Hitachi, Ltd.

Hitachi Metals, Ltd.

Hitachi Communication Technologies, Ltd.

Hitachi Chemical Company, Ltd.

Toshiki Sugawara

Yasunobu Matsuoka

Hiroki Ikeda

Yukio Nakano

Masahiko Mizutani

Takashi Mori

Kenichi Sakamoto

Noboru Endo

Masaki Ohira

Kazuhiko Hosomi

Tohru Kazawa

Koichiro Adachi

Masahiro Aoki

Yusuke Yajima

Norio Chujo

Naoki Matsushima

Satoshi Makio

Madoka Minagawa

Saori Hamamura

Satoshi Kaneko

Masatoshi Takahashi

Yoshihiro Ashi

Shinichi Saito

Tsutomu Kono

Tatemi Ido

Koji Wakayama

Masataka Shirai

Kazuyoshi Hoshino

Shigeki Makino

Kazutaka Sakai

Atsushi Kubotera

Makoto Takahashi

Kaoru Umemura

Masaru Izawa

Kenichi Tanaka

Hitoshi Nakamura

Nobuyuki Sugii

Shinobu Gohara

Junya Kosaka

Nobuhiko Kikuchi

Shinji Tsuji

Ryoji Takeyari

Kazunori Shinoda

Kouji Nakahara

Toshio Katsuyama

Katsuya Oda

Shigehisa Tanaka

Hideo Arimoto

Hidehiro Toyoda

Hiroshi Kakibayashi

Kazuhiko Sagara

Misuzu Sagawa

Masato Shishikura

Kenro Sekine

Taro Ogawa

Etsuko Nomoto

Toshihiko Fukamachi

Kenji Kogo

Ken'ichi Tanaka

There are provided an optical interconnection module and an optical-electrical hybrid board using the same to process optical and electric signals on a board at a low transmission loss at high speed in transmitting high-speed optical signals sent and received between chips or between boards in a data processing apparatus. An optical interconnection module has a structure in which an optical signal is emitted from a laser optical source device, propagates the inside of a modulator device, and is deflected by a beam turning structure in the vertical direction of a substrate, an optical signal is incident from the outside of a semiconductor substrate, and transmitted and received at a photo diode provided on the semiconductor substrate, and the optical signals are optically connected to each other through the inside of the semiconductor substrate in the vertical direction of the substrate with the outside of the semiconductor substrate.

Optical interconnection module and optical-electrical hybrid board

A highly reliable optical switching device and optical switching method ensure restoration of the failure in the large-capacity high density wiring of the multicore fiber with the general number of cores (7 cores, 19 cores and the like). An optical transmission system which transmits a supervisory control signal concerning a transmission path switching to one or more cores of a single or multiple multicore fibers, an active signal to one or more cores, and a standby signal to one or more cores includes optical switching devices connected to respective ends of the optical transmission system. Upon detection of the transmission failure of the active signal based on the signal transmission condition and information from the supervisory control signal, it is switched to the standby signal. The supervisory control signal is transmitted to the center core of the multicore fiber.

Large-capacity fiber optical switching device and optical transmission system

A core of an optical waveguide and a core of a waveguide type optical device are adjacently disposed, and a layer is continuously formed at one end of the core of the waveguide type optical device, wherein an effective refractive index of the layer decreases toward a long axis direction of the optical waveguide stripe.

Optical semiconductor device and optical waveguide

In the optical waveguide board, simultaneously with pattern formation of mirror members at arbitrary positions on a clad layer, guiding patternshaving convex shapes are formed respectively at arbitrary positions on peripheral parts of mirror patterns, and the mirror patternsare worked into tapered shapes. Next, in a state that a mask memberhaving through holes at desired positions, and the guiding patternsare guided by mating, a metal film is formed on surfaces of slope partsof the mirror patterns and the guiding patterns. Furthermore, in a state that the guiding patternsand the photomaskare guided, wiring core patternsare formed on the clad layeradjacent to the mirror patterns

Optical waveguide board having guided structure and method of manufacturing the same, and method of manufacturing optical-electrical hybrid board

Disclosed is a silicon optical waveguide having a small optical loss and no polarization dependency. The silicon optical waveguide is formed on a silicon substrate with an embedded oxide film therebetween, the plane orientation of the surface of the silicon optical waveguide is the (110) plane, the plane orientation of the side wall is the (111) plane, and the recesses and projections of the side wall are planarized at an atomic level.

Semiconductor optical device

An optical module providing higher reliability during high-speed light modulation and a lower bit error rate when built into a transmitter (transceiver). An optical module contains a taper mirror for surface emission of output light, an optical modulator device, and an optical modulation drive circuit, and the optical modulator device and the optical modulation drive circuit are mounted at positions so as to enclose the taper mirror.

Optical module

Specifically, provided is a horizontal-cavity surface-emitting laser including, on a semiconductor substrate: a cavity structure; a waveguide layer; and a reflecting part, wherein a first electrode provided on the semiconductor substrate along side regions of the cavity structure and the reflecting part and a second electrode provided on the main surface of the cavity structure are provided, the first electrode includes an electrode (1) that is provided around one side region of the reflecting part located in the direction intersecting with the traveling direction of light guided through the waveguide layer and an electrode (2) provided around one side region of the cavity structure and the other side region of the reflecting part that are located in the direction parallel with the traveling direction of light guided through the waveguide layer, and the shape of the electrode (2) has different widths at at least two positions.

