Sanyo Electric Co., Ltd.

Toshimichi Naruse

Noriaki Sakamoto

Hajime Kobayashi

Hiroyuki Watanabe

Ryosuke Usui

Hisashi Shimizu

Toshikazu Imaoka

Hidefumi Saito

Yoshihiro Kogure

Nobuhisa Takakusaki

Atsushi Kato

Takeshi Yamaguchi

Takayuki Hasegawa

A semiconductor pellet and chip components are provided on an insulating substrate, and are sealed with a molding resin that is molded by transfer molding. The chip components are positioned so as to surround the semiconductor pellet on all four sides. The lengthwise directions of the chip components surrounding the semiconductor pellet are aligned in a uniform direction. The insulating substrate is set within a die molding apparatus so that during resin injection, the lengthwise directions of the chip components are aligned substantially perpendicularly to the direction of flow of the injected resin.

Resin-sealed semiconductor device and method of manufacturing the same

A circuit device is provided in which the bonding reliability of a brazing material such as soft solder is improved. A circuit device of the present invention includes conductive patterns, a bonding material which fixes circuit elements to the conductive patterns, and sealing resin which covers the circuit elements. The circuit device has a structure in which Pb-free solder containing Bi is used as the bonding material. Since the melting temperature of Bi is high in comparison with that of a general solder, the melting of the bonding material is suppressed when the circuit device is mounted. Further, Ag or the like may be mixed into the bonding material in order to enhance the wettability of the bonding material.

Bonding material and circuit device using the same

In order to prevent short-circuiting when a chip component is brazed to pads of a conductive wiring layer, a hybrid semiconductor circuit includes the chip component with terminal electrodes formed at both ends, a first conductive wiring layer on which the pads are provided such that they correspond to the terminal electrodes, and an overcoat resin that covers the first conductive wiring layer excluding the pads. The terminal electrodes of the chip component are adhered to the pads by a conductive adhesive and an insulating adhesive is provided between the pads.

Hybrid integrated circuit device with high melting point brazing material

A hybrid integrated circuit device comprising: a substrate having an insulated surface and superior thermal conductivity; conductor patterns provided on the substrate; an element mounted on the surface so as to connect with the conductor patterns through electrically connecting means; an outer read which is electrically connected to the conductor patterns and is extended to the outside; and a sealing member of thermoplastic resin so as to be molded and cover at least the surface of the substrate.

Hybrid integrated circuit device, and method of manufacturing thereof

An electronic circuit apparatus has first and second pad electrodes arranged on a substrate to be separated by a first interval, first and second chip electrodes to be separated by a second interval smaller than the first interval, a first solder for fixedly attaching the first chip electrode to the first pad electrode and a second solder for fixedly attaching the second chip electrode to the second pad electrode. Because the first interval is longer than the second interval, any constricted portion does not exist in each of the first and second solders. Therefore, because any stress is not concentrated on any portion of each of the first and second solders, the occurrence of a crack in each of the first and second solders can be prevented.

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Gunma, Japan

Toshimichi Naruse