Nitto-denko Corporation

Toshiki Naitou

Mitsuru Honjo

Yasunari Ooyabu

Jun Ishii

Kazunori Mune

Takami Hikita

Katsutoshi Kamei

A printed circuit board and method of manufacturing the printed circuit board, including a first and second write wiring patterns, an end of a first line and an end of a second line of the first write wiring pattern are arranged on both sides of a third line of a second write wiring pattern. Circular connection portions are provided at the ends of the first line and the second line. Through holes are formed in portions of a cover insulating layer above the connection portions, respectively. First connecting layers made of copper, for example, are formed to fill the through holes of the cover insulating layer. A substantially rectangular second connecting layer made of copper, for example, is formed to integrally cover upper ends of the connecting layers. This causes the first and second lines to be electrically connected to each other through the first and second connecting layers.

Printed circuit board and method of manufacturing the same

A first insulating layer is formed on a suspension body, and a write wiring trace is formed on the first insulating layer. A second insulating layer is formed on the first insulating layer so as to cover the wiring trace. A ground layer is formed on the second insulating layer so as to be positioned above the wiring trace. Moreover, a third insulating layer is formed on the second insulating layer so as to cover the ground layer. A read wiring trace is formed on the third insulating layer. A fourth insulating layer is formed on the third insulating layer so as to cover the wiring trace.

A printed circuit board and method of manufacturing the printed circuit board, including a first and a second write wiring patterns, an end of a first line and an end of a second line of the first write wiring pattern are arranged on both sides of a third line of the second write wiring pattern. Circular connection portions are provided at the ends of the first line and the second line. In addition, through holes are formed in respective portions of a base insulating layer below the connection portions. Each connection portion comes in contact with a connecting region of a suspension body within the through hole.

A method of manufacturing an opto-electric hybrid board which is capable of reducing the number of steps for the manufacture of the opto-electric hybrid board and which achieves the reduction in thickness of the opto-electric hybrid board to be manufactured, and an opto-electric hybrid board obtained thereby. A resist layer is formed on a core-forming resin layer, and is then formed into a predetermined pattern. Resultant portions of the core-forming resin layer serve as cores (optical interconnect lines). Next, a thin metal filmis formed on the under cladding layerso as to cover the resist layer and the cores. Thereafter, the resist layer is removed together with portions of the thin metal filmlying on the surface of the resist layer. Electroplating is performed on the remaining portions of the thin metal filmto fill groovesdefined between adjacent ones of the coreswith electroplated layersobtained by the electroplating. The electroplated layersserve as electrical interconnect lines

Manufacturing method of opto-electric hybrid board and opto-electric hybrid board obtained thereby

A method of manufacturing an opto-electric hybrid board which is capable of reducing the number of steps for the manufacture of the opto-electric hybrid board and which achieves the reduction in thickness of the opto-electric hybrid board to be manufactured, and an opto-electric hybrid board obtained thereby. A plurality of protruding cores (optical interconnect lines)are formed in a predetermined pattern. Thereafter, a thin metal filmis formed in grooves defined between adjacent ones of the coresVia-filling plating is performed on the thin metal filmto fill the above-mentioned grooves with a via-filling plated layerThe plated layerserves as electrical interconnect lines

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Ibaraki, Japan

Toshiki Naitou