Tdk Corporation

Toshikazu Endo

Minoru Takaya

Kenichi Kawabata

Hisashi Kobuke

Masami Sasaki

Kei Suzuki

Hisayuki Abe

Toshiyuki Abe

Takaaki Morita

Masashi Katsumata

Kazuhiko Itoh

Yoshiaki Akachi

Kosuke Takano

Yasuyuki Hattori

Hiroshige Ohkawa

Takashi Kajino

Seiji Takahara

A semiconductor embedded moduleof the present invention has a configuration in which a semiconductor device, which is an electronic component such as a semiconductor IC (die) in a bare chip state, is embedded in a resin layer(second insulating layer). In the semiconductor device, a redistribution layeris connected to land electrodes. A protective layer(first insulating layer) is provided on the redistribution layer, and is provided with openings such that external connection pads P of the redistribution layerare exposed. Also, the resin layeris formed to cover the protective layer, and vias V are formed at the positions of the respective external connection pads P of the redistribution layer. The grinding rate of the resin layeris larger than that of the protective layer

Semiconductor embedded module and method for producing the same

A semiconductor IC-embedded modulecomprises a multilayer substratehaving first and second insulating layersand, and a controller ICand memory ICthat are embedded in the multilayer substrate. A wiring layeris formed as an internal layer in the multilayer substrate. Part of the wiring layerconstitutes a bus lineX. The controller ICor memory ICis embedded in the second insulating layer. First and second ground layersandare provided respectively in the first and second insulating layersand. The effect of noise generated by bus lines is reduced, and an additional reduction in noise and a decrease in size and thickness are achieved by laying out bus lines that connect the semiconductor ICs so that distances are minimized.

Semiconductor IC-embedded module with multilayer substrates with multiple chips embedded therein

A hard disk drive is provided with a platter, a spindle motor for driving the platter, an arm with a magnetic head attached to a distal end thereof, a voice coil motor for driving the arm, a first circuit substrate, and a drive casing for accommodating and electrically shielding the platter, spindle motor, arm, voice coil motor, and first circuit substrate. The first circuit substrate has a multilayer substrate, a plurality of digital ICs that are embedded as bare chips in the multilayer substrate, and a bus line for connecting the digital ICs. The digital ICs are disposed in a mutually horizontal configuration.

Hard disk drive and wireless data terminal using the same

A module with embedded semiconductor IC of the present invention includes a first resin layer, a second resin layer, post electrodes passing through the first and second resin layers, and a semiconductor IC mounted as embedded between the first resin layer and the second resin layer. Stud bumps are formed on land electrodes of the semiconductor IC and positioned with respect to the post electrodes. Owing to this positioning of the stud bumps formed on the semiconductor IC with respect to the post electrodes, the planar position of the stud bumps is substantially fixed. As a result, it is possible to use a semiconductor IC having a very narrow electrode pitch of 100 &#x3bc;m or smaller, particularly of around 60 &#x3bc;m.

Module with embedded semiconductor IC and method of fabricating the module

A core material-including organic core board or inorganic sintered boardhaving a plurality of band-shaped conductor patternsformed on its front and rear surfaces is sliced in a direction crossing the band-shaped conductor patterns. End portions of the band-shaped conductor patternsexposed on each of cut surfaces of the core boardare connected to one another by bridging conductor patterns formed on the cut surfaces. In this manner, at least one helical coil is provided. The inner diameter of the helical coil can be kept constant while coil pitch accuracy can be kept good.

Inductive device and method for producing the same

A laminated electronic component including at least one inductance element and produced from a laminate having electrical insulators and electrical conductors laminated alternately. The inductance element is formed as a helical coil having a plurality of turns each constituted by four sides. The inductance element has pairs of parallel conductor pieces and pairs of bridging conductor pieces. Each pair of parallel conductor pieces form two of the four sides of one turn of the coil. Each pair of bridging conductor pieces form the other two sides of one turn of the coil. Grooves are formed in the laminate to thereby form the parallel conductor pieces. The grooves are filled with an electrically insulating material. The bridging conductor pieces are formed on the electrically insulating material.

