Ngk Spark Plug Company, Limited

Nor Spark Plug Co., Ltd.

Toshikatsu Takada

Toshifumi Kojima

Noriyasu Sugimoto

Toshikazu Horio

Susumu Wakamatsu

Ayako Kawamura

Naoki Otaka

Takeshi Ohno

Ryuji Imai

Mitsugu Onoda

Masaki Ono

Takeshi Oono

Daisuke Nakata

Takashi Kanamori

Rokuro Kambe

Michiya Arakawa

Toshitaka Hayakawa

Shinobu Yoshida

There is provided an optical module for coupling with a fiber optic cable through an optical connector, including a module body connectable with a plug of the optical connector by a dedicated guide pin, with a side surface of the module body being opposed to a mating surface of the connector plug at which an end face of the fiber optic cable is exposed, and an optical element mounted to the module body and having an optical axis brought into alignment with an optical axis of the fiber optic cable upon fitting of the guide pin into the module body and the connector plug.

Optical module, optical module substrate and optical coupling structure

A substrate assembly for supporting an optical component includes a substrate having a front surface and a first recess, a second recess formed portion disposed in the first recess and having a second recess smaller in diameter than the first recess and having an open end at least at a side corresponding to the front surface, the second recess formed portion being made of a material having a machinability better than a material forming the substrate, and an alignment guide member fitted in the second recess and having a protruded portion protruding from the front surface of the ceramic substrate and fittingly engageable in an alignment hole of the optical component. A method of producing such a substrate assembly is also provided.

Substrate assembly for supporting optical component and method of producing the same

An optical device mounted substrate assembly includes a ceramic substrate having a first recess, an optical device mounted on the ceramic substrate and having one of a light emitting portion and a light receiving portion, the optical device being to be optically connected to one of an optical waveguide and an optical fiber connector in way as to align optical axes of the optical wave guide or the optical fiber connector with each other, a resin layer disposed in the first recess and having a second recess smaller in diameter than the first recess, and an alignment guide member fitted in the second recess and having a protruded portion protruding from a front surface of the ceramic substrate and fittingly engageable in an alignment hole of one of the optical waveguide and the optical fiber connector. A fabrication method of such a substrate assembly is also provided.

Optical device mounted substrate assembly

A high frequency antenna module having a substrate, a feeding electrode and two dielectric chip antennas being mounted on said substrate. Each of the two dielectric chip antennas having a base end connected to the feeding electrode and a floating end as an open end. A distance between said open ends of the two dielectric chip antennas is shorter than a distance between said base ends of the two dielectric chip antennas.

High frequency antenna module

A multiple band antenna comprising: a dielectric substrate; and a plurality of antenna elements being formed of each a conductor on a same face of the dielectric substrate and provided in a one-to-one correspondence with frequency bands to operate the frequency bands, wherein each of the antenna elements has an open end as one end and is connected at an opposite end to a feeder line and comprises a narrow part being placed on a side of the open end and formed by line with a narrow wide and a wide part being placed on a side of the feeder line and having a wider width than the narrow wide of the narrow part, the narrow part is turned in order in substantially the same direction as a width direction of the wide part, to form a meander shape, and the antenna elements have the wide parts joined in one piece forming a predetermined angle with each other so as to share a part of the wide parts.

Antenna and radio frequency module comprising the same

A dielectric antenna is provided for a high frequency wireless communication apparatus. The antenna includes a dielectric substrate and a conductive meander line layer formed on the dielectric substrate. A conductive feed line layer, having a greater line width than the width of the meander line layer, is also formed on the dielectric substrate. A conductive taper layer connects the conductive meander line layer to the conductive feed line layer. An edge of the conductive taper layer slants at an angle from an adjacent edge of the conductive feed line layer in a direction toward the conductive meander line layer.

Dielectric antenna for high frequency wireless communication apparatus

A multiple band antenna comprising: a dielectric substrate; and a plurality of conductor parts formed on a face of the dielectric substrate and connected to each other, wherein the plurality of conductor parts comprises: a first conductor part extending in a first direction with a repetitive pattern of peaks and valleys of a linear line and arriving at an open end; a second conductor part extending in a second direction substantially opposite to the first direction with a repetitive pattern of peaks and valleys of a linear line and arriving at an open end; and a third conductor part formed of a wide line having a wider width than that of each of the linear lines of the first and second conductor parts and connected to opposite ends of the first and second conductor parts and also connected to a feeder line.

Multiple band antenna

In a ceramic substrate with a thin-film capacitor, having a ceramic substrate a lower electrode layer formed on the ceramic substrate, a dielectric layer formed on the lower electrode layer and made of an oxide of a material constituting the lower electrode layer, and an upper electrode layer formed on the dielectric layer, a plating layer is provided between the ceramic base and the lower electrode layer to serve as a basis for the lower electrode layer.

Ceramic substrate with thin-film capacitor and method of producing the

A ceramic substrate has on the surface thereof a lower electrode for forming a thin-film condenser, wherein the lower electrode is formed by plating or the lower electrode consists of a plating layer formed on the surface of the ceramic substrate.

Ceramic substrate having lower electrode for forming thin-film condenser

A terminal for an electric circuit device, comprises a copper core, a gold (Au) layer provided over the copper core, and a nickel (Ni) layer having the thickness of 1.5 .mu.m or less, provided under the gold (Au) layer. In another embodiment, the core is made of an alloy containing (Ni) and covered by a metallized surface layer made of copper.

Input/output terminal for electronic circuit device

In a method of fabricating a multilayered interconnection for integrated circuit package, a coating of a metallized conductive pattern is formed on an upper surface of the substrate. A plurality of vertical copper studs are formed on the substrate for an interconnection with the metallized conductive pattern. A polyimide slurry is provided on the surface of the substrate to cover each top surface of the conductive studs. An upper surface of the polyimide slurry is polished to expose each top surface of the copper studs. A masking film is provided on each top surface of the copper studs prior to supplying an intermediate derivative of a polyimide polymer. The masking film works to protect the intermediate derivative against an chemically reaction with the copper studs to avoid a chelate compound from being produced at the time of heating step followed; A coat of the intermediate derivative of the polyimide polymer is provided entirely on the polished surface of the polyimide slurry, and is heated to form a coating of a polyimide layer. Then the coating of the polyimide layer is partly removed to expose portions corresponding to each top surface of the copper studs. The masking film is removed by etching.

Growing community of inventors

Aichi, Japan

Toshikatsu Takada