Fujitsu Corporation

Toshikatsu Hino

Masakazu Kobayashi

Satomi Furukawa

Shozo Suzuki

Koji Kobayashi

Fumio Arase

Nobukatsu Wakabayashi

Kazuhide Toyoda

Takashi Ohshima

Method and apparatus for manufacturing printed wiring boards

Finished printed circuit boards and their identity data are stored in an automatic warehouse and in a stock file, respectively. It is determined whether all necessary printed circuit boards inserted into the shelf of an electronic apparatus are stored in the automatic warehouse by examining the identity data of the printed circuit boards, and if the all necessary printed circuit boards are found to be stored in the automatic warehouse, the identity data of all the necessary printed circuit boards are stored in a delivery file, and the printed circuit boards are delivered according to contents of the delivery file. Employing this method, an amount of 'goods in process' and their retention time are decreased, and information about individual parts used in a dispatched apparatus is easily obtained.

Management method of printed circuit boards in assembling process and

An automatic IC mounting process for mounting a plurality of ICs on an upper surface of a printed circuit board in accordance with a predetermined sequence program. Each of the ICs has a plurality of leads, each of which is to be inserted into a predetermined corresponding through-hole of the printed circuit board. The process includes: (i) a step for inserting the leads of an IC into the through-holes of the printed circuit board; (ii) a step for detecting whether or not each lead of the IC is correctly inserted into the corresponding through-hole after every step (i); (iii) a step for removing a misinserted IC having a misinserted lead from the printed circuit board and discarding the misinserted IC into a predetermined reject place immediately after a misinsertion is detected in the step (ii); (iv) a step for memorizing the information for identifying the misinserted IC; (v) a step for mounting a predetermined number of subsequent ICs on the printed circuit board in accordance with the predetermined sequence program, leaving the position of the misinserted IC unmounted; (vi) a step for searching for whether or not the information was memorized in the step (iv); and, (vii) a step for preparing a new IC identified by that information and remounting it on the printed circuit board at the position of the misinserted IC.

Automatic IC mounting process and apparatus for performing the process

Growing community of inventors

Oyama, Japan

Toshikatsu Hino