University of Florida Research Foundation Inc

Texas Instruments Corporation

Toshikazu Nishida

Mark Sheplak

Louis Nicholas Cattafesta, Iii

Stephen Brian Horowitz

David Patrick Arnold

Saeed Moghaddam

Justin C Sanchez

Glen H Walters

Aftab A Bhanvadia

Scott E Thompson

Jose Carlos Principe

Theodore Sidney Moise

John Anthony Rodriguez

John Gregory Harris

Roozbeh Tabrizian

Rizwan Bashirullah

David Bloomquist

William M Humphreys, Jr

Khai D T Ngo

Mayur Ghatge

Antonio Guillermo Acosta

Erin E Patrick

Al Ogden

Mohammad Takmeel

Kehuey Wu

Patrick Lomenzo

Aniruddh Shekhawat

A method and device of polymerization to form 3D objects is provided. The method and device incorporate an inert immiscible liquid between a liquid monomer and a light source such that the liquid monomer is polymerized when exposed to polymerization light from the light source at a liquid monomer-inert immiscible liquid interface. The liquid monomer is polymerized into a solid polymer that forms the 3D object.

Three-dimensional fabrication at inert immiscible liquid interface

Described herein are stereolithographic methods for preparing 3D objects comprising hollow regions and/or multiple materials. In certain embodiments, the methods comprise applying a blocking composition to fill hollow regions in the 3D printed object. In certain embodiments, an absorbent is applied to dispense material into the 3D printed objects and to remove unwanted resin from the hollow regions. Additionally, in certain embodiments, the modular stereolithographic apparatuses described herein contain an invertible, double vat, which enables users easy access to multiple materials throughout the 3D printing process.

Methods and apparatuses for hollow and multi-material stereolithography

Various examples are provided related to hydrogen plasma treatment of hafnium oxide. In one example, a method includes depositing a monolayer of a precursor on a first oxide monolayer; forming a second oxide monolayer by applying an oxygen (O) plasma to the monolayer of the precursor; and creating oxygen vacancies in the second oxide monolayer by applying a hydrogen (H) plasma to the second oxide monolayer. In another example, a device includes a hafnium oxide (HfO) based ferroelectric thin film on a first side of a substrate and an electrode layer disposed on the HfObased ferroelectric thin film opposite the substrate. The HfOfilm includes a plurality of oxide monolayers including at least one HfOmonolayer, each of the plurality of oxide monolayers having oxygen vacancies distributed throughout that oxide monolayer.

Ferroelectricity and thermal retention through in situ hydrogen plasma treatment of doped hafnium oxide

A nano-mechanical acoustical resonator is designed and fabricated with CMOS compatible techniques to apply to mm-wave RF front-ends and 5G wireless communication systems which have extreme small scale and integrated in 3D sensors and actuators.

Hafnium-zirconium oxide (HZO) ferroelectric transducer and method of making the same

Techniques for forming an electronic device having a ferroelectric film are described. The electronic device comprises a ferroelectric material having one or more crystalline structures. The one or more crystalline structures may comprise hafnium, oxygen, and one or more dopants. The one or more dopants are distributed in the ferroelectric material to form a first layer, a second layer, and a third layer. The second layer is positioned between the first layer and the third layer. Distribution of one or more dopants within the first layer, the second layer, and the third layer may promote a crystalline structure to have an orthorhombic phase.

Doped ferroelectric hafnium oxide film devices

Energy harvesting systems and devices are provided that harvest energy from external asynchronous force impulses using fluidic force transfer of the external force impulses to a plurality of compliant piezoelectric layers that seal a corresponding plurality of inner cavities. Each inner cavity can contain a compressible gas. Direct fluidic force transfer can be accomplished via a compressible or incompressible fluid between an external cover and the compliant piezoelectric layers.

Asynchronous fluidic impulse strain-based energy harvesting system

A shear-stress sensing system can include a floating element whose displacement can be detected through use of optical measurements. The system can utilize high temperature materials to deliver the optical signal to the structure to be measured, which can also utilize high temperature materials. In one embodiment, an intensity modulation or phase modulation of a reflected signal can be measured to determine the shear stress. In another embodiment, a Moire fringe pattern can be used to determine the shear stress.

Floating-element shear-stress sensor

Methods are provided for enhancing properties, including polarization, of thin-film ferroelectric materials in electronic devices. According to one embodiment, a process for enhancing properties of ferroelectric material in a device having completed wafer processing includes applying mechanical stress to the device, independently controlling the temperature of the device to cycle the temperature from room temperature to at or near the Curie temperature of the ferroelectric material and back to room temperature while the device is applied with the mechanical stress, and then removing the mechanical stress. Certain of the subject methods can be performed as part of a back end of line (BEOL) process, and may be performed during the testing phase at wafer or die level.

