Polyplastics Co., Ltd.

Kureha Kagaku Kogyo Kabushiki Kaisha

Toshikatsu Nitoh

Toshifumi Nonaka

Kazutomo Tokushige

Yoshihito Tsukamoto

Takayuki Katto

Andrew B Auerbach

Yukio Ichikawa

Toshio Kanoe

Haruji Murakami

Tsuneyoshi Okada

Makoto Fukuda

Takeshi Amaike

Yoshimitsu Shirai

Nozomu Nakagawa

Sachio Anada

Masato Togami

Kiyokazu Nakamori

Apparatus, method, and coating die for producing long fiber-reinforced

A polyarylene sulfide resin composition having excellent metal corrosion resistance and excellent mechanical properties is composed of 100 parts by weight of a polyarylene sulfide resin; from 0.1 to 10 parts by weight of a specific metal compound the surface of which has been pretreated with a first alkoxysilane compound; from 0 to 10 parts by weight of a second alkoxysilane compound; and from 5 to 500 parts by weight of an organic filler.

Polyarylene sulfide resin composition

A polyarylene sulfide resin composition comprises (A) 100 parts by weight of a polyarylene sulfide resin and (B) 0.05 to 100 parts by weight of at least one gas-trapping agent selected from zinc carbonate, zinc hydroxide and a complex salt of zinc carbonate and zinc hydroxide. It further comprises up to 400 parts by weight of an inorganic filler other than the gas-trapping agent (B) in way of material, the filler being in the form of fibers, particles and/or plates.

Polyarylene sulfide resin composition and molded article thereof

A polyarylene sulfide resin composition useful for molded parts comprises (A) 100 parts by weight of a polyarylene sulfide, (B) 0.01 to 10 parts by weight of an organic bisphosphite of the formula: ##STR1## in which R.sub.1 and R.sub.2 are each an alkyl, an alkyl having at least one substituent, an aryl, an aryl having at least one substituent or an alkoxy, (C) 0 to 400 parts by weight of an inorganic filler and (D) 0.01 to 5 parts by weight of at least one alkoxy silane.

An improved method for encapsulating an electronic component with a highly stable protective layer is provided. Such encapsulation is carried out by injection molding about the surface of the electronic component of an encapsulant composition comprising a molten melt-processable polyester which is capable of forming an anisotropic melt phase having uniformly blended therein about 0.1 to 30 percent by weight based upon the total weight of the composition of silicone oil and/or a silicone rubber. Quality encapsulation is made possible under conditions wherein damage to the electronic component is minimized, and the resulting product is well protected without damage under a wide variety of end use conditions including variations in temperature. The process is carried out in the substantial absence of deleterious mold shrinkage and the product exhibits an extremely low linear coefficient of thermal expansion which well protects the electronic component encased therein.

Improvements in the encapsulation of electronic components employing low

The present invention discloses a composition comprising a mixture containing 100 parts by weight of substantially linear polyphenylene sulfide which is treated with an aqueous solution of an acid or a salt of a strong acid and a weak base and which has not less than 70 mol % of a repeating unit of ##STR1## 0.05 to 5 parts by weight of at least one aminoalkoxysilane compound and, if necessary, 0.01 to 3 parts by weight of a releasing agent, the mixture being kneaded under heating at a temperature higher than the melting point of the polyphenylene sulfide, said composition exhibiting excellent impact strength and weld strength and providing molded product with small amount of flash generated during molding. The invention also discloses a composition which further comprises a fibrous reinforcing material and/or an inorganic powdered or granular filler, according to necessity, as well as disclosing a method of producing said composition.

Polyphenylene sulfide composition and method of producing the same

A polyarylene sulfide resin composition, being improved in thermal resistance and mouldability, comprises (A) 100 parts by weight of a polyarylene sulfide resin, (B) 0.5 to 30 parts by weight of a phosphoric ester represented by the following formula (1): ##STR1##

A molded article useful for electrical parts, such as connectors, has at least one weld portion and is obtained by injection molding of a polyarylene sulfide composition comprising a polyarylene sulfide and an alkoxysilane such as aminoalkoxysilanes, epoxyalkoxysilanes, mercaptoalkoxysilanes and vinylalkoxysilanes, and optionally an inorganic filler.

Weld-containing polyarylene sulfide resin molded article

A polyarylene sulfide resin composition comprises

Growing community of inventors

Fuji, Japan

Toshikatsu Nitoh