Tokyo Ohka Kogyo Co., Ltd.

Nec Corporation

Ciba-geigy Corporation

Tokyo Ohka Kogyo, K.k.

Other

Toshimi Aoyama

Katsuyuki Ohta

Hiroshi Komano

Toshiya Takagi

Kiyoshi Uchikawa

Kazuaki Utsumi

Koji Matsui

Mitsuru Kimura

Kenji Tazawa

Eiichi Ogawa

Takeshi Iwai

Masatoshi Yoshida

Nobuhiro Kobayashi

Naoya Katsumata

Hiromitsu Sato

Syunzi Nakazato

Tomoki Horigome

Koji Kahara

The present invention provides a photosensitive resin composition which comprises an urethane resin obtained by reacting (A) a carboxyl group-containing polymer having an acid value of 30 mg KOH/g or more and a glass transition temperature of 30&deg; C. or more, (B) a compound having two isocyanate groups in one molecule, (C) a compound having two hydroxyl groups in one molecule and (D) a photopolymerizable unsaturated monomer having one hydroxyl group in one molecule, and a photopolymerization initiator, and a resin plate for flexography using the photosensitive resin composition, whereby the photosensitive resin composition having water developing properties, high in sensitivity and impact resilience, and excellent in water resistance, ink resistance and press life of a hardened portion forming a line pattern area of a printing plate material and the resin plate for flexography prepared by the use of the photosensitive resin composition can be provided.

Photosensitive resin composition and flexographic resin plate

A photosensitive resin composition comprising a polymeric binder, an ethylenically unsaturated monomer and a photopolymerization initiator is disclosed. Also, a PS plate using the same is disclosed. The photopolymerization initiator comprises at least one compound selected from specific triazine compounds having a bromine atom on the substituted phenyl nucleus thereof and specific trihalomethyl-containing triazine compounds. The composition has high photosensitivity sufficient for exposure with an argon laser light and satisfactory developability. Additionally disclosed is a photosensitive resin composition comprising a polymeric binder, a monomer having an ethylenically unsaturated double bond and photopolymerization initiators including an acridine compound and a specific triazine compound. This second photosensitive resin composition has high sensitivity, high resolution and a wide development margin. Using this photosensitive resin composition, color filters and PS plates can be produced that have high sensitivity and resolution even to low-energy visible light and which assure high pattern reproducibility.

Photosensitive resin composition containing a triazine compound and a

Compositions comprising a linear base polymer, an ethylenically unsaturated addition-polymerizable compound and a combination of (A) a 1-benzoyl-1-amino-substituted-1-benzylalkane with (B) an .alpha.-phenyl-.alpha.,.alpha.-dialkoxyacetophenone as photopolymerization initiator are suitable for the production of thick-film printing plates.

Process for the production of printing plates

An integrated circuit connecting method that includes connecting electrode pads on an integrated circuit device to electrode terminals on a base with metal bumps interposed, the electrode terminals being formed in registry with the electrode pads. The method includes the steps of forming metal bumps on a surface of at least one of the electrode pads and the electrode terminals; covering the surface on at least one of the integrated circuit device side and the base side with a resin that cures upon exposure to active energy rays; patterning the resin to strip selectively the coating of the resin over one of the electrode pads and the electrode terminals; bringing the electrode pads and the electrode terminals into a face-to-face relationship, allowing the metal bumps to contact one of the opposing electrode pads and electrode terminals, performing thermocompressing so that the resin coating will adhere closely to one of the integrated circuit device and the base while, at the same time, the electrode pads are connected to the electrode terminals with the metal bumps interposed; and performing at least one of heat treatment and exposure to active energy rays.

Method of bonding circuit boards

Photopolymerizable compositions

Disclosed is a photosensitive resin composition for use in a light-shielding film, comprising a photosensitive resin and a light-shielding coloring material, wherein light transmission properties after formation of the light-shielding film are controlled by the light-shielding coloring material so that (i) the light transmission through the light-shielding film is 1% or more in at least one wavelength of a light wavelength region of from 330 nm to less than 425 nm, and (ii) the light transmission through the light-shielding film is 2% or less in a light wavelength region of from 425 to 650 nm.

Photosensitive resin composition used in a method for forming a

Photosensitive resin composition for use as a light-shielding film which

A method of bonding first and second circuit boards includes applying a light-sensitive adhesive over the first electrodes on a first circuit board and the areas where the first electrodes are not formed, and drying the applied adhesive to form a light-sensitive adhesive layer having the light-sensitive adhesive layer exposed selectively to active rays of light and performing development to remove only the light-sensitive adhesive layer on the first electrodes, and then performing a heat treatment to impart bonding quality to the light-sensitive adhesive layer remaining between adjacent first electrodes, placing the first and second circuit boards one on top of the other and thermocompressing the two circuit boards to have the first electrodes connected electrically to the second electrodes to form a single circuit board; and performing a heat treatment and/or exposure to active rays of light on the formed single circuit board.

The remover solution of the invention comprises (A) from 35 to 80% by weight of an alcoholic solvent such as ethylene glycol monoethyl ether, (B) from 10 to 40% by weight of an organic solvent which is a halogenated hydrocarbon solvent, e.g., 1,2-dichlorobenzene and methylene chloride, an ether solvent, e.g., tetrahydrofuran, or an aromatic solvent, e.g., benzene and xylene, and (C) from 0.1 to 25% by weight of a quaternay ammonium compound such as tetramethyl ammonium hydroxide and trimethyl hydroxyethyl ammonium hydroxide. Different from conventional remover solutions which only can swell cured photoresist compositions, the inventive remover solution has a power to completely dissolve a cured photoresist layer to give a quite satisfactory result in the removing works of patterned photoresist layers in the manufacture of semiconductor devices.

Remover solution for photoresist

The invention provides a photosensitive resin composition useful as a solder resist, etching resist or plating resist in the manufacture of printed circuit boards to exhibit excellent resistance against heat and chemicals and good adhesion to the substrate surface. The composition essentially comprises (a) a copolymeric resin of an .alpha.,.beta.-unsaturated dicarboxylic acid anhydride and an ethylenically unsaturated polymerizable compound, of which the acid anhydride units are partially esterified with an unsaturated alcohol and a saturated alcohol, and (b) a photopolymerization initiator. The composition may further comprise optional ingredients such as (c) a photopolymerizable monomeric compound, (d) an epoxy-based resin and (e) an aromatic diamine compound.

Photosensitive resin composition

A water-based photopolymerizable resin composition is disclosed which is suitable for the preparation of a relief printing plate by the photolithographic techniques. The inventive composition, which basically comprises a water-soluble polymer, e.g., poly(vinyl alcohol), a photopolymerizable monomer and a photopolymerization initiator, is characterized in that at least a part of the photopolymerizable monomer is N-tetrahydrofurfuryloxymethyl acrylamide or N-tetrahydrofurfuryloxymethyl methacrylamide. By virtue of this unique ingredient in the composition, the printing plate prepared from the inventive composition is imparted with improved fidelity of pattern reproduction and durability in printing as a consequence of increased hardness and pliability to be freed from the drawback of crack formation in printing even on a cylinder of small diameter under a cold and low-humidity condition.

Growing community of inventors

Kanagawa, Japan

Toshimi Aoyama