Stanley Electric Co., Ltd

Toyoda Gosei Co., Ltd.

Toshimi Kamikawa

Hideo Tamura

Takashi Ebisutani

Hisao Yamaguchi

Hideki Mori

Masami Kumei

Hayato Oba

Mahito Hamada

Atsushi Tsuzuki

Hiroko Tsukamoto

Shinichi Miyamura

Shingo Otobe

Hiroo Sakai

Wakako Niino

A semiconductor light emitting apparatus can include a housing filled with a wavelength conversion material-containing resin material which seals a semiconductor light emitting device inside the recess of the housing. A transparent resin material can be charged on the wavelength conversion material-containing resin material, and can be configured to prevent the resin materials from being detached from each other or from other portions, such as a housing. Furthermore, such a semiconductor light emitting apparatus can emit light with less color unevenness. The housing can include a first recessed portion and a second recessed portion. The second recessed portion can have a larger diameter than the first recessed portion so as to form a stepped area at the boundary therebetween. The first recessed portion is filled with the wavelength conversion material-containing resin material as a first resin. The first resin extends along from an inner surface of the first recessed portion up to an inner surface of the second recessed portion to cover the inner surface of the second recessed portion. Accordingly, the first resin is recessed at its center area toward the semiconductor light emitting device to form a curved upper surface, and the second resin on the first resin is not in contact with the housing.

Semiconductor light emitting apparatus

A surface mount semiconductor device using a lead frame can suppress stress applied to a package by a load in a forming process performed for the lead frame projecting from the package at a portion at which the lead frame projects the package. Concave portions can be provided in at least one lead of a pair of leads that project laterally from side faces of the package. The concave portions can be arranged at positions where the leads are bent approximately perpendicularly along the side faces of the package at respective central portions of the leads. Thus, a cross-sectional area of a bending portion of the lead can be reduced, thereby enabling the lead (or leads) to be easily bent with a smaller bending load. Therefore, a surface mount semiconductor device can be achieved which prevents disconnection without impairing a heat radiation property and which has good moisture resistance.

Surface mount semiconductor device

In an LED lamp, a copper film is first formed on a substrate by plating. A resist is then bonded onto the copper film so that shaped like a ring viewed from the whole of the LED lamp. A nickel and a gold film are formed on a portion of the copper film where the resist is not bonded. Next, an adhesive agent is applied onto a bottom of the lamp house so that the lamp house is bonded onto the substrate through the adhesive agent. A transparent epoxy resin is packed in the frame of the lamp house and hardened by heating to perform resin sealing. Since the resist is bonded onto the surface of copper having a large number of fine irregularities sufficient to ensure a large contact area and excellent in adhesion, separation can be prevented from being caused by thermal stress.

Led lamp including a resist bonded to a copper film

An LED display unit comprises a printed circuit board. A plurality of LEDs are packaged on the printed circuit board. Portions of the respective LEDs except for light emitting sections thereof are sealed by a resin. The LEDs having the portions thereof sealed by the resin are received in a case. A plurality of the cases are arranged on the attaching plate, to form a large-sized display panel. The case has a rear face thereof which is brought to a configuration in which spaces exist between the attaching plate and portions of the case except for a fixing portion thereof to the attaching plate and a connector for wiring.

LED display unit

Growing community of inventors

Tokyo, Japan

Toshimi Kamikawa