Nec Corporation

Toshimasa Umetsu

Makoto Moribe

Misao Iwatare

Toshio Nakanishi

Satoru Onodera

Toshiki Shimasaki

Keijiro Kadomatsu

Yoetsu Aota

An electronic device package accommodatable in an electronic device casing. When a high density multipin connector is caused to mate with a connector mounted on the casing, the former is once brought to a stop just before mating with the latter and, therefore, prevented from rapidly mating with the latter. This eliminates the damage to the body of the connector and the deformation of the pins of the connector.

Electronic device package

An improved mounting apparatus of a shelf housing printed circuit boards in a frame is provided. The shelf is designed to prevent mechanical damage to itself and to the printed circuit boards inside the shelf in the event of deformation of the frame due to vibration during transportation or earthquakes. Guide members which enclose the printed circuit boards are fastened to supporting members in such a manner that the guide members can shift position lengthwise along the supporting members. Thus, mechanical stress causing the frame to deform from a rectangle into a parallelogram does not also deform the guide members holding the printed circuit boards. Accordingly, damage to soldered connections or circuit components on printed circuit boards is prevented.

Structure of shelf to be fixed to frame of communications apparatus

Growing community of inventors

Miyagi, Japan

Toshimasa Umetsu