Ube Industries, Inc.

Other

Toshinori Hosoma

Tomohiko Yamamoto

Katsumi Kato

Hiroshi Inoue

Shigeru Yamamoto

Kazuhiko Yoshioka

Takuhiro Ishii

Takashi Kohno

Osamu Nakayama

Shuichi Hashiguchi

Akinori Otani

Shouzou Katsuki

Kazuhiko Yosioka

A polyimide film favorably employable in a method of producing a through-hole in an aromatic-polyimide film having on its surface a laminated or deposited metal film by applying laser beam onto the polyimide film, preferably is composed of a high Tg aromatic polyimide layer which has a Tg of 300&deg; C. or higher or has no noticeable Tg and is produced from a biphenyltetracarboxylic acid compound and an aromatic diamine compound and a low Tg aromatic polyimide layer which has a Tg of lower than 375&deg; C. but higher than 200&deg; C., provided that the Tg of the low Tg polyimide layer is lower than the Tg of the high Tg polyimide layer and the metal film is laminated or deposited on the surface of the low Tg polyimide layer on the side not facing the high Tg polyimide layer.

Method of producing through-hole in aromatic polyimide film

A roll of a web composed of an aromatic polyimide composite film and a metal film in which the polyimide composite film is composed of a non-thermoplastic aromatic polyimide base film and a thermoplastic aromatic polyimide cover film, the polyimide composite film showing a heat shrinkage ratio of less than 0.1% at 300&deg; C., can be produced by heating a corresponding roll of web composed of a metal film and an aromatic polyimide composite film having a heat shrinkage ratio of more than 0.1% at 300&deg; C., at a temperature between 150&deg; C. and a glass transition temperature of the thermoplastic aromatic polyimide cover film, for a period of at least one minute.

Roll of metal film/aromatic polyimide film composite web

A three-dimensional wiring board comprises a metal base having a roughed surface, a heat-bonding type of polyimide film without using adhesive, bonded to the roughed surface and serving as an electric insulating layer, and a copper foil for a conductive layer, bonded to the other surface of the polyimide film. A method for manufacturing the wiring board comprises a roughing treatment process for plating or oxidizing the surface of a metal base, thereby forming a roughed surface, a contact bonding process for attaching a polyimide film to the roughed surface and a copper foil by thermocompression bonding, thereby forming a laminate material, a patterning process for etching the copper foil into a desired conductive pattern, and a bending process for bending the laminate material into a desired three-dimensional shape by press working.

Three-dimensional wiring board and electric insulating member for wiring board

An aromatic polyimide laminate composed of an aromatic polyimide composite film, a metal film, and a release film is disclosed. The aromatic polyimide composite film is composed of an aromatic polyimide substrate film and two thermoplastic aromatic polyimide layers. Each thermoplastic layer is fixed to each surface of the substrate film. The substrate film has no glass transition temperature of lower than 350&deg; C., and the thermoplastic aromatic polyimide layer has a glass transition temperature of 190-280&deg; C. The metal film is fixed, with no intervening adhesive layer, to one thermoplastic aromatic polyimide layer at a 90&deg; peel strength of 0.8 kg/cm or more and the release film is fixed, with no intervening adhesive layer, to another thermoplastic aromatic polyimide layer at a 90&deg; peel strength of 0.001-0.5 kg/cm, under such condition that the latter peel strength is one half or less of the former peel strength.

Aromatic polyimide laminate

A flexible aromatic polyimide film/metal film composite sheet is composed of a multi-layered polyimide film having a highly heat-resistant aromatic polyimide layer to one surface of which is bonded another aromatic polyimide layer (in which the multi-layer polyimide film is prepared by simultaneous casting), and a metal film which is bonded to the latter polyimide layer by heating under pressure and subsequent cooling under pressure using a double belt press.

Flexible aromatic polymide film/metal film composite sheet

A bonded wafer in which silicon wafers and an amorphous heat fusion bonding polyimide are used, a process for producing the same, and a substrate which is prepared by variously processing the bonded wafer.

Bonded wafer, process for producing same and substrate

An aromatic polyimide film in the form of a continuous tape having a thickness of 50 to 125 .mu.m favorably employed for manufacture of electric circuit is composed of a biphenyltetracarboxylic acid recurring unit and a p-phenylenediamine recurring unit. The polyimide film has the following characteristics: a tensile strength of not lower than 30 kg/mm.sup.2 ; a tensile modules of not lower than 500 kg/mm.sup.2 ; a linear expansion coefficient of not higher than 2.5.times.10.sup.-5 cm/cm/.degree.C.; a heat shrinkage ratio of not higher than 0.05%; a low curling having a maximum curling of not higher than 3 mm for a disk of diameter of 86 mm; and a uniform thickness having a maximum rate of inclination of not more than 3 .mu.m per 10 mm.

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Yamaguchi, Japan

Toshinori Hosoma