Seiko Epson Corporation

Toshinao Shinbo

Koji Sumi

Yoshinao Miyata

Noriaki Okazawa

Shiro Yazaki

Masami Murai

Akihisa Wanibe

Hitoshi Takaai

Akira Kuriki

Hironobu Kazama

Masanori Mikoshiba

Maki Ito

Tetsuya Akasu

Hisashi Akachi

Tsutomu Nishiwaki

Kazushige Hakeda

Xin-Shan Li

Li Xin-Shan

A liquid ejecting head including a diaphragm constituting a portion of a wall surface of a pressure chamber that accommodates a liquid, and a piezoelectric element that vibrates the diaphragm. In the liquid ejecting head, the diaphragm includes a plurality of layers, and the plurality of layers include a compressive film that has compressive stress and a tensile film that has tensile stress. The compressive film and the tensile film are two layers adjacent to each other that have a largest tension difference among the plurality of layers, and an absolute value of the tension difference between the compressive film and the tensile film is 400 [N/m] or smaller.

Liquid ejecting head and liquid ejecting apparatus

A liquid ejecting head including a diaphragm constituting a portion of a wall surface of a pressure chamber that accommodates a liquid, and a piezoelectric element that vibrates the diaphragm. In the liquid ejecting head, the diaphragm includes a plurality of layers, and d/D&#x2264;0.25 is satisfied where D is a thickness of the diaphragm and d is a distance between a neutral axis of the diaphragm and an interface between two adjacent layers in which a tension difference is the largest in the plurality of layers.

A method of manufacturing a dielectric film includes a coating step of coating sol made of an organic metal compound and forming a dielectric precursor film, a drying step of drying the dielectric precursor film, a degreasing step of degreasing the dielectric precursor film, and a baking step of baking the dielectric precursor film to form a dielectric film. The drying step includes a first drying step of drying the dielectric precursor film by heating the dielectric precursor film to a temperature lower than a boiling point of a solvent which is a main solvent of the sol and then holding the dielectric precursor film at the temperature for a predetermined period of time, and a second drying step of drying the dielectric precursor film further by reheating the dielectric precursor film and then holding the dielectric precursor film at the temperature for a predetermined period of time.

Method of manufacturing dielectric layer and method of manufacturing liquid jet head

A method of manufacturing a piezoelectric element includes a piezoelectric layer forming step of sequentially and repeatedly performing a heat treatment step of applying a piezoelectric material containing lead to a lower electrode film at a relative humidity in the range of 30% to 50% Rh and then performing a heat treatment to form a piezoelectric precursor film and a crystallization step of firing the piezoelectric precursor film to form a piezoelectric film on the lower electrode film, thereby forming a piezoelectric layer.

Method of manufacturing liquid jet head, method of manufacturing piezoelectric element and liquid jet apparatus

A method of manufacturing an actuator device configured to prevent separation of a vibration plate and to enhance durability and reliability, and a liquid-jet apparatus are provided. The method includes the steps of forming a vibration plate on one surface of a substrate, and forming a piezoelectric element having a lower electrode, a piezoelectric layer, and an upper electrode on the vibration plate. The step of forming a vibration plate at least includes an insulation film forming step of forming an insulation film made of zirconium oxide by forming a zirconium layer on the one surface side of the substrate in accordance with a sputtering method and subjecting the zirconium layer to thermal oxidation by inserting the substrate formed with the zirconium layer to a thermal oxidation furnace heated to a temperature greater than or equal to 700&#xb0; C. at a speed greater than or equal to 200 mm/min.

Method of manufacturing actuator device for ink jet head

A step of forming a vibration plate includes a step of forming an insulation film in order to cause the surface roughness Ra of the insulation film to be in the range of 1 nm to 3 nm: the insulation film being made of zirconia which has been obtained by depositing a zirconium layer, and accordingly by the thermally oxidizing the zirconium layer at a predetermined temperature, and the insulation film constituting the uppermost surface of the vibration plate. In addition, a step of forming a piezoelectric elements includes: a step of applying titanium (Ti) onto a lower electrode by use of a sputtering method, and of forming a seed titanium layer thereon; and a step of forming a piezoelectric precursor film by applying a piezoelectric material onto the seed titanium layer, and of forming a piezoelectric layer by baking, and crystallizing, the piezoelectric precursor layer.

Method of manufacturing an actuator device

In order to provide a silicon wafer break pattern that stabilizes the location and shape of the breaks at weak spots of the break pattern and that reduces waste, the through-holes of the break pattern is disposed along a scribe line, a first group of the through-holes are substantially disposed on only a first side of the scribe line, and a second group of the through-holes are substantially disposed on only a second side of the scribe line.

Growing community of inventors

Nagano-ken, Japan

Toshinao Shinbo