Seiko Epson Corporation

Toshihiro Sawamoto

Hiroyuki Kobayashi

Akiyoshi Aoyagi

Hirohisa Nakayama

Tomoo Kinoshita

A liquid ejection head including: a head body having a nozzle surface; a fixing plate including a bottom surface to be fixed to the head body and a side surface intersecting the bottom surface; and first filler filled between the head body and the side surface, wherein the side surface is in contact with a biasing plate biased from the side surface toward the head body, and the first filler is filled at least to a height of contact position between the fixed plate and the biasing plate with respect to the bottom surface.

Liquid ejection head and liquid ejection apparatus

A method is provided to realize a three-dimensional mounting structure of different types of packages. By bonding protruding electrodes onto lands, which are formed on a first carrier substrate, second and third carrier substrates are mounted on the first carrier substrate such that ends of the second and third carrier substrates are arranged above a semiconductor chip.

Semiconductor device, electronic device, electronic equipment, method of manufacturing semiconductor device, and method of manufacturing electronic device

An anisotropic conductive film bonds the semiconductor chip to the substrate while serving as an electrically conductive medium therebetween. The anisotropic conductive film is produced by laminating, in a unitary body, an electrically conductive particle containing layer constructed of a mixture of electrically conductive particles and a resin, and an electrically non-conductive layer having a fluidity lower than the fluidity of the electrically conductive particle containing layer.

Anisotropic conductor film, semiconductor chip, and method of packaging

An anisotropic conductive film includes hard portions at the two edges and a soft portion constituting the remainder. Due to such a construction, when a semiconductor chip is bonded to a substrate by thermocompression, the hard portions inhibit the soft portion from flowing toward the periphery of the semiconductor chip. Thereby, it is possible to prevent the anisotropic conductive film from adhering to a hot pressing tool.

Growing community of inventors

Suwa, Japan

Toshihiro Sawamoto