Fujitsu Corporation

Toshinori Kasuga

Yukio Ozaki

Taizan Kobayashi

Kazuyuki Ikura

Jun Matsueda

Yasuyuki Masuda

Michinao Nomura

Mitsuo Takeuchi

Hirokazu Yamanishi

Masanori Fukushi

Tohru Harada

Hiroaki Tamura

Eiji Takada

Hirofumi Ohsawa

An operation position locating system locates a position on a product where an operation is performed in a manufacturing process of the product including one or more operations to be performed. The system includes an operation completion coordinates detection unit and an operation position locating unit. The operation completion coordinates detection unit processes a plurality of images obtained by capturing from a plurality of viewpoints a range including an operation completion position where an operation is completed when the operation is completed, thereby detecting a set of operation completion coordinates representing the operation completion position. The operation position locating unit obtains a set of operation coordinates representing an operation position where the operation is to be performed on each operation, and locates the operation position corresponding to the operation completion position based on the set of operation completion coordinates and the one or more obtained sets of operation coordinates.

System, operation cell, method, product manufacturing method, and marker for locating operation position

A cleaning apparatus includes: a supply unit to supply at least an initial amount of cleaning solution to a specific portion of an object to be cleaned; an agitator to induce agitation in the cleaning solution supplied to the object; a monitoring unit to monitor an amount of the cleaning solution and to provide a signal indicative thereof; and a control unit to detect a threshold amount of reduction in the cleaning solution based on the signal from the monitoring unit and accordingly to control the supply unit to supply an additional amount of cleaning solution to the specific portion of the object.

Cleaning apparatus and cleaning method

An ultrasonic bonding apparatus includes an ultrasonic bonding unit, and a wiping unit configured to wipe out pre-cured underfill that has adhered to a tool surface of a head, by using a wiping member. The ultrasonic bonding unit includes a first driver configured to drive the head to press an electronic component upon a substrate, and an ultrasonic generator. The wiping unit includes a wiping table used to wipe out the tool surface, a feed mechanism configured to supply a wiping member to the wiping table and to roll up the wiping member, a cartridge configured to house the wiping table and the feed mechanism, and a second driver configured to drive the cartridge in the plane. The first driver is configured to press the head upon the wiping member on the wiping table.

Ultrasonic bonding apparatus

An ultrasonic bonding apparatus for manufacturing an electronic device that includes a substrate, an electronic component, and an underfill filled between the electronic component and the substrate includes a head that includes a tool surface configured to mount the electronic component, a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with the substrate and to press the head against the wiping member on the wiping table, a detector configured to detect a first pressure applied between the wiping member on the wiping table and the tool surface when the wiping unit provides wiping, and a controller configured to control a second pressure applied by the ultrasonic bonding unit, based on a detection result by the detector.

An ultrasonic bonding apparatus includes a head that includes a tool surface configured to mount an electronic component, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with a substrate, and a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table. The wiping unit includes a solvent supply unit configured to supply a solvent configured to powder the underfill, to the wiping member on the wiping table, a sealed cartridge configured to house the wiping table and a feed mechanism configured to supply the wiping member to the wiping table and to roll up the wiping member from the wiping table, and a cartridge support member that includes a motor configured to drive the feed mechanism, and is detachably attached to the cartridge.

A resonatorof the present invention includes: a vibrating memberholding an electronic componentand applying a vibration to the electronic component; and a depressing memberapplying a depressing force for a side of a substrateto the electronic componentthrough the vibrating member. The depressing memberincludes: leg portionswhich are disposed so as to leave spaces between the leg portions and both side facesof the vibrating memberparallel with a vibration direction A; and supporting portionsthrough which the leg portionsand the side facesof the vibrating memberare to be coupled to each other. With respect to a size of a cross section of each of the supporting portionsparallel with the side faceof the vibrating member, a length Lalong the vibration direction A of the vibrating memberis shorter than a length Lalong a depressing direction B of the depressing member

Resonator, ultrasonic die bonding head, and ultrasonic die bonding apparatus

A vibration extraction processing unit extracts a deflection component synchronous with a rotation from a clock signal of a non-contact sensor so as to correct a clock jitter. A clock generating unit generates a clock signal of any format frequency preliminarily set up according to the clock signal from the vibration extraction processing unit. A sector correction processing unit measures an error due to the frequency deflection so as to correct the writing start position for the format pattern signal of each sector containing a servo frame signal stored in a memory according to the measured error. Writing processing units read out the corrected format pattern signal from the memory according to a synchronous signal corresponding to a single turn of a disc and a format frequency clock signal and then writes into a disc medium face.

Servo track writing device and method thereof

An oscillating apparatus includes a driver generating a waveform signal based on a stored data for specifying a waveform so as to output the waveform signal to a transducer. A detector detects a phase difference between electric voltage and current supplied to the transducer. A memory unit holds gain data reflecting a characteristic of the transducer. The gain data specify gains corresponding to respective phase differences. An arithmetic unit calculates the frequency of the waveform based on the phase difference detected at the detector and a gain included in the gain data. The oscillating apparatus enables determination of a gain suitable to the transducer in view of the characteristic of the transducer. The frequency of the waveform signal is allowed to follow the change in the resonant frequency in a shorter period. The oscillation can thus be kept well.

Growing community of inventors

Kawasaki, Japan

Toshinori Kasuga