Hitachi Cable, Inc.

Renesas Technology Corp.

Hitachi Cable Precision Co., Ltd.

Toshikatsu Hiroe

Hiroyuki Takasaka

Toshio Kawamura

Noboru Imai

Kenichi Kaneko

Gen Murakami

Hiroyuki Isobe

A light emitting device has a cup portion with a bottom surface opening, and one electrode of a light emitting element is connected to the cup portion. The other electrode of the light emitting element is connected to a lead set up from an inner space to outside the cup portion using the opening of the cup portion. Each electrode and lead of the light emitting device can be electrically connected without bonding wires. This prevents shadows or light unevenness from reflecting the shape of the bonding wire, thereby enhancing light-emission efficiency. As an alternative to setting up the lead from inside to the outside of the cup portion, the lead existing outside the cup portion and the other electrode are electrically connected via the bonding wire through the cup portion's opening. Thus, light outputted outside of the light emitting device is not intercepted by the bonding wire.

Light emitting device having a mirror portion

The occurrence of burrs and chips in punching an insulating film is suppressed by adjusting an edge tearing resistance of the insulating film. The edge tearing resistance is preferably 50 to 70 kgf/20 mm for the purpose of suppressing the burrs and the chips.

Insulating film with improved punching characteristics and lead frame

Growing community of inventors

Ibaraki, Japan

Toshikatsu Hiroe