Hamamatsu-photonics K.k.

Toshimichi Ishizuka

Hirotoshi Terada

Ikuo Arata

Masataka Ikesu

Akira Shimase

Yoshihiro Ito

Hiroyoshi Suzuki

A failure analysis unit is a wafer conveyance unit configured to convey a wafer while holding the wafer in a semiconductor failure analysis apparatus, the wafer conveyance unit including: a placement table configured to fix a wafer at a predetermined observation position; and a wafer chuck configured to convey the wafer while holding the wafer to the observation position. The wafer chuck includes a plurality of holding members (protruding portions) provided so as to face a side surface of the wafer, and holds the wafer by sandwiching a peripheral portion of the wafer W with the plurality of holding members.

Wafer conveyance unit and wafer conveyance method

The semiconductor failure analysis device includes: a light source configured to generate irradiation light with which the semiconductor device is irradiated; a solid immersion lens disposed on an optical path of the irradiation light; a light detection unit configured to receive reflected light and to output a detection signal according to the reflected light; an optical systemdisposed between the light source and the solid immersion lens to emit the irradiation light to the semiconductor device via the solid immersion lens and disposed between the solid immersion lens and the light detection unit to emit the reflected light received via the solid immersion lens to the light detection unit. The light source emits the irradiation light having a center wavelength of 880 nm or more and 980 nm or less. The solid immersion lens is formed of GaAs.

Semiconductor failure analysis device

A solid immersion lens supporting device includes a lens holderthat holds a solid immersion lensin a free state in which a lens bottom surfaceprotrudes downward through a lower openingso as not to fix the solid immersion lens, and a lens coverwhich is provided to an upper openingof the lens holder, and in which a cover bottom surfaceon the solid immersion lensside is on a plane perpendicular to an optical axis, the lens cover coming into one-point contact with a spherical lens top surfaceof the solid immersion lens. Further, the lens coveris provided with a positioning portion which is capable of carrying out positioning of the solid immersion lenswith respect to the objective lens with reference to an image of the lens coverobserved via the objective lens. Thereby, the immersion lens supporting device which is capable of efficiently carrying out movement, installation, and positioning of the immersion lens onto a sample is realized.

Immersion lens holding device

The present invention relates to a laser beam inspection apparatus for inspecting a defect on a sample such as semiconductor integrated circuits by using a laser beam. The laser beam inspection apparatus irradiates a laser beam to a sample supplied with a constant current or applied by a constant voltage, and then detects indirectly a change in current or a change in electric field corresponding to a change in the value of resistance developed by scanning the laser beam along the surface of the sample. For example, the change in current is conducted indirectly in such a manner that a magnetic field detecting apparatus detects the change in the magnetic field caused by a current flowing the power supply line provided between a constant voltage source and a sample, and whereby it becomes possible to specify the defective area of the sample based on the detection of the change in the magnetic field.

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Hamamatsu, Japan

Toshimichi Ishizuka