Nitto-Denko Corporation

Toshikazu Baba

Masaki Mizutani

Shotaro Masuda

Yuichi Tsujita

Atsushi Hino

Yasuto Ishimaru

Yoshihiro Kawamura

Yoshinari Takayama

Makoto Tsunekawa

Ichiro Amino

An opto-electric hybrid board includes: an electric circuit board including an insulative layer, and an element mounting electrode formed on the front surface of the insulative layer; an optical element mounted on the element mounting electrode by contact frictional heat; and an optical waveguide including a first cladding layer in contact with the back surface of the insulative layer of the electric circuit board. Between the insulative layer and the first cladding layer, a reinforcing layer is provided at the portion corresponding to the element mounting electrode. A reinforcing layer is provided at the portion corresponding to the element mounting electrode, in the surface of the first cladding layer, which is on the side opposite to the insulative layer. The resin-made reinforcing layer is greater than the first cladding layer in storage modulus at the temperature of the board when the element is being mounted.

Opto-electric hybrid board and method of manufacturing same

An opto-electric hybrid board which is capable of significantly reducing stresses applied to a bent portion thereof is provided. The opto-electric hybrid board includes a stacked electric circuit board and an optical waveguide. The electric circuit board includes an insulative layer having front and back surfaces, electrical interconnect lines formed on the front surface of the insulative layer, and an insulative coverlay formed on the front surface of the insulative layer and for covering and protecting the electrical interconnect lines. The optical waveguide includes a first cladding layer having a front surface, cores formed in a pattern on the front surface of the first cladding layer, and a second cladding layer covering the cores. Part of the opto-electric hybrid board is defined as a to-be-bent portion in which the coverlay and the optical waveguide are disposed in non-overlapping relation.

Opto-electric hybrid board

A photosensitive resin composition is provided, which has properties necessary for a solder resist (insulative property, solder heat resistance, alkali developability and the like) and is capable of forming a film that is excellent in folding endurance even after the IR reflow process. A flexible circuit board employing the photosensitive resin composition and a circuit board production method are also provided. The photosensitive resin composition comprises: (A) a linear polymer of an ethylenically unsaturated compound comprising a carboxyl-containing ethylenically unsaturated compound; (B) an epoxy resin; (C) a polymerizable compound containing an ethylenically unsaturated group; and (D) a photopolymerization initiator. The photosensitive resin composition has a tensile breaking elongation percentage of not less than 10% and a 2% weight loss temperature of not lower than 260&#xb0; C. after being cured.

Photosensitive resin composition, flexible circuit board employing the same, and circuit board production method

A halogen-free and flame-resistant photosensitive resin composition is provided, which has properties necessary for a solder resist (insulative property, solder heat resistance, alkali developability and the like) and is capable of forming a film that is excellent in folding endurance even after an IR reflow process. A flexible circuit board employing the photosensitive resin composition and a circuit board production method are also provided. The photosensitive resin composition comprises: (A) a linear polymer of an ethylenically unsaturated compound comprising a carboxyl-containing ethylenically unsaturated compound; (B) an epoxy resin; (C) a polymerizable compound containing an ethylenically unsaturated group; (D) a photopolymerization initiator; and a cyclic phosphazene (E) represented by the following general formula (1): 

A printing apparatus includes a feed-out unit for feeding out an elongated base material which is wound up in a roll, a printing unit for printing a liquid resist onto the elongated base material that is fed out of the feed-out unit, a wind-up unit for winding up the elongated base material on which the liquid resist is printed by the printing unit into a roll, and a suction unit positioned between the printing unit and the wind-up unit in a transport direction of the elongated base material for sucking up a solvent in the liquid resist.

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Ibaraki, Japan

Toshikazu Baba