Matsushita Electric Works, Ltd.

Toshiki Yamane

Yoshimasa Fujiwara

Masayuki Hattori

Hiroshi Matsuda

Yuji Takada

Kazutaka Ikeda

Kazuo Sawada

Osamu Iijima

Jun Nishijima

Yoshihiko Sugimoto

Takayoshi Akiyama

Hisato Taniwaki

Yoshinori Koizumi

An image processing and inspection system includes a master device () having a video camera () and a first controller () responsible for processing and inspecting the image of an object () in accordance with inspection criteria. Intercommunicated () with the master device () is a personal computer () equipped with a second monitor (), and a second input member (). The motion-picture taken by the camera () for inspection on the side of the master device () is transmitted to the computer () so as to be displayed on the second monitor () as a real-time image of the object () for easy confirmation of the object on the side of the computer (), thereby enabling to determine the inspection criteria on the side of the computer () while monitoring the real-time image of the object ().

Image processing and inspection system

In the present invention, the same image data, captured by a TV camera, is processed by the use of an image-processing board connected to an extension bus constituted by a personal computer and a CPU board inside the personal computer so that the CPU board and the image-processing board are allowed to execute the image processes in parallel with each other.

Image processing inspection apparatus

An image processing inspection apparatus comprises a TV camera, a plurality of image-processing-use image memories which are provided for a plurality of screen frames, a plurality of display-use image memories which are provided for a plurality of screen frames, a display monitor, a CPU and a switch for selectively connecting for each screen frame one of the image-processing-use image memories with the TV camera and the CPU, and one of the display-use image memories with the TV camera and the display monitor.

An optical measurement system for determination of a profile or thickness of an object includes first and second optical heads directing first and second light beams, respectively on first and second points on the surface of the object. Photo-sensors are included respectively in the first and second optical heads for receiving reflected lights from said first and second points and providing first and second outputs which varies in proportion to perpendicular distances from a reference plane to said first and second points on the object's surface. The first and second outputs are transmitted selectively to a single processing circuit through a switch. The processing circuit operates to process the first and second outputs in sequence to measure by triangulation the perpendicular distance of the first and second points from the reference plane and to analyze a surface or thickness of the object based upon thus measured perpendicular distances. With the use of the single processing circuit, the first and second outputs can be processed in the identical conditions to enable reliable determination of the perpendicular distances of the first and second points from the reference plane and therefore accurate analysis of the surface profile or the thickness of the object.

Optical measurement system for determination of an object's profile or

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Sakai, Japan

Toshiki Yamane