Dow Corning Toray Company, Ltd.

Dow Corning Corporation

Dow Silicones Corporation

Toshiki Nakata

Makoto Yoshitake

Steven Swier

Toshio Saruyama

Masaaki Amako

Kazuo Hirai

Toyohiko Fujisawa

Kouichi Ozaki

Hiroaki Yoshida

Shin Yoshida

Toru Imaizumi

Yusuke Miyamoto

Haruna Yamazaki

Takaki Aoyama

The present invention relates to a hot-meltable curable silicone composition for compression molding or laminating and a laminate provided with at least one layer comprising the composition, as well as a semiconductor device using these and a method of manufacturing the same. In accordance with the present invention, it is possible to efficiently manufacture a semiconductor device provided with a hemi-spheroidal lens- or dome-shaped seal. In the present invention, it is easy to control the shape of the seal, and the seal does not contain any bubbles. In the present invention, it is also easy to control the thickness of the coating layer of the semiconductor device apart from the seal.

Hot-melt type curable silicone composition for compression molding or laminating

The present invention relates to a curable silicone composition which is a hydrosilylation reaction curable silicone composition for sealing, coating, or adhering of an optical semiconductor element, and includes at least one type of compound selected from triazole-based compounds with the exception of benzotriazole. The curable silicone composition, for example, includes (A) an organopolysiloxane having at least 2 aliphatic unsaturated hydrocarbon groups per molecule, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule, (C) at least one type of compound selected from among triazole-based compounds with the exception of non-substituted benzotriazole, and (D) a hydrosilylation reaction catalyst. The curable silicone composition forms a cured product having excellent transparency and thermal shock resistance, and the optical semiconductor device utilizing the composition has excellent reliability.

Curable silicone composition and optical semiconductor device

A display device having a surface with light-emitting regions and non-light-emitting regions, wherein the aforementioned light-emitting regions and non-light-emitting regions are subjected to simultaneous surface treatment selected from: (1) brush treatment; (2) blast treatment; or (3) combined brush and blast treatment, whereby after the aforementioned treatment the surfaces of the light-emitting regions have a 60&#xb0;-mirror-surface glossiness according to JIS Z 8741 exceeding 20%, while the surfaces of the non-light-emitting regions have a 60&#xb0;-mirror-surface glossiness according to JIS Z 8741 not exceeding 20%, has good visibility of images reproduced by the display, which is especially suitable for outdoor application.

Display device, method of manufacturing thereof, and method of improving visibility

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Ichihara, Japan

Toshiki Nakata