Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Sakai Chemical Industry Co., Ltd.

Matushita Electric Industrial Co., Ltd.

Toshihiro Nishii

Shinji Nakamura

Shigeru Yamane

Toshiaki Takenaka

Hideaki Komoda

Kunio Kishimoto

Takeshi Suzuki

Fumio Echigo

Satoru Tomekawa

Eiji Kawamoto

Izuru Nakai

Masayuki Sakai

Toshiharu Okada

Akihiro Miura

Hidenori Hayashi

Toru Fujimoto

Yoshihiro Kawakita

Toshikazu Kondo

Kiyohide Tatsumi

Tadao Kimura

Junichi Kimura

Shinji Harada

Yasuhiro Tai

Koichi Tsuda

Yuichiro Sugita

Akio Ochi

Yasuharu Fukui

Hiroshi Yamaji

The present invention provides a chlorine-containing resin composition capable of providing a processed product that is excellent in thermal stability and heat resistance and that has various excellent properties derived from the chlorine-containing resin in an efficient, easy, simple, and high-yield manner, without degrading the appearance of the processed product. The present invention also provides a method for providing such a processed product. The present invention relates to a chlorine-containing resin composition containing a chlorine-containing resin, a hydrotalcite powder, and organic acid zinc, wherein the hydrotalcite powder contains magnesium (Mg) and/or zinc (Zn), and aluminum (Al), the molar ratio of the total amount of magnesium and zinc to the amount of aluminum ((Mg+Zn)/Al) is 2.20 or less, and the hydrotalcite powder has an oil absorption of 30 ml/100 g or less.

Chlorine-containing resin composition

In a method of manufacturing a circuit forming board, a first sheet having a first direction is transferred in a second direction, so that the first direction of the first sheet is parallel to the second direction. Films are stuck onto both surfaces of the first sheet while transferring the first sheet in a third direction orthogonal to the first direction of the first sheet. This method allows a connecting member, such as conductive paste, to electrically couple between layers of the circuit forming board.

Method of manufacturing circuit forming board

A manufacturing method of a clad board includes: sticking a releasing film to a pre-preg sheet; forming a non-through-hole or through-hole in the pre-preg sheet including the releasing film; filling the hole with conductive paste; peeling off the film; and heating and pressing a metal foil onto the pre-preg sheet. The clad board has a smooth face formed on one face or both the faces of the pre-preg sheet, so that the conductive paste is restrained from spreading in an interface between the pre-preg sheet and the releasing film. This structure can avoid short-circuit between circuits and prevent insulating reliability from lowering. As a result, an yield rate is improved, and a reliable circuit board is obtainable.

Method of manufacturing clad board for forming circuitry, clad board and core board for clad board

A stable and high quality circuit forming substrate is provided even when the work size is increased in the circuit forming substrate. In a stacking step, prepregs that are B stage substrate materials, are arranged lined with respect to a first metal foil, and stacked on the first metal foil. A C stage substrate material is stacked on the B stage substrate materials. Further, the prepregs that are two or more B stage substrate materials, are stacked on the C stage substrate material and a second metal foil is stacked thereon.

Method for manufacturing circuit forming substrate

A conductive portion is formed in a hole formed in a material sheet. A metal foil is placed on a surface of the material sheet to provide a laminated sheet. The laminated sheet is heated and pressed to provide a circuit-forming board. The metal foil includes a pressure absorption portion and a hard portion adjacent to the pressure absorption portion. The pressure absorption portion has a thickness changing according to a pressure applied thereto. The circuit-forming board provided by this method provides a high-density circuit board of high quality having reliable electrical connection.

Method for producing circuit-forming board and material for producing circuit-forming board

Method of manufacturing circuit-forming board and material of circuit-forming board

A circuit board with reliable electrical connections is provided. An insulated board material, having connections for connecting a layer to another layer, includes a reinforcing member. A thickness of the entire insulated board material is at least equal to and not more than 1.5 times of a thickness of the reinforcing member.

Circuit-formed substrate and method of manufacturing circuit-formed substrate

In a heat and press stage of manufacturing printed wiring boards, a functional surface layer having release property is provided on a surface of a cushion, and a blocking layer is prepared between the functional surface layer and an inner layer having cushion property so that a frequency of use of the cushion can be increased.

