Fujifilm Corporation

Fuji Photo Film Company, Limited

Toshihiro Usa

Kazunori Komatsu

Yoshiki Sakazaki

Masakazu Nishikawa

Tadashi Yasunaga

Kazuhiro Niitsuma

Satoshi Chai

Aya Mochizuki

Shotaro Ogawa

Kenichiro Tamaki

Kozue Ikeda

Takayuki Ito

Hideaki Tsubaki

Toru Fujimori

Hidenori Takahashi

Shuji Hirano

Atsushi Fujita

Koji Shirakawa

Kenji Sugiyama

Kenji Ichikawa

Katsuhiro Nishimaki

Ikuo Takano

Soft mold transfer container

A production method of a mold having a recessed pattern includes: a plate precursor preparation step of preparing a plate precursor having a pedestal on which a protruding pattern is disposed; a resin plate preparation step of preparing a thermoplastic resin plate having a recessed step portion; and a resin plate precursor production step of producing a thermoplastic resin plate precursor. The plate precursor comprises a substrate having a larger area than the pedestal in a plan view on a side opposite to a surface of the pedestal on which the protruding pattern is disposed. An edge portion where a side surface of the pedestal and the substrate are in contact with each other has a through-hole penetrating the substrate along the side surface of the pedestal.

Production method of mold having recessed pattern in recessed step portion

Soft mold transfer container lid

A production method of a mold having a recessed pattern includes: a plate precursor preparation step of preparing a plate precursor having a pedestal on which a protruding pattern is disposed; a resin plate preparation step of preparing a thermoplastic resin plate having a recessed step portion; and a resin plate precursor production step of producing a thermoplastic resin plate precursor, the resin plate precursor production step including a positioning step of positioning the protruding pattern of the plate precursor and a center position of the recessed step portion, and a recessed pattern forming step of forming a recessed pattern having an inverted shape of the protruding pattern on the thermoplastic resin plate by pressing the protruding pattern of the heated plate precursor and the pedestal against the recessed step portion, thereafter cooling the plate precursor, and separating the plate precursor from the thermoplastic resin plate.

Production method of mold having recessed pattern in recessed step portion, and manufacturing method of pattern sheet

Provided are a mold case that prevents deformation of a microneedle array, and a manufacturing method of a microneedle array. The problems are solved by the manufacturing method of a microneedle array including: a filling step of filling needle-like recessed portions of a mold having flexibility and having a plurality of the needle-like recessed portions on a front surface, with a liquid material; and a drying step of drying the liquid material in a state where the mold filled with the liquid material is stored in the mold case which causes an edge portion of the mold to be sandwiched between the lid and the pedestal.

Mold case and manufacturing method of microneedle array

Provided are a production method of a mold having a recessed pattern, and a manufacturing method of a pattern sheet having good accuracy and excellent productivity. The production method of a mold includes: a step of preparing an electroform having a protruding pattern and a mold having a first mold and a second mold forming a cavity; a step of fixing the electroform excluding an end portion of the electroform to the first mold; a clamping step of clamping the electroform excluding the end portion of the electroform and a region of the protruding pattern between the first mold and the second mold to form the cavity; and an injection step of filling the cavity with a resin.

Production method of mold having recessed pattern, and manufacturing method of pattern sheet

Provided are a production method of a mold having a recessed pedestal pattern for preventing a liquid flow and a manufacturing method of a pattern sheet. A production method of a mold having a recessed pedestal pattern, has: a step of preparing an insert mold having a protruding needle pattern group; a step of preparing a mold having a first mold provided with a protruding pedestal shape and a second mold; a holding step of holding the protruding pedestal shape of the first mold and the protruding needle pattern group of the insert mold in an overlapping manner; a clamping step of performing clamping with the first mold and the second mold to form a cavity; and an injection step of filling the cavity with a resin.

Production method of mold having recessed pedestal pattern, and manufacturing method of pattern sheet

There is provided a method capable of manufacturing a mold at low cost, and a method of manufacturing a biocompatible pattern sheet by using the mold. The method of manufacturing a mold having a recessed pattern includes the steps of: forming a silicone resin film by applying a silicone resin solution to a surface of a model having a protrusion pattern; defoaming the silicone resin film by reducing the silicone resin film in pressure; forming the mold by heating and curing the silicone resin film while a base plate is in contact with a face of the silicone resin film, the face being opposite to the model; and releasing the mold from the model after releasing the base plate. The method of manufacturing a pattern sheet uses the mold.

Method of manufacturing mold and method of manufacturing pattern sheet

A chemical amplification resist composition that is used for preparation of a mold, and a mold preparation method and a resist film each using the composition are provided.

Chemical amplification resist composition, and mold preparation method and resist film using the same

When writing the shapes of elements of a fine pattern on a substrate by microscopically vibrating the electron beam back and forth in a radial direction of the substrate or in a direction orthogonal to the radial direction and deflecting the electron beam in a direction orthogonal to the vibration direction to scan the electron beam so as to completely fill the shapes of the elements, a proximity-effect correction is performed according to the arrangement density of the elements in which the amount of dose is adjusted by setting the deflection speed faster for the writing of an element in a densely arranged region than for the writing of an identical element in a sparsely arranged region.

Electron beam writing method, fine pattern writing system, method for manufacturing uneven pattern carrying substrate, and method for manufacturing magnetic disk medium

When performing writing on a substrate applied with a resist by rapidly vibrating electron beam in a direction orthogonal to a radial direction of the substrate and X-Y deflecting the electron beam while rotating the substrate in one direction, a long element is written by scanning the electron beam with the middle position of a 2-bit signal length as the center position of the electron beam so as to completely fill the area of the writing length reduced by a predetermined ratio and an unwritten portion of predetermined width remaining on each side of the long element with respect to a final 2-bit signal length on a magnetic disk medium.

Electron beam writing method for magnetic recording medium

When writing element shapes of a fine pattern on a substrate applied with a resist by scanning an electron beam thereon, ON/OFF control is performed for emitting the electron beam at a predetermined rotational position of the substrate by a blanking-OFF signal, performing writing in a rotational direction of the substrate along with the rotation of the substrate, and terminating the writing by a blanking-ON signal based on write data to perform writing for one round, and repeating the writing based on the ON/OFF control by moving the electron beam or substrate in a radial direction of the substrate and rotation control is performed for controlling the rotation speed of the rotation stage so as to be increased for inner track writing and decreased for outer track writing inversely proportional to the radius of the writing position.

When writing a hard disk pattern on a substrate applied with a resist by scanning an electron beam on the substrate while rotating a rotation stage, writing is started with respect to each radial direction position of each area based on a predetermined encoder pulse for each radial direction position among those generated according to the rotational angle of the rotation stage that occurs after a predefined encoder pulse that occurs ahead in a rotational direction of a radial direction position whose write start position in a circumferential direction in each area arrives first at the writing position as the rotation stage rotates and ahead of the write start position in the circumferential direction with respect to each radial direction position, and after a predetermined time from the predetermined encoder pulse.

When writing elements of a fine pattern on a substrate applied with a resist by scanning an electron beam on the substrate, the electron beam is scan controlled so as to completely fill the shape of each of the elements by vibrating the electron beam rapidly in a radius direction of the rotation stage and at the same time deflecting in a direction orthogonal to the radius direction of the rotation stage faster than a rotational speed thereof, thereby sequentially writing the elements.

Growing community of inventors

Odawara, Japan

Toshihiro Usa