Rohm Co., Ltd.

Osaka University

Kyoto University

Toshikazu Mukai

Kazuisao Tsuruda

Jaeyoung Kim

Tomoichiro Toyama

Jae-Young Kim

Masayuki Fujita

Hideaki Yanagida

Yuichi Ogawa

Tadao Nagatsuma

Masahiro Asada

Safumi Suzuki

Jae Young Kim

Hideyuki Kawakami

Sebastian Diebold

Kenta Urayama

A terahertz element of an aspect of the present disclosure includes a semiconductor substrate, first and second conductive layers, and an active element. The first and second conductive layers are on the substrate and mutually insulated. The active element is on the substrate and electrically connected to the first and second conductive layers. The first conductive layer includes a first antenna part extending along a first direction, a first capacitor part offset from the active element in a second direction as viewed in a thickness direction of the substrate, and a first conductive part connected to the first capacitor part. The second direction is perpendicular to the thickness direction and first direction. The second conductive layer includes a second capacitor part, stacked over and insulated from the first capacitor part. The substrate includes a part exposed from the first and second capacitor parts. The first conductive part has a portion spaced apart from the first antenna part in the second direction with the exposed part therebetween as viewed in the thickness direction.

Terahertz element and semiconductor device

A terahertz device includes a terahertz element, a sealing resin, a wiring layer and a frame-shaped member. The terahertz element that performs conversion between terahertz waves and electric energy. The terahertz element has an element front surface and an element back surface spaced apart from each other in a first direction. The sealing resin covers the terahertz element. The wiring layer is electrically connected to the terahertz element. A frame-shaped member is made of a conductive material and arranged around the terahertz element as viewed in the first direction. The frame-shaped member has a reflective surface capable of reflecting the terahertz waves.

Terahertz device and production method for terahertz device

One aspect of the present disclosure provides a terahertz-wave detector including a semiconductor substrate, an active element formed on the semiconductor substrate and a first resistive portion electrically connected in parallel with the active element.

Terahertz-wave detector and terahertz unit

According to one aspect of the present disclosure, a terahertz device is provided. The terahertz device includes a semiconductor substrate, a terahertz element, and a first rectifying element. The terahertz element is disposed on the semiconductor substrate. The first rectifying element is electrically connected to the terahertz element in parallel.

Terahertz device

A reflective detection device, includes: oscillation element oscillating a terahertz wave; exit part from which the terahertz wave exits; incident part to which the terahertz wave reflected from a detection target is incident; and detection element detecting the terahertz wave incident to the incident part, wherein the exit part and the incident part are disposed on one side in first direction and are spaced apart from each other in second direction with respect to the detection target, the terahertz wave exiting from the exit part travels to propagate from the exit part toward the incident part in the second direction along a direction toward the detection object in the first direction, and the terahertz wave incident to the incident part travels to propagate from the exit part toward the incident part in the second direction along a direction away from the detection target in the first direction.

Reflective detection device

A THz device includes: an antenna electrode capable of transmitting and receiving a THz wave to free space; first transmission lines capable of transmitting the THz wave, the first transmission lines respectively connected to the antenna electrodes; an active element of which a main electrode is connected to each of the first transmission lines; second transmission lines capable of transmitting the THz wave, the second transmission lines connected to the first active device; pad electrodes respectively connected to the second transmission lines; and a low-pass filter with respect to the THz wave, the low-pass filter connected to the pad electrodes, wherein impedance matching of between the antenna electrode and the active element is performed by an impedance conversion of the first transmission lines. The THz device is capable of the high-efficiency matching between the active element and the antenna due to the impedance conversion effect of the transmission line.

Terahertz device and terahertz integrated circuit

THz device includes: a semiconductor substrate; a first semiconductor layer disposed on the semiconductor substrate; an active element formed by being laminated on the first semiconductor layer; a second electrode connected to the first semiconductor layer to be connected to a cathode K of the active element, the second electrode disposed on the semiconductor substrate; a first electrode connected to an anode A of the active element, the first electrode disposed on the semiconductor substrate to be opposite to the second electrode; a rear reflector metal layer disposed on a back side surface of the semiconductor substrate opposite to the first semiconductor layer, wherein the active element forms a resonator between the second and first electrodes, wherein electromagnetic waves are reflected on the rear reflector metal layer, and electromagnetic waves have a surface light-emission radiating pattern or surface light-receiving pattern in a vertical direction to the semiconductor substrate.

Terahertz device and fabrication method of the same

The THz device module includes: a substrate; a THz device disposed on a front side surface of the substrate, and configured to oscillate or detect THz waves; a cap covering the THz device being separated from the THz device, and comprising an opening formed at a position opposite to the THz device in a vertical direction of the front side surface of the substrate; and a sealing member covering the opening of the cap so as to seal the THz device in conjunction with the substrate and the cap. A distance from the THz device to the sealing member is within a near-field pattern to which an electric field of the THz waves can be reached without interruption from a surface of the THz device to the sealing member. The THz device module efficiently emits or detects THz waves from the opening, thereby suppressing upsizing of the cap.

Terahertz device module

There is provided solution testing equipment which can detect an output variation of a THz oscillation device using a THz wave (h&#x3bd;) by contacting a liquid or cells on an RTD oscillation device, and can reduce the size and weight thereof. The solution testing equipment includes: a THz oscillation device configured to radiate the THz wave I; a THz detection device configured to receive the THz wave I; and a solution as a test object disposed on the THz oscillation device, in which the solution is tested on the basis of output characteristics of the terahertz wave varying in response to a relative permittivity of the solution.

Solution testing equipment

A terahertz oscillation device includes a first electrode placed on the semiconductor substrate; a second electrode placed via the insulating layer toward the first electrode, and opposes the first electrode to be placed on the semiconductor substrate; a MIM reflector formed between the first electrode and the second electrode by sandwiching the insulating layer; a resonator adjoining of the MIM reflector and is placed between the first electrode and the second electrode which oppose on the semiconductor substrate; an active element placed at the substantially central part of the resonator; a waveguide adjoining of the resonator and is placed between the first electrode and the second electrode which oppose on the semiconductor substrate; and a horn apertural area adjoining of the waveguide and is placed between the first electrode and the second electrode which oppose on the semiconductor substrate.

Growing community of inventors

Kyoto, Japan

Toshikazu Mukai