Kabushiki Kaisha Toyoda Jidoshokki Seisakusho

Kabushiki Kaisha Toyota Jidoshokki

Toshiki Inoue

Yoshifumi Kato

Takanori Murasaki

Kyoko Kumagai

Hisashi Shiraki

Toshihisa Shimo

Takashi Yoshida

Takashi Komori

Masanobu Hidaka

A semiconductor driver circuit has a plurality of output bumps that are connected to respective electrodes for energizing electroluminescent devices by electric current supplied through the electrodes. The output bumps are arranged in a plurality of output bump rows. Each of the output bump rows includes a plurality of the output bumps.

Semiconductor driver circuit, display device and method of adjusting brightness balance for display device

A plating bath which accommodates an insoluble anode and a printed-circuit board, and a copper dissolved bath which supplies copper ions are arranged. The insoluble anode is arranged as opposed to the printed-circuit board being a cathode, and a forward/reverse current is applied between both of the electrodes. Iron ions are added to a plating solution.

Electrolytic plating method and device for a wiring board

An aqueous solution containing sulfuric acid and hydrogen peroxide is used for a soft etchant in a soft etching step in a smear removing process performed prior to a catalyst applying process for chemical copper plating after formation of via holes through an insulating layer of a multi-layer substrate by irradiation of laser. The concentration of sulfuric acid is 2.4 times or less than the concentration of hydrogen peroxide. Preferably, the concentration of sulfuric acid is in a range of 9 to 90 g/l, and the concentration of sulfuric acid is lower than the concentration of hydrogen peroxide. More preferably, the concentration of sulfuric acid is in a range of 9 to 18 g/l, and the concentration of hydrogen peroxide is in a range of 33 to 38.5 g/l. As a result, smear can be certainly removed without excessively etching a conductive layer in the smear removing process.

Method of removing smear from via holes

A coloring layer composition for a chromatic device of the present invention contains an oxide such as tungsten oxide or niobium oxide and so on as a solute, water and an organic solvent such as propanol. In the step of forming a reduction coloring layer, a film is formed by using a peroxotungstic acid solution containing 100 parts by weight of WO.sub.3.aNb.sub.2 O.sub.5.bH.sub.2 O.sub.2.cH.sub.2 O (wherein a, b and c are each a positive number) as a solute, 20 to 120 parts by weight of water and 80 to 800 parts by weight of n-propanol as an organic solvent. At this time, a dip coating method is used, and the vertical pulling-up speed is less than 15 cm/min. The present invention can effectively prevent unevenness and separation of the reduction coloring layer.

Color layer composition for chromatic device and method of producing

The present invention relates to a method for preparing a coloring layer composition for a chromatic device comprising a step of preparing a peroxotungstic acid solution comprising a solute including WO.sub.3 .circle-solid.aNb.sub.2 O.sub.5 .circle-solid.bH.sub.2 O.sub.2 .circle-solid.cH.sub.2 O (a, b, and c represent a positive number), water for dispersing and holding the solute, and an organic solvent compatible with water, and aging the peroxotungstic acid solution to obtain a polymer. According to the method of the present invention, a large size chromatic device can be reliably produced at a low cost. Further, a composition having a sufficient coloring effect and a quick response speed of the coloration-bleaching change in the chromatic device can be prepared.

Method for preparing coloring layer composition for chromatic device

A coloring layer composition for a chromatic device of the present invention contains an oxide such as tungsten oxide or niobium oxide and so on as a solute, water and an organic solvent such as propanol. In the step of forming a reduction coloring layer, a film is formed by using a peroxotungstic acid solution containing 100 parts by weight of WO.sub.3.aNb.sub.2 O.sub.5.bH.sub.2 O.sub.2 .andgate.cH.sub.2 O (wherein a, b and c are each a positive number) as a solute, 20 to 120 parts by weight of water and 80 to 800 parts by weight of n-propanol as an organic solvent. At this time, a dip coating method is used, and the vertical pulling-up speed is less than 15 cm/min. The present invention can effectively prevent unevenness and separation of the reduction coloring layer.

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Kariya, Japan

Toshiki Inoue