Hitachi, Ltd.

Hitachi Chemical Company, Ltd.

Toshiki Iino

Toshio Hatada

Kenichi Kasai

Takahiro Daikoku

Noriyuki Ashiwake

Tadakatsu Nakajima

Akio Idei

Takayuki Atarashi

Tamotsu Tsukaguchi

Shigeyuki Sasaki

Yasuo Ohsone

Tetsuya Tanaka

Akira Yamagiwa

Hitoshi Matsushima

Fumiyuki Kobayashi

Atsuo Nishihara

Kazuhiro Komatsu

Hideyuki Kimura

Susumu Iwai

Michiyuki Takagi

Takao Ohba

Keizou Kawamura

Nobuo Kawasaki

Yoshihiro Kondou

Yoshito Hayashi

Kunio Kamata

Toshihiro Komatu

Tetsuro Honma

Hiromi Kaneko

There is disclosed a liquid-cooled electronic device. Semiconductor devices are mounted on a substrate of a semiconductor module immersed in a cooling liquid. A wire-like member is provided in the vicinity of a cooling medium ejection port of each cooling medium supply member which cools a respective one of the semiconductor devices by a jet of the cooling liquid. With this arrangement, the flow of the cooling liquid downstream of the wire-like member is disturbed to promote the boiling over the entire surface of the semiconductor device, and when the semiconductor device is to be cooled, a transient temperature rise is reduced at the time of starting the energization of the semiconductor device, thereby stabilizing the temperature of the semiconductor device.

Liquid-cooled electronic device

The disclosed invention aims at providing a semiconductor module structure which has a high ability of absorbing thermal deformation, is excellent in radiating ability and enables an easy maintenance operation. To this end, in the semiconductor module of the invention thermal conductor members are provided, each of which has an area of contact with a semiconductor device or an inner surface of a housing and has opposed heat transfer surfaces. A radiator is formed integrally on the housing. With this structure, large thermal deformation resulting from a high heat production density design can be absorbed, and at the same time heat from semiconductor devices can be efficiently radiated.

Semiconductor module

An electronic apparatus having a plurality of semiconductor devices which produce heat during operation, with a heat sink having a plurality of tabular or pin-type fins is provided on each semiconductor device. Nozzles are associated with the heat sinks so as to supply a cooling fluid into the heat sinks. The heat sinks are so arranged that all these heat sinks guide and discharge the cooling fluid in the same direction. A breadth of the respective nozzles, as measured in the direction (x-direction) of the flow and discharge of the cooling fluid determined by the heat sink is less than that of the associated heat sink. A width of the nozzle, as measured in the direction (y-direction) perpendicular to the x-direction is smaller than that of the associated heat sink. A space between adjacent nozzles provide a discharge passage of an ample cross-section which reduces resistance encountered by the heated cooling medium to be discharged therethrough.

Electronic apparatus

An electronic equipment has a cooling structure in which air discharged from heat sinks can be recovered without any leakage and compact blow ducts and discharge ducts are disposed in a narrow space. A supply opening and a discharge opening for cooling air are independently formed in a heat sink. A plurality of supply branched ducts and discharge branched ducts are combined in a comb-like shape along the axis of the ducts. Ejection openings for cooling air are formed on each of the supply branched ducts in positions corresponding to each of the heat sinks. Such ejection openings are closely connected to the supply openings for cooling air of the heat sinks. On the other hand, recovery openings for cooling air are formed on each of the refrigerant discharge ducts in a position corresponding to each of the heat sinks. Such recovery openings are closely connected to the discharge openings for gas refrigerant of the heat sinks.

Cooling apparatus for electronic equipment

A cooling apparatus for electronic equipment for improving the reliability of the equipment by making uniform the temperature distribution of heat generating devices mounted on the electronic equipment, more particularly on a computer and for reducing the working process required at the time of performing a maintenance of a printed circuit board in the electronic equipment by stacking, in a frame, the electronic printed circuit boards on which the heat generating devices, such as a CPU and memories, are mounted at predetermined intervals. The cooling apparatus has a fan fastened to one wall surface of a chamber and a plurality of jet cooling devices formed on the surface opposing the wall surface. The jet cooling devices are formed in parallel to the printed circuit boards. The jet cooling devices are slits, or nozzles or jet stream ducts extending among the printed circuit boards and are so formed as to supply cooling air in a jet stream state to each heat generating device. Therefore, the cooling air can be concentrated to locally cool the printed circuit board including the device that generates heat of a large heating value. Hence, the temperature rise in the heat generating devices can be made uniform.

Jet cooling apparatus for cooling electronic equipment and computer

An apparatus for cooling semiconductor devices includes a module for cooling semiconductor devices; a refrigerant cooling device for receiving via an outlet pipe the refrigerant discharged through an outlet port of the module to cool the refrigerant; a refrigerant circulation pump for receiving, via a suction pipe, the refrigerant cooled by the refrigerant cooling device and sending the refrigerant to the module via an inlet pipe; and a refrigerant-flow stabilizing mechanism for stabilizing a refrigerant circulation flow discharged from the refrigerant circulation pump to be returned to the refrigerant circulation pump via the module and the refrigerant cooling device. Since the refrigerant-flow stabilizing mechanism stabilize the refrigerant flow, the refrigerant flow can be stably circulated so that the semiconductor devices in the module are stably cooled.

Apparatus for cooling semiconductor device and computer having the same

This invention relates to an axial thrust balancing device for pumps which cancels an axial thrust caused by impellers by utilizing a discharge water pressure. In the device, there is provided a small axial gap between a low pressure sidewall of a balancing drum tightly fitted over a shaft of impellers and a flange-like end wall extending inwardly from a stationary wall along the low pressure sidewall of said balancing drum. On application of the device to a vertical pump, in particular, the balancing drum is prevented from being in contact with the end wall during suspension of operation.

Axial thrust balancing device for pumps

An axial thrust balancing system including a sleeve for balancing an axial thrust applied to a rotary shaft and a bush defining therebetween a clearance having arranged therein at least one pressure chamber for dividing the clearance into a plurality of smaller clearances. The axial division of the clearance reduced the ratio of the axial length of the clearance to the diameter of the sleeve and stabilizes the bearing characteristics of a film of fluid in the clearance, thereby inhibiting the generation of a self-excited vibration of the shaft up to a high rotation velocity.

Axial thrust balancing system

Growing community of inventors

Ibaraki-ken, Japan

Toshiki Iino