Inductance element, laminated electronic component, laminated electronic component module and method for producing these element, component and module

A composite magnetic material including a resin and generally spherical magnetic metal particles of at least one type dispersed in the resin and consisting essentially of single crystal grains, the metal particles having a mean particle size of 0.1 to 10 &#x3bc;m and each having an insulating coating layer at least partially coated thereon.

COMPOSITE MAGNETIC MATERIAL AND MAGNETIC MOLDING MATERIAL, MAGNETIC POWDER COMPRESSION MOLDING MATERIAL, AND MAGNETIC PAINT USING THE COMPOSITE MAGNETIC MATERIAL, COMPOSITE DIELECTRIC MATERIAL AND MOLDING MATERIAL, POWDER COMPRESSION MOLDING MATERIAL, PAINT, PREPREG, AND SUBSTRATE USING THE COMPOSITE DIELECTRIC MATERIAL, AND ELECTRONIC PART

A composite dielectric material comprising a resin resulting from a polyvinylbenzyl ether compound and a dielectric ceramic powder dispersed therein is useful in the high-frequency region. A composite magnetic material comprising a polyvinylbenzyl ether compound and a magnetic powder is also provided as well as a flame retardant material comprising a polyvinylbenzyl ether compound and a flame retardant. These materials may be used in the fabrication of substrates, prepreg sheets, coated metal foils, molded items, and metal foil-clad substrates.

COMPOSITE DIELECTRIC MATERIAL, COMPOSITE DIELECTRIC SUBSTRATE, PREPREG, COATED METAL FOIL, MOLDED SHEET, COMPOSITE MAGNETIC SUBSTRATE, SUBSTRATE, DOUBLE SIDE METAL FOIL-CLAD SUBSTRATE, FLAME RETARDANT SUBSTRATE, POLYVINYLBENZYL ETHER RESIN COMPOSITION, THERMOSETTIN

This invention has an object of providing a method for producing a multilayer substrate or an electronic part wherein decrease in the thickness has been enabled without causing the problem of insufficient strength or the like in the handling, as well as the electronic part. Such object has been attained by a method for producing a multilayer substrate or an electronic part comprising the steps of adhering a conductor layer to a transfer film, patterning the conductor layer to form a predetermined pattern, placing the transfer film overlaid with the patterned conductor layer on a prepreg so that the side of the conductor layer faces the prepreg, and then adhering the transfer film to the prepreg by applying heat and pressure and peeling the transfer film to produce the prepreg having the conductor layer formed thereon; and the multilayer electronic part produced by such method.

Method for producing multilayer substrate and electronic part, and multilayer electronic part

The invention is to offer electronic parts and a method of producing the same in which a producing time is shortened, crack or warp are hard to occur, and cost-down can be attained. Core substrates are made by forming a resin or a compound material made by mixing powder-like functional materials with this resin into thin plates, and hardening them. Conductor patterns are formed on at least any of front and back surfaces of the core substrates through any of an evaporation process, an ion plating process, an ion beam process, a sputtering process, and a vapor deposition process, followed by patterning. Half-hardened prepregs are produced by forming the resin or the compound material made by mixing powder-like functional materials with this resin into the thin plates. The prepregs and the core substrates are alternately laminated and laminated layers are made by unifying through a hot pressing.

Electronic parts and method producing the same

Using plural layers selected from among composite resin substrates having a fully high or low dielectric constant, composite resin substrates having a fully high magnetic permeability, and composite resin substrate layers having a fully high Q value, the invention provides a multilayer electronic part of small size having high performance and improved overall electrical characteristics. The multilayer electronic part includes constituent layers of at least two types formed of composite materials and a conductor layer formed on at least one composite material layer, wherein the conductor layer constructs a predetermined electric circuit.

Growing community of inventors

Tokyo, Japan

Toshikazu Endo