relative to the board-fixed tables at the recognizing position. A printing device prints the printing material on the boards at the printing position. An inspecting device inspects the printing state of the boards at the inspecting position. The method carries out the board-feeding, position recognizing, printing, printing-state-inspecting, and board-discharging operations by use of the corresponding devices.

Printing apparatus and method for inspecting printed materials

An apparatus for printing a solder paste to a printed circuit board with use of a screen mask plate and a squeegee. The apparatus includes a device for moving one of the printed circuit board and the screen mask plate at a first moving speed in a direction to be separated from the other of them after printing of the solder paste and until the moving one of the printed circuit board and the screen mask plate reaches a plate-separation position which is a position immediately before the screen mask plate and the printed circuit board are completely separated from each other, and a controller for changing the first moving speed to a second moving speed higher than the first moving speed when the moving one of the printed circuit board and the screen mask plate reaches the plate-separation position.

Apparatus for printing solder paste to a printed circuit board and

The present invention provides a reflow apparatus and method effective to make constant the internal gas flow direction in a heating section within a reflow furnace. A circulating gas path is formed in a heating unit which collects and causes the gas to flow from a sirocco fan, up the rear side of the heating unit and then down towards a circuit board moving along a transfer path at the front side of the heating unit. Moreover, a plurality of straightening plates are arranged above the transfer path of the heating unit so as to guide the hot gas, which is flowing forwardly downwardly toward the circuit board moving along the transfer path. A blow-down nozzle is provided and includes a plurality of plates aligned in rows in the transferring direction of the circuit boards. The plates have an inverse U-shaped cross section. The blow-down nozzle is arranged below the straightening plates to cause the vertical hot gas flows to flow uniformly over the whole surface of the circuit board.

Reflow apparatus and method

A method for printing a solder paste to a printed circuit board with use of a screen mask plate and a squeegee, the method includes steps of moving one of the printed circuit board and the screen mask plate at a first moving speed in a direction to be separated from the other of them after printing of the solder paste and until the moving one of the printed circuit board and the screen mask plate reaches a plate-separation position which is a position immediately before the screen mask plate and the printed circuit board are completely separated from each other, and changing the first moving speed to a second moving speed higher than the first moving speed when the moving one of the printed circuit board and the screen mask plate reaches the plate-separation position.

Growing community of inventors

Sakai, Japan

Toshinori Mimura