Toyoda Gosei Co., Ltd.

Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Kyoritsu Elex Co., Ltd.

Toshimasa Hayashi

Hideki Kokubu

Kosei Fukui

Michio Miyawaki

Jun Ito

Satoshi Wada

Masanobu Senda

Takashi Nonogawa

Kazuki Nishijima

Naoki Shibata

Takashi Terayama

Yukihiro Demukai

Hiroyuki Tajima

Yuji Takahashi

Shota Shimonishi

Daiichiro Kawashima

Toshiaki Chiyo

Koichi Goshonoo

Yuhki Ito

Mitsuhiro Inoue

Kenichi Koya

Takumi Narita

Tetsuya Miyano

Atsushi Tsuzuki

Katsunori Arakane

Isao Ito

Hiroaki Kawaguchi

Kazuma Mitsuyama

Itsuki Yamamoto

Kouji Kudo

Nario Fukumoto

Hiroyuki Fukae

Kengo Nishiyama

A method of manufacturing a light-emitting device includes providing a case including an annular sidewall and an LED chip including a chip substrate and a crystal layer and mounted in a region surrounded by the sidewall of the case, and dripping a droplet of an electrically-charged phosphor-containing resin so as to fill a space between the sidewall and the LED chip. The droplet is attracted toward the sidewall by an electrostatic force during the dripping.

Method of manufacturing light-emitting device

A light emitting device includes a double-sided electrode type semiconductor light emitting element that has a first electrode formed on a front side of the double-sided type semiconductor light emitting element and a second electrode formed on a rear side of the double sided type semiconductor light emitting element and is configured to emit light from a side wall surface of the double-sided electrode type semiconductor light emitting element, a first lead frame that is bonded to a whole area of one face of the first electrode, a second lead frame that is bonded to a whole area of one face of the second electrode, and a case in which a portion of the first lead frame and a portion of the second lead frame is embedded.

Light emitting device

A light-emitting device includes a plurality of LED chips arranged in series and each including a chip substrate and a crystal layer including a light-emitting layer. One of the plurality of LED chips is configured such that the chip substrate thereof includes a side surface facing another adjacent LED chip of the plurality of LED chips. The side surface has a highest cleavability among all side surfaces of the chip substrate of the one of the plurality of LED chips.

Light-emitting device

The present invention provides a light emitting device, which includes a light emitting diode (LED) chip, a wavelength conversion plate including a fluorescent substance and disposed on a light output surface side of the LED chip, and a sub heat radiation path formed to radiate heat of the wavelength conversion plate. The sub heat radiation path includes a transparent heat-conductive film provided on a surface of the wavelength conversion plate, a heat radiator provided in the vicinity of the LED chip, and a thermal connection member that thermally connects the transparent heat-conductive film to the heat radiator.

Light emitting device and manufacturing method for the same

A light emitting device comprises a case having a space therein, the space defined by an inner bottom surface and an inner side surface of the case, a lead frame housed in the space, and having a bending portion bent along the inner side surface of the case, and a light emitting element electrically connected to the lead frame, wherein a rear surface of the bending portion is embedded in the case and a front surface of the bending portion is exposed from the inner side surface of the case so as to oppose the light emitting element, and wherein a projecting portion projected from the inner bottom surface and inclined to the inner side surface of the case is formed on the inner side surface of the case.

The present invention provides a LED lamp module including a metal base, a flexible board mounted on the metal base and having a through hole, a surface mounted type LED lamp including a ceramic package having a projection portion on a back of the ceramic package, a LED chip mounted on the ceramic package, and a light output surface. The projection part is thermally connected with the metal base through the through hole, and the LED lamp is electrically connected with the flexible board through an electric conductive member at a portion other than the projection portion. The LED lamp module includes a cover covering a part of the LED lamp other than the light output surface and the flexible board and pressing the LED lamp.

LED lamp module

In a side surface light emitting type light emitting device mounted on the surface of a wiring board, the light emitting device comprises: a base body part having a reflecting case and a terminal holding part formed integrally with the reflecting case in the rear part of the reflecting case; and lead members inserted into the base body part, having a pair of connecting parts including base parts of the connecting parts drawn out from the lower surface of the base body part and bent along the lower surface and side bending parts provided in the base parts of the connecting parts and bent along the side surfaces of the terminal holding part and connected to a pattern of the wiring board; and is characterized in that the base parts of the connecting parts are provided with protruding parts protruding toward the center of the lower surface of the terminal holding part and cut-out parts are provided for accommodating the protruding parts in the lower surface of the terminal holding part.

Side surface light emitting device

Light emitting diode

In a light-emitting device including a base body portion which is configured by integrally forming a reflection case and a terminal holding portion provided at the rear portion of the reflection case and lead members to be inserted into the base body portion, portions of the lead members extracted outside of the base body portion are bent along the terminal holding portion to form a pair of connection portions to be connected to the pattern of a wiring board, respectively, a plurality of radiation plates are provided at the lead member. The plurality of the radiation plates are extracted from the same surface (lower surface) of the base body portion. Since the plurality of radiation plates are provided, at the time of being the radiation plates, the base body portion is prevented from being applied with an excessive force and the damage of the base body portion can be prevented.

Growing community of inventors

Kiyosu, Japan

Toshimasa Hayashi