Fujitsu Corporation

Other

Kabushiki Kaisha Toshiba

Fujitsu Vlsi Limited

Fujitsu Limited & Fujitsu Vlsi Limited

Toshimi Ikeda

Kuninori Kawabata

Masato Matsumiya

Taiji Ema

Hiroshi Nomura

Masato Takita

Masaya Katayama

Masahiro Kuwamura

Atsushi Takeuchi

Kenji Tsuchida

Tsuneo Inaba

Motoo Nakano

Akira Kikutake

Fumihiko Inoue

Junichi Ishikawa

Atsushi Hatakeyama

Masaharu Wada

Fumihiro Kohno

Masatomo Hasegawa

Nobutaka Taniguchi

Osamu Tsuboi

Satoshi Eto

Satoru Asai

Yuki Ishii

Takayoshi Minami

Michiari Kawano

Masaaki Higashitani

Shuzo Otsuka

Yasuko Tabata

A nonvolatile semiconductor memory device includes a plurality of memory cells holding memory cell information, a plurality of bit lines connected to the plurality of memory cells, the plurality of bit lines including a first bit line conected to a selected one of the plurality of memory cells and a plurality of second bit lines connected to non-selected memory cells, a plurality of reference cells supplying different reference currents respectively, and a read-out circuit, wherein, when reading the memory cell information, the read-out circuit is coupled to the first bit line connected to the selected memory cell and coupled to one of the plurality of reference cells through one of the plurality of second bit lines connected to the non-selected memory cells.

Multi-value nonvolatile semiconductor memory device equipped with reference cell and load balancing circuit

A semiconductor memory device having a shift redundancy function includes a switch circuit for changeably connecting a plurality of decode signal lines decoding an address signal to a plurality of selecting lines and redundancy selecting lines, and executes a switch operation for shifting at least one of a plurality of decode lines in the direction of a first redundancy selecting line positioned at one of the ends among a plurality of selecting lines or a second switch operation for shifting at least one of the decode lines in the direction of a second redundancy selecting line positioned at the other end among the selecting lines or both of the first and second operations when any fault occurs in a plurality of selecting lines. The semiconductor memory device preferably includes two or more first redundancy selecting lines positioned at one of the ends of a plurality of selecting lines, two or more second redundancy selecting lines positioned at the other end, and first and second switch units disposed in two stages. When any fault selecting line occurs, the first switch unit executes a first switch operation for shifting at least one of the decode signal lines in the direction of the first redundancy selecting line or a second switch operation for shifting the same in the direction of the second redundancy selecting line, or the second switch unit executes a third switch operation for shifting at least one decode signal line in the direction of the first redundancy selecting line or a fourth switch operation for shifting it in the direction of the second redundancy selecting line.

Semiconductor memory device and method for executing shift redundancy operation

A memory device has a data line (DATA-BUS) for connection to a memory cell, a reference line (Reference-BUS) for reference, a precharge circuit (), a load circuit (), and an amplifier circuit (). The precharge circuit is connected to the data line and the reference line and configured to precharge the data line and the reference line. The load circuit is connected to the data line and the reference line and configured to apply a first constant current to the data line and apply a second constant current which is smaller than the first constant current to the reference line. The amplification circuit is connected to the data line and the reference line and configured to amplify a differential voltage between the data line and the reference line.

Memory device

A semiconductor device which is driven by a first potential, a second potential lower than the first potential, and a third potential lower than the second potential includes a first Pch transistor and a first Nch transistor connected in series between the first potential and the third potential, a second Pch transistor having a drain node thereof connected to a gate node of the first Nch transistor, and a second Nch transistor having a source node thereof connected to a source node of the second Pch transistor, wherein the drain node and gate node of the second Nch transistor are fixed to the second potential and the first potential, respectively.

Semiconductor device using two types of power supplies supplying different potentials

A semiconductor memory device includes a memory cell array having a plurality of memory cells. The memory cells are arranged at intersections between a plurality of word lines and a plurality of bit lines. The semiconductor memory device also includes a row decoder section located adjacent to the memory cell array. The row decoder section has a plurality of decoder circuits which selectively drive the word lines. The semiconductor memory device further includes a control circuit section located adjacent to the row decoder section. The control circuit section has at least one control circuit whose part is arranged in the row decoder section.

Semiconductor memory device

After data readout, in equalizing a complementary pair of bit lines one of which has been overdriven with an overdrive voltage, excessive charges on the overdriven bit line are discharged by a discharge circuit. By adjusting the discharge period of the discharge circuit, the potential to which the bit lines are equalized is adjusted.

Semiconductor memory device having overdriven bit-line sense amplifiers

One (first level shift circuit) of first and second level shift circuits is provided in a local word-drive-line driving circuit located near memory cell arrays. The second level shift circuit is provided in a global word-drive-line driving circuit located remote from the memory cell arrays.

Semiconductor memory device with reduced its chip area and power consumption

A semiconductor device characterized by comprising a first insulating film formed on the semiconductor substrate, a first wiring or mark formed on the first insulating film, an electrically isolated pattern formed under the first insulating film and below the first wiring or mark, a hole formed in the first insulating film to connect the first wiring or mark and the electrically isolated pattern, and a second insulating film for covering the first wiring or mark.

