Mitsubishi Denki Kabushiki Kaisha

Toshinobu Banjo

Shigeo Onoda

Yasuhiro Murasawa

Tetsuya Ueda

Makoto Omori

Yasushi Kasatani

Minoru Tanaka

Ryuichiro Mori

Kouji Shika

Hiroshi Seki

Akira Yamamoto

Haruo Shimamoto

Masaharu Yoshida

Hideji Aoki

Hideya Yagoura

Yoshinobu Kawata

Yasuhiro Teraoka

Shunichi Uemura

Katsuyuki Fukudome

Osamu Nakagawa

Ikuo Sasaki

Syuichi Osaka

Shigeyuki Nango

Koji Yanagitani

A treatment utilizing chemical vapor deposition is conducted on a major treatment surface (14) of a semiconductor substrate (8) under the condition where the semiconductor substrate (8) is held on a bottom surface of a stage (10) by suction force which is caused by reducing pressure in a vacuum pocket (13). In such a treatment, inert gas supplied by an inert gas feeder (24) is fed through a fluid duct (43) and inert gas feed holes (52) to an inert gas jetting gap (32) which is a space between an outermost circular surface (31) of an outer portion of a substrate holding surface (11) and a reverse major surface (12) of the semiconductor substrate (8). The inert gas is jetted out of the inert gas jetting gap (32) to a reaction chamber (6). Jets of the inert gas prevents undesirable objects or reaction byproduct (34) from easily penetrating in an inner region of the substrate holding surface (11). Thus, deposition of the reaction byproduct is prevented, and reduction of strength of holding the semiconductor substrate by suction force is avoided. As a result, operating efficiency of a semiconductor manufacturing apparatus and the yield are enhanced.

Apparatus for manufacturing semiconductor and method of manufacturing

A reference pin (150) is provided on a bottom die (108) of a molding device (100). A lead frame (3) is carried with a chucking device (120) attached to an X-Y table mechanism (110). A hole (132) is formed in a stage (131) of the X-Y table mechanism. Respective images of the hole and the pin are detected by a TV camera (142) to control the relative position of the bottom die and the lead frame by driving the X-Y stage.

Method of positioning lead frame on molding die to seal semiconductor

A die bonding apparatus includes a Z-axis direction drive mechanism having a main drive motor, a bonding arm having a first arm and a second arm, a holding device provided on one end of the second arm for releasably holding a die, a torque generating device for applying a torque to the second arm, a parallel position detecting device for detecting a displacement of the second arm from a state in which the die and the bonding surface are parallel to each other and for generating a displacement signal, and a control device for storing an inclination of the bonding surface beforehand and for controlling the descent of the second arm and the application of a load to the die.

Die bonding apparatus and method of controlling the same

A thin-web frame feeding device for intermittently feeding a thin-web frame at a predetermined pitch along a guide rail has first and second shafts supported by bearing stands for synchronized axial sliding motion in the same direction and for rotation in opposite directions. The first and second shafts are provided with feeding claws rotatable in accordance with the rotation of the shafts into and out of positions where spontaneous portions of the thin-web frame are clamped. The feeding claws are axially moved in accordance with the axial sliding movement of the shafts to feed the thin-web frame.

Device for feeding thin-web frame

Molding device for sealing semiconductor element with resin

A packaged semiconductor device includes a resin package having a rectangular shape, a semiconductor device contained in the resin package and having a plurality of terminals oriented along the shorter sides of the resin package, a plurality of leads located in the vicinity of the terminals of the semiconductor device and extending outwardly from the shorter sides of the resin package generally parallel to the longer sides, and a plurality of lead wires respectively connecting each of the plurality of terminals of the semiconductor device to one of the plurality of leads.

Packaged semiconductor device

An IC card has a shutter reciprocatively mounted on a frame in order to protect a plurality of external-element connection terminals which are mounted on the frame. Guide grooves formed in the frame include those which receive corresponding projections formed on spring-mounting portions of the shutter to keep the projections in engagement therewith, thereby enabling both the base portion and the spring-mounting portion of the shutter to be guided. End portions at one end of those guide grooves determine a position of the shutter such that the shutter is prevented from overshooting the frame. Thus, the IC card is capable of ensuring stable opening and closing action of the shutter.

IC card

A connector provided in an external device for an IC card having a card shutter provided with slide members, the shutter being capable of advancing and retreating and adapted to cover and protect external terminals of the IC card when the card is not used. This connector is provided with electroconductive pins adapted to move the shutter in the direction opposite to that of the insertion of the IC card so as to open the shutter of the IC card by contacting the slide member of the card shutter when the IC card is inserted into the connector, and an earth line for grounding the pin.

Connector in external device for connection to IC card

A memory card having: a card-like package; a semiconductor module disposed within the package; a plurality of electrode terminals mounted on the package for external electrical connection of the semiconductor module in the package to an external circuit; a metallic shutter disposed on the package and movable between an open position in which the electrode terminals are exposed for the electrical connection and a closed position in which the electrode terminals are covered; and an insulating layer formed on a surface of the shutter which faces the electrodes.

Memory card

A metal mold for plastic molding a semiconductor device by a transfer-molding method with the use of thermo-hardening plastics. The mold includes a pot section into which plastic is injected; a cavity section where a product is formed; a runner section constituting a path for the plastic from the pot section to the cavity section; a gate section provided between the runner section and the cavity section so as to reduce the cross-sectional area for the flow of the plastic which flows therethrough from the runner section to the cavity section; a flow restriction section provided in the path of the runner section so as to reduce the cross-sectional area of the flow of plastic.

Method of molding a semiconductor device

An IC card having a circuit board provided with wiring formed on at least one of two surfaces of the circuit board, a terminal base fixed to one surface of a front portion of the circuit board and having a multiplicity of electrode terminals disposed on its upper surface, a plurality of electronic parts mounted on the two surfaces of the circuit board, and a package in which the circuit board on which the electronic parts are mounted is incorporated while exposing the electrode terminals to the outside of the package.

Memory card for a computer system

A memory card comprises a plastic outer package which houses a semiconductor device and an electrical connector. The outer package comprises a plurality of package sections which are stacked atop one another and bonded together along connecting surfaces formed on the outer peripheries of the package sections. At least one of the connecting surface of each pair of adjoining package sections has an overflow groove for bonding agent formed therein which prevents the bonding agent from being forced to the outside of the outer package when the package sections are bonded together.

Memory card housing

A die bonding apparatus includes a stocker for temporarily accommodating dice, a first conveying device for successively picking up a plurality of dice from one wafer and conveying them to the stocker, a wafer loader/unloader for replacing the wafer from which the dice have been picked up with a new one, a bonding station for bonding a die to a work which serves as a die mounting medium, a work loader for supplying works to the bonding station, and a second conveying device for successively conveying the dice accommodated in the stocker to the bonding station.

Die bonding apparatus

A battery holder mechanism comprises lower supporting portions for receiving the peripheral edge of a battery holder body from below and upper supporting portions for receiving the same from above when the battery holder body is inserted into a battery inserting opening of a package of an electronic appliance, such as an IC card. The upper and lower supporting portions are provided alternatingly inside an inserting hole of a package.

Growing community of inventors

Itami, Japan

Toshinobu Banjo