Ibiden Company Limited

Toshihiro Nomura

Kiyotaka Tsukada

Daisuke Minoura

Hiroshi Sakaguchi

Hideki Furuzawa

Tomohiro Nishikawa

Naotaka Higuchi

A sound-absorbing member has a Helmholtz resonance structure including an inlet passage and a hollow portion connected to the outside through the inlet passage, wherein the sound-absorbing member includes a first layer and a second layer disposed on the first layer, the first layer includes a first main surface and a second main surface opposite to the first main surface, the second layer includes a third main surface facing the second main surface and a fourth main surface opposite to the third main surface, the first layer includes a first through-hole penetrating through the second main surface from the first main surface and defining the inlet passage, the second main surface includes a second main surface opening defining an end portion of the first through-hole and a second main surface flat portion, the third main surface includes a third main surface opening defining an end portion of the hollow portion and a third main surface flat portion, the second main surface opening has an opening area smaller than the opening area of the third main surface opening, and a first air layer is formed at least at a portion between the second main surface flat portion and the third main surface flat portion.

Sound absorption member, vehicle component, and automobile

A semiconductor device includes wiring boards each having an insulating board, conductor circuits and through-holes, the insulating board having top and bottom surfaces, the conductor circuits formed on the top and bottom surfaces, the through holes penetrating the insulating board and electrically connecting the conductor circuits of the top and bottom surfaces; conductor posts each having flange, head and leg portions, the flange portion having first and second surfaces and having an external diameter larger than that of the through-hole, the head portion protruding from the first surface, the leg portion protruding from the second surface; and electronic components each having an electrode formed on one or more surfaces and connected to the leg portion. The head portion is inserted until the first surface of the flange portion comes into contact with the bottom surface of the wiring board and electrically connected at an inner wall of the through-hole.

Semiconductor device and method for manufacturing the same

A conductor circuit and method of manufacturing a conductor circuit. The method includes forming a continuous conductor pattern on an insulating substrate, and connecting a short-circuit wire at a first position on the continuous conductor pattern such that two or more points on the continuous conductor pattern are short-circuited to each other by the short-circuit wire at the first position. An electrolytic plating film is formed on the continuous conductor pattern while the short-circuit wire is connected to the continuous conductor pattern at the first position, and the short-circuit wire is removed from the first position on the continuous conductor pattern to uncover a first exposed portion of the continuous conductor pattern.

Growing community of inventors

Ibi-gun, Japan

Toshihiro Nomura