Tokyo Shibaura Denki Kabushiki Kaisha

Toshiki Sasabe

Hideo Honma

Osamu Sasaki

Kunihiro Ikari

Tsutomu Takamura

Kazuhiro Takeda

There is presented a chemical copper-plating bath capable of providing a plated film having excellent mechanical characteristics, especially ductility, which bath contains a specific additive having the following formula: ##STR1## Stability of the bath as well as further improvement of mechanical strength of plated films are also found to be attained by adding in combination at least one compound selected from the group consisting of 1,10-phenanthroline, its derivatives, 2,2'-dipyridyl, 2,2'-diquinoline and water-soluble cyanides.

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Tokyo, Japan

Toshiki Sasabe