Goo Chemical Company, Ltd.

Emaus Kyoto, Inc.

Kyoto University

Murata Manufacturing Co., Ltd.

Ngk Insulators, Inc.

Mitsubishi Chemical Corporation

Goo Chemical Industries Co., Ltd.

Kosen National Institute of Technology

Toshikazu Oda

Norio Ishizuka

Satoshi Miyayama

Soichi Hashimoto

Kyoko Konishi

Yoshinobu Tsujii

Keita Sakakibara

Katsuo Doi

Takaya Sato

Hideki Shimizu

Michiaki Iha

Masahiro Kubota

Shoya Yoda

Kazunari Yamada

Fumito Suzuki

Koichi Yoshioka

Masahiro Mizushima

Toshiaki Nishimura

Shizuharu Watanbe

A titania porous body is entirely formed of titania. The titania porous body includes a titania framework, first pores, and second pores. The titania framework forms a three-dimensional network structure. The first pores are opening portions of the three-dimensional structure. The second pores are disposed in a surface of the titania framework. Such a titania porous body is also referred to as a titania monolith.

Titania porous body and method for producing same

The present invention provides a porous body, the swelling of which under acidic conditions is suppressed, and a method for producing the porous body. The first porous body of the present invention is formed of a copolymer of an epoxy compound and a curing agent, wherein the porous body is a porous body containing no primary to tertiary amino groups and has an interconnected pore structure in which holes provided inside the porous body communicate with each other. The second porous body of the present invention is formed of a copolymer of an epoxy compound and a curing agent, wherein the porous body is a porous body containing no nitrogen atom to be quaternized by acid treatment, and has an interconnected pore structure in which holes provided inside the porous body communicate with each other.

Porous body, and method for producing porous body

The present invention provides porous particles made of an organic polymer, uniform in shape, and having through holes that are not closed. The porous particles according to the present invention are porous particles having a substantially spherical shape. The porous particles are made of an organic polymer. Each of the porous particles has an interconnected pore structure in which through holes provided inside the porous particle communicate with each other, and ends of the through holes are open toward an outside of the porous particle.

Porous particle made of organic polymer, method for producing porous particle made of organic polymer, and block copolymer

The present invention provides a separating medium including porous resin particles which has a sufficient pore diameter suitable for liquid chromatography applications and which has high strength, is reduced in pressure loss during liquid passing, has the excellent property of separating a desired substance, and has low nonspecific adsorption properties. The separating medium of the invention is a separating medium obtained by treating porous epoxy resin particles and having an average pore diameter of 10 to 2,000 nm, or a separating medium obtained by treating porous epoxy resin particles and having a water content of 50% or higher.

Separating medium and column for liquid chromatography

There is disclosed a photosensitive conductive paste comprising a water- or alkali-soluble acidic-functional-group-containing organic binder, a photosensitive organic component, an organic solvent, a conductive powder such as iron or copper, and a mono-ol compound having a boiling point of about 178&deg; C. or higher such as dipropylene glycol monoethyl ether and/or a diol compound such as pentamethylene glycol. The photosensitive conductive paste has excellent storage stability and can be developed consistently.

Photosensitive conductive paste

An ultraviolet-curable and alkali-developing type photo solder resist ink comprises an epoxy resin obtained by extending chains of an epoxy compound by an isocyanate compound having at least two isocyanate groups per one molecule of the isocyanate compound, an ultraviolet-curable resin having carboxyl group and an ethylenically unsaturated group having a photopolymerization capability, a photopolymerization initiator, and a diluent. The resist ink shows a wide precuring acceptable width for providing an extended shelf life, a good tacky-dry property after a precuring step, excellent light-sensitivity at an exposing step, superior resolution, and improved removability of a film of the resist ink by an alkaline solution at a developing step. In addition, a solder resist obtained by a post-baking step of the resist ink film provides excellent resistances to molten solder and gold plating.

Ultraviolet-curable and alkali-developing type photo solder resist ink

A process of manufacturing a printed circuit board having plated landless through-holes involves filling a radiation curable putty material in through-holes plated with copper in a substrate, exposing the material under radiation of light in order to cure the material, placing a liquid resist on the substrate surface, covering a mask over the resist, exposing the resist layer by using a mask having a circuit pattern, developing the resist, etching the substrate surface, and removing the cured putty material in the through-holes and the remaining portion of the resist. The filling material composition used in the process comprises hydrophthalic mono ester compound as a component (A), a catalyst for promoting photo polymerization of a vinyl group in the mono ester as a component (B), a highly transparent rosin having a Hazen color tone of 300 or less for the improvement of cure depth of the material after exposure of light as a component (C), and a powder of at least one extender selected from polyethelene, nylon, polyester, talc, silica, aluminum hydroxide, titanium oxide, barium sulfate, kaolinite, calcium carbonate, and phthalocyanine as a component (D).

Process of manufacturing a printed circuit board with plated landless

A radiation curable filling material is used for a process of manufacturing a printed circuit board having plated landless through-holes. The material is filled in the through-holes and solidified in the through-holes via a photo polymerization to protect plated through-hole interior from an etching solution. The composition comprises a hydrophthalic acid monoester compound as a component (A); a catalyst for promoting photo polymerization of a vinyl group in the mono ester as a component (B); a highly transparent rosin having a Hazen color tone of 300 or less for the improvement of filling material transmission by radiation as a component (C), a powder of extender as a competent (D). The photo polymerization reaction occurs at the vinyl group of the hydrophthalic mono ester with the presence of the catalyst for promoting the photo polymerization. The rate of the reaction is enhanced by adding a vinyl compound such as an acrylate. The superior transmission of the highly transparent rosin enables to increase cure depth of the filling material.

Filling material composition used for a process of manufacturing a

Photosensitive solder resist ink, printed circuit board and production

A resist ink composition developable with a diluted, alkaline solution, which exhibits high dispersion stability itself, can form a pattern with excellent resolution, even in the case of a low exposure amount, and can produce a cured resist film excellent in solvent resistance for high-performance printed circuits and which comprises an ultraviolet-curable resin obtained by copolymerizing (a) from 5 to 50% by weight of an ethylenically unsaturated monomer of a general formula: ##STR1## wherein R.sub.1 represents a hydrogen atom or a methyl group; R.sub.2 represents a hydrogen atom or an alkyl group; n represent an integer of from 1 to 4, and/or glycerol mono(meth)acrylate, (b) from 10 to 90% by weight or glycidyl (meth)acrylate and (c) from 0 to 80% by weight of other ethylenically unsaturated monomers capable of copolymerizing with these (a) and (b), followed by reacting the resulting copolymer with from 0.7 to 1.2 equivalents, relative to one epoxy equivalent of said copolymer, of (meth)acrylic acid and a saturated or unsaturated polybasic acid anhydride; a photopolymerization initiator; a diluent; and a thermosetting epoxy compound.

Resist ink composition, printed circuit board produced by using the

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Kyoto, Japan

Toshikazu Oda