Kobe Steel, Ltd.

Toshiki Segawa

Hiroshi Tamagaki

Hirofumi Fujii

Tadao Okimoto

Atsushi Ishiyama

Hideyuki Tsumura

A deposition device includes: a cooling unit that cools workpieces; a rotating table main body that rotates around a vertical axis, this rotating table main body having a cooling unit placement portion on which the cooling unit is placed and workpiece placement portions which are arranged so as to surround the periphery of the cooling unit placement portion and on which the workpieces are placed respectively; a lifting mechanism that lifts and lowers the cooling unit, inside the space, between a first position in which the cooling unit is placed on the rotating table main body and a second position in which the cooling unit is spaced upward from the rotating table main body and faces side surfaces of the workpieces placed on the workpiece placement portions; and refrigerant piping attached to the chamber and detachably connected to the cooling unit to supply the refrigerant to the cooling unit.

Deposition device having cooler with lifting mechanism

A heat treatment apparatus includes: a plurality of rollers guiding a substrate, each of the rollers having a roller width greater than a substrate width; a heater including a heating surface which has a width greater than the substrate width; and a heat shield member arranged between a heating surface exposed portion of the heating surface, which is exposed while protruding from an end of the substrate in a width direction of the substrate along the width direction and a roller exposed portion of the specific roller included in the plurality of rollers, the roller exposed portion being exposed while protruding from the end of the substrate in the width direction to the same direction in which the heating surface exposed portion protrudes, the heat shield member shielding heat radiation from the heating surface exposed portion to an outer circumferential surface of the roller exposed portion.

Heat treatment apparatus

The disclosed plasma CVD apparatus () is provided with a vacuum chamber (); a pair of deposition rollers () disposed within the vacuum chamber () that are connected to both poles of an AC power supply and around which a substrate (W) is wound; a gas-supplying device () that supplies process gas containing a source gas to a deposition zone (D) which is a portion of or all of the region that is on one side of a line linking the centers of rotation of the pair of deposition rollers (); and a magnetic-field-generating device () that, by means of the AC power supply being applied to each of the deposition rollers (), forms a magnetic field that causes the source gas in a predetermined region to become plasma. The magnetic-field-generating device () causes the source gas in the region adjacent to the surface of the portion of the pair of deposition rollers () located within the deposition zone (D) to become plasma, forming a plasma region (P). The substrate (W) is wound around the pair of deposition rollers () so as to pass through the plasma region (P).

Plasma CVD apparatus

Provided is a continuous deposition apparatus wherein replacement operations of a feeding unit and a take-up unit are easily performed. The continuous deposition apparatus is provided with: a vacuum chamber (); a deposition roller (); evaporation sources (LLR) which supply a deposition material to a film substrate from the side of the film substrate which is wound on the deposition roller and on which a coating is to be deposited; a feeding unit () which supplies the film substrate to the deposition roller (); and a take-up unit () which takes up the film substrate after the coating is deposited thereon. The vacuum chamber () is provided with: an evaporation source opening for carrying out and carrying in the evaporation sources; evaporation source door sections (L,R) which open and close the evaporation source opening; another opening provided for the substrate on which the coating is to be deposited, besides the evaporation source opening, for the purpose of carrying out and carrying in the feeding unit () and the take-up unit (); and door sections (L,R) which are provided for the substrate and open and close the opening provided for the substrate.

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Takasago, Japan

Toshiki Segawa