Nec Compound Semiconductor Devices, Ltd.

Nec Corporation

Toshimichi Kurihara

Takashi Ueda

Shigeki Tsubaki

Tetsu Toda

Takahiro Kawabata

The lower end of a resin wall is bonded to a radiating plate, and a lead is fixed so as to extend through the resin wall. After a semiconductor chip is bonded thereto, a resin lid is put to seal the semiconductor chip. Recessed parts for burying the lower end of the resin wall are formed on the side parts of the radiating plate, and protruding parts are further provided within the recessed parts. The lead has holes formed on the package outer part and the resin wall inner part. The loading surface of the semiconductor chip is finished with silver plating, and the package exterior and the lead are plated with gold. The shape fitted to the resin wall is imparted to the resin lid, and the resin lid is further formed into a vertically plane symmetric shape.

Semiconductor device in a resin sealed package with a radiating plate and manufacturing method thereof

An electronic product comprises a heat radiating plate, an electronic component securely mounted on the heat radiating plate and including a high power transistor, an enveloper including a frame member securely associated with the heat radiating plate to encompass the electronic component, and a lid member securely attached to an upper opening end of the frame member, thereby accommodating and sealing the electronic component in the enveloper, and at least one electrically conductive element passing and extending through the frame member. The frame member is made of a suitable resin material, and the lid member is made of one material selected from the group consisting of a ceramic material, a metal material, and a composite material.

Electronic product with heat radiating plate

A lid-member holder is used to define envelopers encapsulating electronic components in production of hollow-package type electronic products. A plurality of lid members are temporarily held by the holder body. The lid members are arranged so as to be consistent with an arrangement of surrounding wall members, which are to be sealed with the lid members in a lump to define the envelopers, and the temporary holding of the lid members by the holder body is realized such that lid members can be separated from the lid members after the surrounding wall members are completely sealed with the lid members, without the lid members being removed from the surrounding wall members.

Lid-holding frame used in production of hollow-package type electronic products, and sealing-process using such lid-holding frame

In a semiconductor device having a semiconductor substrate, an internal electrode layer is formed on the semiconductor substrate. A barrier metal layer is formed on the internal electrode. An external electrode layer is formed on the barrier metal layer. A pad electrode is made of the internal electrode layer, the barrier metal layer, and the external electrode layer. A wire is electrically connected to the pad electrode. An area of the external electrode layer is set midway between an area of a polymerization portion of the wire on the pad electrode and a planar area of the barrier metal layer.

Semiconductor device having pad electrode connected to wire

The present invention provides a bonding structure between a bonding pad and a bonding portion of a bonding wire made of an Au-base material, wherein said bonding pad further comprises: a base layer; at least a barrier layer overlying said base layer; and a bonding layer overlying said at least barrier layer, said bonding layer including an Al-base material, and wherein said bonding portion of said bonding wire is buried in said bonding layer, and an Au&mdash;Al alloy layer extends on an interface between said bonding portion and said bonding layer, and a bottom of said Au&mdash;Al alloy layer is in contact with or adjacent to an upper surface of said barrier layer.

Growing community of inventors

Kawasaki, Japan

Toshimichi Kurihara