Murata Manufacturing Co., Ltd.

Toshiki Nagamoto

Yasuhiro Nishisaka

Tetsuya Kisumi

Yukio Sanada

Yoko Okabe

Mitsuhiro Kusano

Seiji Koga

Masato Kimura

A multilayer ceramic capacitor having an external electrode with a glass phase, where an occupation rate of the glass phase is 30% to 60% on an area ratio, and a maximum length c of the glass phase is 5 &#x3bc;m or less.

Conductive paste, electronic component, and method for manufacturing electronic component

In a multilayer ceramic capacitor in which an outer electrode is arranged on a ceramic element body to be electrically connected to an inner electrode, the outer electrode includes a metal electrode layer on the ceramic element body, and a conductive resin layer on the metal electrode layer. When a dielectric layer between a pair of the inner electrodes adjacent in a stacking direction among a plurality of the inner electrodes extending to one of a pair of end surfaces of the ceramic element body is an inter-electrode dielectric layer, a gap extends a direction connecting the adjacent inner electrodes sandwiching the inter-electrode dielectric layer at a position near or adjacent to at least the one of the end surfaces.

Multilayer ceramic capacitor

A conductive paste includes a metal powder, a glass frit containing a Si component, and an organic vehicle. The metal powder has a flat shape with a ratio a/b of a maximum length a to a maximum thickness b of 2.5 or more, a molar content of SiOin the glass frit is 36 to 59 percent by mole, and a volume content of the glass frit is 6 to 11 percent by volume. In external electrodes of a multilayer ceramic capacitor using this conductive paste, the molar content of SiOin a glass phase is 38 to 60 percent by mole, and an occupation rate of the glass phase is 30% to 60% on the area ratio, and a maximum length c of the glass phase is 5 &#x3bc;m or less.

Conductive paste, electronic component and method for manufacturing electronic component

An electroconductive paste that includes an inorganic filler which contains a spherical Cu powder of 3 &#x3bc;m or less in average particle size; a flat Cu powder of 3 or more in aspect ratio and 10 &#x3bc;m or more in average particle size; glass frit; and a spherical inorganic powder of 30 &#x3bc;m or more in average particle size, the spherical inorganic powder including an inorganic material that is not melted in a heat treatment step for baking. The spherical inorganic powder is contained in a proportion of 10 to 35 parts by volume with respect to 100 parts by volume of a mixture of the spherical Cu powder and the flat Cu powder. In addition, the proportion of the flat Cu powder falls within the range of 10 to 50% by volume with respect to the total amount of the spherical Cu powder and flat Cu powder.

Electroconductive paste for bonding metal terminal, electronic component with metal terminal, and method for manufacturing same

A ceramic electronic component includes a ceramic body, a glass coating layer, and an electrode terminal. The ceramic body includes a plurality of internal electrodes whose ends are exposed on the surface of the ceramic body. The glass coating layer covers a portion of the ceramic body on which the internal electrodes are exposed. The electrode terminal is provided directly on the glass coating layer. The electrode terminal includes a plating film. The glass coating layer is made of a glass medium in which metal powder particles are dispersed. The metal powder particles define conduction paths that electrically connect the internal electrodes with the electrode terminal.

Ceramic electronic component and method for producing the same

A ceramic electronic component includes a ceramic body; a plurality of internal electrodes provided in the ceramic body and including ends exposed on a surface of the ceramic body; a coating layer covering a surface portion of the ceramic body on which the internal electrodes are exposed, the coating layer being made of a glass or resin medium in which metal powder particles are dispersed; and an electrode terminal provided directly on the coating layer and including a plating film. The metal powder particles define conduction paths electrically connecting the internal electrodes with the electrode terminal and have an elongated shape in cross section along a thickness direction of the coating layer. The metal powder particles defining the conduction paths have a maximum diameter not smaller than the thickness of the coating layer.

Ceramic electronic component including coating layer

A monolithic ceramic capacitor includes an outer electrode arranged on a ceramic element body including inner electrodes, and a dielectric layer present between a pair of the inner electrodes adjacent in a stacking direction and extending to one of a pair of end surfaces of the ceramic element body that defines an inter-electrode dielectric layer. A gap extending in a direction connecting the inner electrodes sandwiching the inter-electrode dielectric layer is present in about 5% to about 90% of inter-electrode dielectric layers in the ceramic element body at a position near or adjacent to at least one of the pair of end surfaces of the ceramic element body.

Monolithic ceramic capacitor

A multilayer ceramic capacitor having external electrodes. Each of the external electrodes has a lower layer resistance electrode and an upper layer conductive electrode. A glass contained in the upper layer conductive electrode has a softening point higher than that of a glass contained in the lower layer resistance electrode by 20&#xb0; C. or more.

Multilayer ceramic capacitor and method for manufacturing the same

Provided is a multilayer ceramic capacitor including external electrodes which also functions as a resistive element, and the external electrodes achieve strong bonding with internal electrodes containing Ni or a Ni alloy. The external electrodes include a resistive electrode layers contacting a ceramic laminate and internal electrodes. The resistive electrode layers contains a complex oxide which reacts with Ni or a Ni alloy contained in the internal electrodes in a proportion of 26 to 79% by weight, a glass component in a proportion of 20 to 56% by weight, and metal which reacts with Ni or a Ni alloy in a proportion of 1 to 18% by weight.

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Nagaokakyo, Japan

Toshiki Nagamoto