Semiconductor device and method of manufacturing the same

A semiconductor memory device has a segment type word line structure and comprises a plurality of main word lines and a plurality of sub word lines which are arranged at different levels. The semiconductor memory device is provided with a memory cell array divided into a plurality of cell array blocks. A plurality of sub row decoder areas, each for selecting one of the sub word lines, are defined between the cell array blocks. A plurality of first metal wiring lines formed by use of the same wiring layer as the main word lines are provided. The first metal wiring lines pass across the sub row decoder areas and the cell array blocks.

Semiconductor memory device having segment type word line structure

A power supply line is formed over a memory cell array which has arranged a plurality of memory cells using a metal wiring layer M1 which is disposed on the side closest to the memory cell array, of all the metal wiring layers. The power supply lines are formed over the memory cell array using not only an upper metal wiring layer M2 but the metal wiring layer M1 so that the wiring resistance of the power supply lines may decrease and a sufficient amount of current can be supplied to the power supply lines. Consequently, the circuits supplied with an electric current through the power supply lines become capable of high-speed operation. This is particularly effective for the high-speed operation of the circuits arranged around the memory cell array. The power supply line formed using the lower metal wiring layer M1 is connected over the memory cell array to a power supply line which is formed using the metal wiring layer M2 on the upper layer than the metal wiring layer M1. Therefore, the netlike configuration of the power supply lines can be made with higher density compared to conventional ones.

Semiconductor integrated circuit

Microstructures, including a plurality of spaced structural members which are bendable under an external force, undergo a treating method using a first treating liquid, to prevent permanent deformation, by removing the microstructure from the first treating liquid to an environment having a pressure less than atmospheric pressure; or moving the microstructure from the first treating liquid to a second treating liquid having a smaller surface tension than the first treating liquid, and then removing the microstructure from the second liquid; or drying the microstructure removed from the first treating liquid by exposing same to a liquid vapor having a smaller surface tension than the first treating liquid; or removing the microstructure from the first treating liquid to the atmosphere, and drying the microstructure using an energy beam of high intensity or an ultrasonic wave.

Method of liquid treatment of microstructures comprising bendable structural members

On one hand, a row address is provided via a buffer gate to a row address register,, and its output is provided via a complementary signal generation circuit,and a predecoder,to a word decoder,A. On the other hand, in response to an issuance of-an activate command a control signal AS,is provided via a delay circuit,to the clock input CK of the row address register,as a strobe signal AS,, and AS,is provided, to reduce timing margin, via a delay circuit,A to the strobe signal input of the predecoder,as a strobe signal S,. S,is provided via a delay circuit,B to the strobe signal input of the word decoder,A having RS flip-flops,to,or latch circuits. Each of the latch circuits consists of a NOR gate having a set input and a reset input and another NOR gate having an input coupled to receive the output of the former NOR gate and another set input to receive a multiple selection signal which is common for all the latch circuits in word decoders.

Memory device having row decoder

On one hand, a row address is provided via a buffer gate to a row address register 11, and its output is provided via a complementary signal generation circuit 15 and a predecoder 16 to a word decoder 17A. On the other hand, in response to an issuance of an activate command a control signal AS1 is provided via a delay circuit 14 to the clock input CK of the row address register 11 as a strobe signal AS2, and AS2 is provided, to reduce timing margin, via a delay circuit 20A to the strobe signal input of the predecoder 16 as a strobe signal S2. S2 is provided via a delay circuit 20B to the strobe signal input of the word decoder 17A having RS flip-flops 2301 to 2332 or latch circuits. Each of the latch circuits consists of a NOR gate having a set input and a reset input and another NOR gate having an input coupled to receive the output of the former NOR gate and another set input to receive a multiple selection signal which is common for all the latch circuits in word decoders.

According to the present invention, the main word lines arranged in a row direction have a linear pattern shape, and in the region where sub word decoder circuits are formed, the pattern of the main word lines has a shape whereby the pattern branches and splits into a plurality of lines and then reconverges, in the direction of the row. In the region where the line splits, relatively small island-shaped patterns of the conducting layer are located, forming nodes which have a difference electric potential from the main word lines. The main word lines are constituted by a first metal conducting layer, similarly to the prior art. In other words, small island-shaped metal layer patterns, which are electrically different from the main word lines are formed inside the conducting metal layer pattern constituting the main word lines, similarly to island formed in the middle of a river, for example.

A photomask has a plurality of transparent regions defined in an opaque region and classified into first and second groups. Each of the transparent regions belonging to one of the first and second groups is provided with a phase shifter, so that the phase of light transmitted through the transparent region belonging to the first group becomes different from the phase of light transmitted through the transparent region belonging to the second group. The photomask includes: a pair of first transparent regions belonging to the first group and including linear portions disposed in parallel, a virtual straight line interconnecting one ends of the first transparent regions intersecting at a right angle with the extension direction of the linear portions; and a second transparent region belonging to the second group and disposed at the center between, and in parallel to, the linear portions of the pair of first transparent regions, the second transparent region including a linear thickportion and a linear thin portion, the linear thin portion being disposed in an area between the pair of first transparent regions and continuously coupled to the linear thick portion, and a connection portion between the thick and thin portions being indented from the virtual straight line toward the area between the pair of first transparent regions.

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Kawasaki, Japan

Toshimi Ikeda