Horizontal-cavity surface-emitting laser

In order to provide a compact optical module permitting highly efficient optical coupling and having components thereof highly densely packaged, a light emitting diode that is included in the optical module and emits light in a vertical direction with respect to a principal surface of a semiconductor substrate is provided with a lens integrated into a light emitting region, and a retaining section integrated to surround the light emitting region. Accordingly, readiness in alignment of the light emitting diode and an optical fiber, which guides light emitted from the light emitting diode, with each other is upgraded. Eventually, the compact optical module permitting highly efficient optical coupling and having components thereof highly densely packaged can be provided.

Surface emitting laser module and vertical illuminated photodiode module

An object of the present invention is to provide a germanium laser diode that can be easily formed on a substrate such as silicon by using a normal silicon process and can emit light efficiently. A germanium light-emitting device according to the present invention is a germanium laser diode characterized in that tensile strain is applied to single-crystal germanium serving as a light-emitting layer to be of a direct transition type, a thin semiconductor layer made of silicon, germanium or silicon-germanium is connected adjacently to both ends of the germanium light-emitting layer, the thin semiconductor layer has a certain degree of thickness capable of preventing the occurrence of quantum confinement effect, another end of the thin semiconductor layer is connected to a thick electrode doped with impurities at a high concentration, the electrode is doped to a p type and an n type, a waveguide is formed so as not to be in direct contact with the electrode, and a mirror is formed at an end of the waveguide.

Light-emitting device, light-receiving device and method of manufacturing the same

The object of the invention included in the present application is to automatically prevent the deterioration of the image even when the image quality of the projected image is deteriorated due to the replacement of the light source or the like. The following light beam scanning image projection apparatus is one means for achieving the object. In the light beam scanning image projection apparatus including a plurality of light sources which emit the light beams of respectively different wavelengths, a driving section which modulates the intensity of each light beam in accordance with the image signal, the light axis alignment means which aligns the light axes of each light beam, and scanning means which scans the light beams, the light axis alignment means includes: a plurality of optical elements; and an adjusting section which adjusts at least one of a position and a gradient of at least one of the optical elements, and the light beam scanning image projection apparatus further includes: detecting means which detects a shift between a spot center of each light beam and a center reference point; and position correction means which controls the adjusting section based on a detection result in the detecting means to adjust at least one of the position and the gradient of at least one of the optical elements of the light axis alignment means, thereby aligning the light axes of each light beam.

Light beam scanning image projection apparatus

It is necessary to completely remove overlapping of signals between plural PONs in order to make the PONs coexist. Accordingly, it is required to share or intensively manage bandwidth use conditions over an optical fiber that serves as a common band between plural systems. Therefore, transmission clocks should be synchronized with high accuracy between plural systems. A reference clock is provided from an external device or a representative OLT to the entire systems to perform clock synchronization between plural systems, so that the overall systems are synchronized by synchronizing each OLT with the reference clock. A hierarchical management method is selected that manages ONUs under the control of each OLT by managing band use information arranged for each OLT with respect to an external device or a representative OLT for sharing of bandwidth use conditions between plural systems.

Network system and optical line terminal

Network system, optical network unit and optical line terminal

In fabricating an optical I/O array module, an optical waveguide provided with mirror parts, each having a tapered face, is formed on a substrate, a convex shaped member or a concave shaped member is placed at spots above the respective mirror parts of the optical waveguide, and laser diode arrays and photo diode arrays, provided with either a concave shape, or a convex shape, are mated with, or into the convex shaped member or the concave shaped member before being mounted. Further, there are formed multiple filmy layers, on which an LSI where a driver IC LSI of optical elements, and an amplifier LSI of the optical elements are integrated.

Optical I/O array module and its fabrication method

A photoelectric composite wiring module, being superior in performances and mass-productivity thereof, and a transmission apparatus of applying that therein are provided. Optical devicesandare disposed on a circuit board, so that they are optically coupled with optical guidesformed on the circuit board, wherein a filet-like resin is formed on a side surface of a bump, which is formed on side surfaces or/and upper portions of the optical devices, on an upper layer thereof being compressed a resin film to be adhered thereon, thereby forming an insulation film, and an electric wiring layeris laminated, so that the electrodes of the optical devicesand wirings of the electric wiring layer are electrically connected with, and further thereon is mounted a semiconductor element; thereby obtaining the structure for brining the transmission speed to be high per channel, and for preventing the power consumption from increasing. Also, it has the structure of not causing deterioration of the optical devices due to ill influences of moisture, thereby achieving high reliability. Further, it also produces an easy connecting method with a transmission apparatus, and high productivity thereof.

Photoelectric composite wiring module and method for manufacturing same

A photoelectric composite wiring module includes a circuit substrate, an optical device, an LSI (device) having a driver and an amplifier for the optical device, and a thin film wiring layer having an electrical wiring. The optical device is connected with the LSI by means of the electrical wiring. The optical device is formed on the circuit substrate and optically coupled to an optical waveguide formed in the circuit substrate. The thin film wiring layer is formed on the optical device to ensure that the optical device is electrically connected with the electrical wiring of the thin film wiring layer. The LSI is mounted on and electrically connected with the thin film wiring layer.

Photoelectric composite wiring module and method for manufacturing the same

Growing community of inventors

Kokubunji, Japan

Toshiki Sugawara