Enhancement of properties of thin film ferroelectric materials

In one embodiment, a neural interface system includes an implantable neural probe having a flexible substrate, electrodes that extend from the substrate that are adapted to contact neural tissue of the brain, a signal processing circuit configured to process neural signals collected with the electrodes, and a wireless transmission circuit configured to wirelessly transmit the processed neural signals, and a backend computing device configured to wirelessly receive the processed neural signals, to process the received signals to reconstruct the collected neural signals, and to analyze the collected neural signals.

Neural interface systems and methods

Embodiments of a vibrational energy harvester are provided. A vibrational energy harvester can include a translator layer sandwiched between two stator layers. The translator layer can include a plate having an array of magnets and two or more piezoelectric patches coupled to a tether beam attached to the plate. The stator layers can have a printed circuit board with multilayer electrical windings situated in a housing. In operation, vibration of the housing can result in bending of the piezoelectric patches coupled to the tether beam. This bending simultaneously results in a relative displacement of the translator, which causes a voltage potential in the piezoelectric patches, and a relative velocity between the translator and the stators, which induces a voltage potential in the stator coils. These voltage potentials generate an AC power, which can be converted to DC power through a rectification circuit incorporating passive and active conversion.

Dual-mode piezoelectric/magnetic vibrational energy harvester

A method of fabricating a MEMS flexible substrate neural probe is provided. The method can include applying an insulation layer on a substrate, and depositing a plurality of metal traces on the insulation layer and electroplating each of the plurality of traces. The method also can include encapsulating the insulation layer and metal traces deposited thereon with an insulation layer. Additionally the method can include etching the insulation layer to form a plurality bond pad sites and probes to form a flexible ribbon cable having a plurality of bond pad sites disposed on a surface of the flexible cable and a plurality of neural probes extending from the flexible cable. The method further can include separating the substrate from the insulation layer and depositing insulation on each of the neural probes, each probe comprising insulated portion and exposed metallic tip. Moreover, the method can include cutting each of the exposed metallic tips, and plating each of the exposed metallic tips and each of the plurality of bond pad sites.

MEMS flexible substrate neural probe and method of fabricating same

A packaged semiconductor device () includes a semiconductor chip () having at least one selectively thinned substrate (cavity) region (). A package () is provided for mounting, enclosing and electrically connecting the chip () to the outside world, and structure for applying external stress () to induce strain in the thinned substrate region (). The external stress is preferably adjustable, such as by varying the gas flow (or a vacuum) applied through a pressure valve.

Methods and articles incorporating local stress for performance improvement of strained semiconductor devices

A multi-resonator-based system responsive to acoustic waves includes at least two resonators, each including a bottom plate, side walls secured to the bottom plate, and a top plate disposed on top of the side walls. The top plate includes an orifice so that a portion of an incident acoustical wave compresses gas in the resonators. The bottom plate or the side walls include at least one compliant portion. A reciprocal electromechanical transducer coupled to the compliant portion of each of the resonators forms a first and second transducer/compliant composite. An electrical network is disposed between the reciprocal electromechanical transducer of the first and second resonator.

Electromechanical acoustic liner

Embodiments of the present invention described and shown in the specification and drawings include a combination responsive to an acoustic wave that can be utilized as a dynamic pressure sensor. In one embodiment of the present invention, the combination has a substrate having a first surface and an opposite second surface, a microphone positioned on the first surface of the substrate and having an input and a first output and a second output, wherein the input receives a biased voltage, and the microphone generates an output signal responsive to the acoustic wave between the first output and the second output. The combination further has an amplifier positioned on the first surface of the substrate and having a first input and a second input and an output, wherein the first input of the amplifier is electrically coupled to the first output of the microphone and the second input of the amplifier is electrically coupled to the second output of the microphone for receiving the output signal from the microphone. The amplifier is spaced from the microphone with a separation smaller than 0.5 mm.

MEMS based acoustic array

An electromechanical floating element shear-stress sensor, which may also be referred to as a flow rate sensor, having one or more transduction mechanisms coupled to a support arm of a floating element wafer such that the transduction mechanisms are normal to the force applied to a top surface of the floating element. The transduction mechanisms may be generally attached to a side surface of one or more arms supporting the floating element and may be coupled together and to a processor using one or more contacts extending from the backside of the floating element sensor. Thus, the floating element shear-stress sensor may have an unobstructed surface past which a fluid may flow. The floating element may also include a temperature sensing system for accounting for affects of temperature on the floating element system.

Growing community of inventors

Gainesville, FL, United States of America

Toshikazu Nishida