The Furukawa Electric Co., Ltd.

Toshimitsu Nakamura

Tetsuya Mieda

Naoaki Mihara

Kunihiko Ishiguro

Keiji Saito

Masami Aoyama

Takumi Asanuma

Toshihiro Suzuki

Satoshi Hattori

Hideto Fukuda

Takanori Yamakawa

Provided are a resin composition for element encapsulation for organic electronic devices which is transparent, has excellent flexibility, water vapor barrier properties, and adhesive force, and can suppress the generation of dark spots, a resin sheet for element encapsulation for organic electronic devices, an organic electroluminescent element, and an image display device. This adhesive resin composition for element encapsulation for organic electronic devices is used to seal an element for organic electronic devices, and is characterized by containing a diene polymer and a softening agent, in which the content of the softening agent is from 5% by mass to 30% by mass of the total mass.

Resin composition for element encapsulation for organic electronic devices, resin sheet for element encapsulation for organic electronic devices, organic electroluminescent element, and image display device

A resin composition for sealing an organic electroluminescent element, containing: at least one epoxy compound; at least one polyester resin; and at least one Lewis acid compound or at least one compound which generates a Lewis acid, in which the content of the epoxy compound is from 10 to 200 parts by mass with respect to 100 parts by mass of the polyester resin.

Resin composition for sealing organic electroluminescent element, sealing film for organic electroluminescent element, gas-barrier film for organic electroluminescent element, and organic electroluminescent element using these films

A transparent resin composition for sealing an organic EL element and other things having a sufficient effect of blocking moisture and excellent flexibility is provided. As essential components, a thermoplastic resin, tackifying resin and organometallic compound represented by the following chemical formula are included, having a light transmittance of 85% or more, and having a relationship of AM/Y&#x3c;162, 

Transparent resin composition for sealing organic electroluminescence element, resin sheet for sealing organic electroluminescence element, and apparatus for displaying image

A resin composition for sealing an organic electroluminescent device, containing:

Resin composition for sealing organic electroluminescent device; method of producing the same; and adhesive film, gas-barrier film, organic electroluminescent device and organic electroluminescent panel using the resin composition

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Tokyo, Japan

Toshimitsu Nakamura