Hamamatsu-photonics K.k.

Toshimitsu Wakuda

Naoki Uchiyama

Kenshi Fukumitsu

Fumitsugu Fukuyo

Kazuhiro Atsumi

Kenichi Muramatsu

Satoshi Matsumoto

Tatsuya Suzuki

Tetsuya Osajima

Norio Kurita

Masayoshi Kusunoki

Fumitsugu Fukoyo

A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein at pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

Laser processing method and laser processing apparatus

A part of a glass layerdisposed along a region to be fused R is irradiated with a laser beam L, so as to form the glass layerwith a laser-absorbing parthaving a high laser absorptance. Then, while using the laser-absorbing partas an irradiation initiation position, the region to be fused R is irradiated therealong with a laser beam L, so as to melt the glass layerand fix the glass layeronto a glass member. Since the irradiation initiation position for the laser beam Lhas already become the laser-absorbing part, a stable region where the melting of the glass layeris stable can be formed immediately from the start point for initiating the irradiation with the second laser beam or nearby. The glass memberis fused to a glass memberthrough the glass layerhaving such a stable region formed throughout the region to be fused R, so as to yield a glass fusing structure

Fusion bonding process for glass

A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

A glass layer fixing method for manufacturing a glass layer fixing member by fixing a glass layer to a first glass member, includes the steps of disposing the glass layer on the first glass member along a region to be fused, the glass layer containing a glass powder and a laser-absorbing material and irradiating the region to be fused therealong with a first laser beam, so as to melt the glass layer, fix the glass layer to the first glass member, and increase a laser absorptance of the glass layer.

Glass fusion method

Method of cutting a wafer-like object and semiconductor chip

A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cutting line on the surface of the work to cause multiple photon absorption and with a condensed point located inside of the work, and a modified area is formed inside the work along the predetermined determined cutting line by moving the condensed point along the predetermined cut line, whereby the work is cut with a small force by cracking the work along the predetermined cutting line starting from the modified area and, because the pulse laser beam is hardly absorbed onto the surface.

Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device

Method of manufacturing a semiconductor device formed using a substrate cutting method

Method of cutting a substrate and method of manufacturing a semiconductor device

Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device

A laser processing method comprising a step of irradiating an object to be processed with laser light elliptically polarized with an ellipticity of other than 1 such that a light-converging point of the laser light is located within the object along the major axis of an ellipse indicative of the elliptical polarization of laser light, along a line which the object is intended to be cut, to form a modified region caused by multiphoton absorption within the object, along the line which the object is intended to be cut.

A laser processing method which can accurately cut an object to be processed along a line to cut is provided. A modified regionformed by multiphoton absorption forms a cutting start regionwithin an object to be processedalong a line to cut. Thereafter, the objectis irradiated with laser light Labsorbable by the objectalong the line to cut, so as to generate fracturesfrom the cutting start regionacting as a start point, whereby the objectcan accurately be cut along the line to cut. Expanding an expandable filmhaving the objectsecured thereto separates individual chipsfrom each other, which can further improve the reliability in cutting the objectalong the line to cut

Laser beam machining method

After a glass layeris disposed between a glass memberand a thermal conductoralong a region to be fused, a laser beam Lis emitted while the thermal conductoris used as a heat sink, so as to melt the glass layer, thereby burning and fixing the glass layeronto the glass member. While the glass layerdrastically increases its laser absorptance at the time of burning, the thermal conductorserves as the heatsink and draws heat from the glass layer, thereby inhibiting the glass layerfrom falling into an excessive heat input state. Thereafter, another glass member is overlaid on the glass memberhaving the glass layerburned thereonto, such that the glass layeris interposed therebetween. Then, the region to be fused is irradiated therealong with a laser beam, so as to fuse the glass members together.

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Hamamatsu, Japan

Toshimitsu Wakuda