Konishi Co., Ltd.

Toshinao Okitsu

Shigeru Nagasawa

Shinichi Sato

Yoshihiko Yotsuyanagi

Naganori Araki

Tomio Uchida

Disclosed is a heat-resistant resin composition prepared by mixing a resin composition (A) and polyamine (B), followed by heating the mixture for the hardening, said composition (A) being prepared by heating a mixture of (a) polymaleimide resin represented by a general formula: ##STR1## where R.sub.1 is an organic group having a valency of n, Xa and Xb are the same or different monovalent atoms or groups selected from the group consisting of hydrogen atom, halogen atom and organic group, and n is an integer of 1 to 4, (b) an epoxy resin having at least two epoxy groups in the molecule, and (c) a compound having one alcoholic or phenolic OH group and at least one epoxy group in the molecule.

Epoxy resin, maleimide and OH- and epoxy-containing compound

The invention provides an adhesive composition of the two-part separate application type comprising solutions A and B. The solution A is an aqueous solution of a high polymer having an amide bond or an imide bond within the molecule, or an aqueous dispersion obtained by adding a rubber latex and/or synthetic resin emulsion to the aqueous solution of the high polymer. The solution B is an aqueous solution of a dialdehyde compound, or an aqueous solution or dispersion obtained by adding a crosslinking agent for crosslinking the high polymer of the solution A to the aqueous solution of the dialdehyde compound.

Fast setting adhesive composition

An adhesive composition which is in a wax-like or jelly-like state at room temperature comprising:

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Tokyo, Japan

Toshinao Okitsu