Ngk Spark Plug Company, Limited

Toshihisa Nomura

Kazushige Akita

Tomoyoshi Ono

Kenji Suzuki

Keisuke Okugawa

Yosuke Shinozaki

Kazuya Nozu

An electrostatic chuck includes: a body substrate having a substrate front surface and a substrate rear surface and made of ceramic; an attraction electrode provided in the body substrate; a metal base having a base front surface and a base rear surface, and placed such that the base front surface faces the substrate rear surface of the body substrate; and an internal through hole formed so as to penetrate the base front surface and the base rear surface of the metal base. The body substrate has a plurality of heating regions in each of which a heater electrode is provided. In the internal through hole, a plurality of heater electrode terminals are provided which are electrically connected to the heater electrode in each heating region. The plurality of heater electrode terminals provided in the internal through hole are electrically connected to a connection member provided in the internal through hole.

Electrostatic chuck

A wiring board for an electronic parts inspecting device that can be designed and produced relatively quickly, inexpensively, and with few jigs is provided. In certain embodiments the wiring board includes a base board made of an insulating material having a front surface and a back surface, the base board including a plurality of first via conductors as well as first terminals on the front surface and outer terminals on the back surface that are connected to the ends of the first via conductors, and a mounting board on the front surface of the base board having a front side that includes, a plurality of probe pads, a plurality of second terminals that are electrically connected to the first terminals of the base board, and front surface wirings that connect the probe pads to the second terminals. Lastly, a method of manufacturing the same is provided.

Wiring board for electronic parts inspecting device and its manufacturing method

A ceramic substrate for an electronic part inspecting apparatus that can be manufactured in accordance with predetermined specifications, regardless of the number and location of pins required, relatively quickly and inexpensively is provided. In certain embodiments the ceramic substrate is configured to connect to a probe for inspecting an electronic component, and the ceramic substrate comprises a plurality of vias located in a center area of the ceramic substrate that penetrate through the ceramic substrate in its thicknesswise direction, pads located in an outer periphery that surrounds the center area where the vias are located, the pads being configured to connected to the probes, and a conductive layer located only over the front surface of the ceramic substrate and connects the vias to the respective pads. Certain embodiments comprise a greater number of vias than pins. A method of manufacturing the ceramic substrate is also provided.

Ceramic substrate and method for manufacturing the same

A wiring board for an electronic parts inspecting device that can be designed and produced relatively quickly, inexpensively, and with a few number of jigs is provided. In certain embodiments the wiring board comprises a board main body having a front surface, a probe pad area having probe pads located in a central portion of the front surface, an outer connecting terminal area having outer connecting terminals located in a peripheral portion of the front surface, and wherein probe pads are connected to outer connecting terminals by front surface wirings formed between the probe pad area and the outer connecting terminal area. While certain embodiments further comprise inner wirings and first via conductors to connect the probe pads and outer connecting terminals, it is preferable to have no or a minimal amount of such inner wirings. Lastly, a method of manufacturing the same is provided.

An electronic component-inspection wiring board including a first laminate composed of plural first ceramic layers and having pads formed on a front surface to transmit inspection signals to an electronic component, wiring layers formed between the first ceramic layers , and via-conductors connecting pads to the wiring layers exposed on a rear surface of the first laminate; and a second laminate composed of second ceramic layers having plural via-conductors extending between front surface and rear surface of the second laminate, wherein lands connecting a via-conductor exposed on the rear surface of the first laminate and a via-conductor exposed on the front surface of the second laminate are disposed between the first laminate and the second laminate, and the diameter dof the land is 2-5 times larger than the diameter dof a via-conductor connected to the land.

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Kasugai, Japan

Toshihisa Nomura