Method of manufacturing printed wiring boards

A laminated circuit board with electronic components buried therein comprises a substrate on which a land disposed on one main surface thereof is connected and fixed by solder to an integrated circuit (or the like). A sheet is laminated on the upper surface of the substrate. A filling portion by fluid resin is formed by clearance at the outer periphery of the integrated circuit (or the like). The sheet maintains its shape by woven or non-woven cloth having a hole in which the integrated circuit (or the like) is buried. The woven or non-woven cloth is impregnated with resin having heat fluidity and is thermally compressed. Thus, the electrical and mechanical connections between the laminated circuit board and electronic component can be enhanced in reliability.

Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus

In order to improve the adhesion of a circuit to a circuit forming board, a separation film including a base film and a coating layer formed on the base film is joined to both the sides of the board. When a laser beam is applied to form a throughhole in the board, a unified portion of the board and the separation film is formed around the throughhole. An energy beam is applied to the whole or a part of the surface of a circuit formed at a circuit forming step to transfer a part of the separation film. Thus, a high density board where the circuit strongly adheres to the board can be realized in the manufacturing process of the circuit forming board.

Method of manufacturing circuit forming board to improve adhesion of a circuit to the circuit forming board

It is possible to obtain a clean high-quality circuit board by removing affected material and foreign matter produced when a hole is formed. A manufacturing method of the circuit board includes (a) preparing a film-coated board material by bonding a film material as a mask to a board material, (b) forming a hole in the film-coated board material by applying a laser beam thereto, and (c) selectively removing the unnecessary material sticking to the film-coated board material from the film-coated board material by supersonic cleaning without peeling the film material off the board material. Unnecessary material such as foreign matter is produced when the hole is formed, and the unnecessary material sticks to the board material. After removal of such unnecessary material, a conductive material is disposed in the hole, using the film material as a mask, and the film material is later removed from the board material.

Method of manufacturing a circuit board and its manufacturing apparatus

The present invention aims to provide a printing plate capable of preventing paste of high viscosity adhering to an edge of a squeegee from being transferred to and left on a through hole of a printed circuit board when the paste is being filled by a squeegeeing method. The printing plate has a metal sheet () provided with a squeegee cleaning section () formed thereon and fixed to the back surface of a slanting area () of mask () attached to a plate framework (). The through hole of the printed circuit board is filled with paste only after paste of high viscosity adhering to the edge of the squeegee is removed by the squeegee cleaning section (), to prevent the paste from being left on the through hole, and thereby achieving the printed circuit board of excellent quality.

Printing plate, circuit board and method of printing circuit board

In the process of forming a through-hole or blind-hole at desired positions of a the substrate material, the present invention sets a drilling target position for each hole and a plurality of auxiliary drilling positions at a periphery of the drilling target position, and performs a plurality of drillings at the drilling target position and the plurality of auxiliary drilling positions. In another preferred embodiment of the present invention, a plurality of drillings are performed only at the auxiliary drilling positions per one hole at the desired position. According to the present invention, through-holes or blind-holes having several sizes of diameters can be formed by using one drilling jig under a single drilling condition. Accordingly, it is possible to efficiently produce circuit boards at low costs.

Circuit board production method and circuit board production data

For the purpose of achieving enhanced reliability with respect to interlayer connections of printed wiring boards, a manufacturing method of printed wiring boards of the present invention includes any one of the steps of A) restricting the resin flowing in hot press processing, B) joining fiber reinforcements together by fusion or adhesion, C) having the thickness of a board material reduced after a filling process and D) forming a low fluidity layer via a filler mixed in a board material. Such properties as allowing the resin flowing in hot press processing to be controlled are provided to a material for manufacturing printed wiring boards of the present invention or to a volatile ingredient contained therein to allow the thickness of a board material to be reduced efficiently after a filling process.

Method and material for manufacturing circuit-formed substrate

A method of manufacturing multi-layer circuit board comprising: a hole forming step for forming through-holes or blind-holes in a plate-form or sheet-form board material, and a filling step for filling a paste into through-holes or blind-holes formed in the hole forming step by using a filling means. A second paste is supplied to the paste in the filling process by using a paste supplying means to stabilized a viscosity of the paste and the paste is reliably filled into the through-holes or the blind-holes.

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Osaka, Japan

Toshihiro Nishii