Nec Tokin Corporation

Nec Tokin Toyama, Ltd.

Nec Corporation

Toshihisa Nagasawa

Akihiro Kawai

Yuichi Maruko

Kenji Araki

Tadamasa Asami

Shinji Arai

Hitoshi Takata

Satoshi Arai

Koji Sakata

Satoshi Abe

Yutaka Nakazawa

Takashi Yasuda

Masako Ohya

Kazuya Mimura

Mitsuru Ogawa

Makoto Tsutsui

Yuji Aoki

Surface-mount low-profile capacitor

A surface-mounting thin type capacitor includes a capacitor element having a shape ofand two end portions which form a side surface of the capacitor element. Two anode terminals are disposed on lower surfaces of the end portions along the side surface to form a mounting surface substantially perpendicular to the side surface. A cathode terminal is disposed at a middle part of the capacitor element to form the mounting surface together with the anode terminals. The cathode terminal is not between the anode terminals spatially and thereby manufacturing process of the capacitor is simplified and it is easy to change the intended use of the capacitor.

Surface-mounting capacitor

In a solid electrolytic capacitor, a second dielectric layer made of an oxide of valve action metal is formed on first side, second side, and third side surfaces of an anode portion of an anode member. Between the second dielectric layer and a conductive polymer layer of the cathode layer, an electrical insulating resin layer is formed.

Solid electrolytic capacitor, distributed constant type noise filter, and method of producing the same

A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions at opposite ends thereof and a cathode portion at the center, an anode terminal connected to each anode lead portion via a strip-like plate, and a cathode terminal connected to the cathode portion. The anode and the cathode terminals and have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case has a bottom portion filling a gap between the anode and the cathode terminals and mechanically connecting the anode and the cathode terminals and sidewalls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals have upper surfaces exposed on an inner bottom surface of the mold resin case to be connected to the anode lead portions and the cathode portion.

Surface-mount capacitor and method of producing the same

A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portionsat opposite ends thereof and a cathode portionat the center, an anode terminalconnected to each anode lead portionvia a strip-like plate, and a cathode terminalconnected to the cathode portion. The anode and the cathode terminalsandhave a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin casehas a bottom portion filling a gap between the anode and the cathode terminalsandand mechanically connecting the anode and the cathode terminalsand, and side walls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminalsandhave upper surfaces exposed on an inner bottom surface of the mold resin caseto be connected to the anode lead portionsand the cathode portion

In a surface-mount thin-profile capacitor including an aluminum foil as a base member composed of an aluminum core and a pair of etched layers covering opposite surfaces of the aluminum core, a resist resin is formed at a boundary between an anode as each of opposite end portions of the aluminum foil and a cathode formed at a center area of each of opposite surfaces of the aluminum foil. The resist resin separates and isolates the etched layer on the side of the anode and a conductive polymer layer from each other. If a part of the conductive polymer layer climbs up onto the resist resin, the climbing part of the conductive polymer layer is covered with an additional resist resin.

Surface-mount thin-profile capacitor and method of producing the same

A thin-type surface-mount capacitor is a solid electrolytic capacitor. The capacitor includes a capacitor element having an anode body in the form of a plate-like or foil-like valve-action metal that is area-increased, and a conductive functional polymer film used as a solid electrolyte. The capacitor further includes thermal adhesive insulating resin impregnated tapes that are stuck to the capacitor element on upper and lower sides thereof, and an element reinforcing metal plate and a solderable cathode terminal metal platethat are stuck to the tapes, respectively. The capacitor is finally formed by applying a curing treatment under high temperature and pressure. Each of the metal plates is applied with a stepping process that provides a difference in level corresponding to a predetermined thickness.

Thin-type surface-mount capacitor

A chip-type capacitor includes a capacitor element, an encapsulation resin covering an entirety of the capacitor element, an anode terminal having a base portion whose bottom surface is exposed on a mounting surface of the encapsulation resin and a standing-up portion perpendicular to the base portion and having one end connected to the base portion and the other end welded to an anode lead wire led out from the capacitor element, and a cathode terminal fixed through a conductive adhesive to the capacitor element so as to expose a bottom surface on the mounting surface of the encapsulation resin. A depressed portion is formed on each of opposite side surfaces of the encapsulation resin, thereby partially exposing a top surface of each of the anode and the cathode terminals opposite to the bottom surface to form a terminal exposed portion exposed out of the encapsulation resin.

Chip-type capacitor, method of manufacturing the same and molding die

An electric double-layer capacitor has a pair of thrust plates for thrusting a stacked cell pair and a gasket for encapsulating the stacked cell pair together with the thrust plates. The thrust plate has slanted side surfaces for effecting a close contact with a packaging overcoat. The thrust plates and the mounting gasket are coupled together by an interdigitaion relationship.

Growing community of inventors

Toyama, Japan

Toshihisa Nagasawa