The Furukawa Electric Co., Ltd.

Toshimitsu Nishiwaki

Nobuyuki Shibata

Kenji Suzuki

Shigeo Yamaguchi

Isamu Kinoshita

Masaaki Arahori

Toshio Yamamoto

Hiroshi Ikeda

Kouki Sato

Toshiya Hikami

Mizuki Oike

Takuma Aoki

A diaphragm for a planar speaker and a planar speaker having a long-term stability and a high reliability and exhibiting a flat sound pressure frequency property. The diaphragm for a planar speaker includes a voice coil formed by winding a wire conductor, two adhesive layers sandwiching the voice coil therebetween, and bases bonded to the two adhesive layers on the side opposite to the voice coil. The planar speaker employs the diaphragm.

Diaphragm for planar speaker and planar speaker

A wiring system is provided. Using the system, a wire conductor is stuck on a surface of a substrate by causing a three-dimensional relative movement between a wiring head for guiding the wire conductor and the substrate such that the wiring head relatively moves along an adhesive layer on the surface of the substrate and the wiring head and the adhesive layer intermittently come close to each other for point contact.

System for forming conductor wire on a substrate board

An optical attenuator ( ) has a substrate (glass substrate) ( ) and an optical attenuation film ( ) that attenuates an input light with a predetermined optical attenuation factor, and the optical attenuation film ( ) is disposed on a light input face ( ) of the substrate ( ). An angle defined by the light input face ( ) and the light output face ( ) of the substrate ( ) is set to 0.15&deg; to 0.5&deg;. A protective film ( ) for preventing the deterioration of the optical attenuation film ( ) is formed on a surface of the optical attenuation film ( ).

Optical attenuator and optical attenuator module

A wiring method is provided, in which a wire conductor is stuck on a surface of a substrate by causing a three-dimensional relative movement between a wiring head for guiding the wire conductor and the substrate such that the wiring head relatively moves along an adhesive layer on the surface of the substrate and the wiring head and the adhesive layer intermittently come close to each other for point contact.

Wiring method for forming conductor wire on a substrate board

An apparatus for assembling and inspecting optical fibers and a connector which attaches the connector to at least one cord end of a plurality of optical fibers and inspects connection loss etc. due to connection of the connector. A process of connecting the connector to the cord ends where the connector is assembled which is linked to a process of processing the other cord ends and then inspecting connection loss etc. of the optical fibers due to a connection of the connector.

Apparatus for assembly and inspection of optical fiber connectors

Disclosed a method of assembly and inspection of optical fiber connectors which attaches connectors to at least one cord end of a plurality of optical fiber cords in which single or multiple optical fibers are accommodated and inspects connection loss etc. due to connection of the connectors. A process of connecting the connectors to cord ends where the connectors are assembled is linked to a process of processing the other cord ends and then inspecting connection loss etc. of the optical fibers due to a connection of the connectors.

Growing community of inventors

Tokyo, Japan

Toshimitsu Nishiwaki