Murata Manufacturing Co., Ltd.

Toshimi Yoshimura

Norio Sakai

Kenji Minowa

Tetsuro Saito

Shoichi Kawabata

Shigehiro Nojiri

Shin-ichi Takakura

Katumi Katoh

In order to properly hold a number of miniaturized electronic component chips so that processing such as formation of external electrodes can be efficiently performed, a holder having an adhesive face to be stuck to first end surfaces of a number of electronic component chips for holding the electronic component chips is employed. The number of electronic component chips being held by the holder are dipped in electrode paste, so that external electrodes are formed on second end surfaces thereof. Then, an adhesive face of another holder having stronger adhesion than the adhesive face of the first holder is stuck to the electronic component chips, whereby the number of electronic component chips are simultaneously transferred to this holder. The first end surfaces are then also dipped in electrode paste to from external electrodes thereon.

Method of handling electronic component chips

In order to properly hold a number of miniaturized electronic component chips so that processing such as formation of external electrodes can be efficiently performed, a holder having an adhesive face to be stuck to first end surfaces of a number of electronic component chips for holding the electronic component chips is employed. The number of electronic component chips being held by the holder are dipped in electrode paste, so that external electrodes are formed on second end surfaces thereof. Then, an adhesive face of another holder having stronger adhesion than the adhesive face of the first holder is stuck to the electronic component chips, whereby the number of electronic component chips are simultaneously transferred to this holder. The first end surfaces are then also dipped in electrode paste to form external electrodes thereon.

Electronic component chip holder including two adhesive surfaces having

A ceramic laminate obtained by stacking a plurality of ceramic green sheets is charged in a die comprising a base, a frame and an upper punch, which are formed of rigid bodies respectively, and brought into a sealed state. When hydrostatic pressure is applied in this state, the upper punch is pressurized to approach the base, thereby uniformly compression-compacting the ceramic laminate.

Method of manufacturing ceramic laminated compact

A method of fabricating a multilayer capacitor including a series of steps of applying an electrode paste on a ceramic green sheet supported on a supporting film, cutting the ceramic green sheet to a predetermined size by employing a cutting head having drawing means, stripping the cut ceramic green sheet from the supporting film with the ceramic green sheet being held in the cutting head, transferring the ceramic green sheet held in the cutting head to a metallic pressing mold, and laminating a plurality of ceramic green sheets in the metallic mold to obtain a laminated body by repeating the above step of stripping the ceramic green sheet from the supporting film and the above step of transferring the ceramic green sheet to the metallic mold.

Growing community of inventors

Kyoto, Japan

Toshimi Yoshimura