Matsushita Electric Industrial Co., Ltd.

Toshiki Abe

Norifumi Eguchi

Hiroshi Ariyoshi

A die bonder equipped with an image recognition unit having a zoom optical system for placing a chip to a correct location in accordance with recognition results delivered from the image recognition unit. Data related with the recognition offset data that specify a relationship in the relative location between optical coordinates system and mechanical coordinates system, and the pixel rate, etc. are stored in advance in a correction magnification index memory section, maintaining linkage to respective zoom magnification indices. Results of recognition are converted from a location information in terms of an optical coordinates system into a location information in actual dimensions in terms of a mechanical coordinates system of the die bonder, using a datum selected among the data in accordance with a magnification index at which the chip was pictured by a camera of an image recognition section. The data setting operations, which were required to be done at each time when the zoom magnification rate is changed, are made automatically to an increased operational advantage.

Automatic assembly apparatus and automatic assembly method

An LCD 1 is evacuated from the focus range of the camera 4 in a horizontal direction, while a positioning object 18 on a TCP 17 is placed in the focus range of the visual field of the camera 4 to obtain a dislocation of the TCP 17 by monitoring the positioning object 18. The TCP 17 is then lifted in a vertical direction keeping its horizontal position until it goes out of the focus range of the camera 4. The LCD 1 is returned in the horizontal direction so that a positioning object 2 on the LCD 1 comes into the focus range of the camera 4. Then, a dislocation of the LCD 1 is detected by monitoring the positioning object 2. A mutual positional relation is corrected by shifting at least either the LCD 1 or the TCP 17 in the horizontal direction based on the detected dislocations of the positioning objects 2 and 18. Finally, the TCP 17 is lowered keeping its horizontal position, and mounted on the LCD 1.

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Fukuoka, Japan

Toshiki Abe