Kabushiki Kaisha Nihon Micronics

Toshinaga Takeya

Michitaka Okuta

Hisao Narita

Yuki Saito

Shou Harako

Jukiya Fukushi

Yasutaka Kishi

Takayuki Hayashizaki

Tomokazu Saito

Minoru Sato

Tomoya Sato

Shoji Kamata

Electric contact

A measurement system includes a drive device configured to drive the plurality of optical semiconductor elements, a probe unit including a plurality of optical connection devices configured to receive respective emitted lights from the plurality of optical semiconductor elements and a processing device including a plurality of photoelectric converters. Each of the optical connection devices is connected to each of the photoelectric converter, and at least some of the emitted lights received by the optical connection devices are input to the photoelectric converter. The photoelectric converter converts the input emitted lights into electric signals.

Measurement system

A measurement method of receiving an emission light output from an optical semiconductor element on an incident end surface of an optical probe, shifts a relative position between the optical semiconductor element and the optical probe on a plane surface intersecting with an optical axis of the emission light, measures an incident intensity of the emission light at several positions, and obtains an incident intensity pattern showing a relationship between a change in the relative position and the respective incident intensities.

Measurement system and measurement method

An optical probe receives an optical signal output from a test subject. The optical probe includes an optical waveguide composed of a core portion and a cladding portion disposed on an outer periphery of the core portion, wherein an incident surface of the optical waveguide, which receives the optical signal, is a convex spherical surface with a constant curvature radius.

Optical probe, optical probe array, test system and test method

A method for manufacturing a probe card prepares a plurality of probes, each having a metal layer on an attaching portion, and hot-melt material covering the metal layer. Each probe is attached to a probe substrate by inserting its attaching portion into a different through hole of the probe substrate so that at least a part of the metal layer is located in the through hole. The hot-melt material of each attaching portion is melted and thereafter solidified such that the hot-melt material contacts the metal layer and a part of a wall surface of the through hole, to fix each probe to the probe substrate.

Method for manufacturing probe card

A method for manufacturing a probe card includes inserting an attaching portion of each probe into one of first through holes provided on a probe substrate at least in a row, inserting a probe tip portion of each probe into second through holes respectively provided on a plurality of plate-like positioning members piled in their thickness directions at least in a row, relatively displacing the adjacent positioning members in opposite directions to two-dimensionally position the probe tip portions of the probes, and thereafter softening a conductive jointing material to position the attaching portions of the respective probes against the first through holes.

A contact for an electrical test comprises a first area to be bonded to a board, a second area extending in the right-left direction from the lower end portion of the first area, a third area projecting downward from the tip end portion of the second area, and a low light reflective film having lower light reflectance than that of the first area. The third area has a probe tip to be contacted an electrode of an electronic device. The low light reflective film is formed on a surface of at least the bonding part of the first area to the board and its proximity.

Growing community of inventors

Aomori, Japan

Toshinaga Takeya