Sony Corporation

The Furukawa Electric Co., Ltd.

Uacj Corporation

Furukawa Automotive Systems Inc.

Toso Kabushiki Kaisha

Toshihiro Nakamura

Hisashi Koaizawa

Kotaro Kitawaki

Sadayuki Toda

Hideyuki Hatakeyama

Nobuaki Orita

Naoki Kitamura

Michio Kondo

Wataru Kumagai

Kenkichi Suzuki

Hiroshi Kuraseko

Ryohei Yamada

Tomohiro Nakayama

Yasuhiro Naka

Hideki Takahashi

Takeshi Yagi

Yasuhiro Ishibashi

Takashi Nakayama

Hiroshi Yasutomi

Tomonari Murakami

Gen Fujiki

Ryo Sakamoto

Keiichi Aiso

Shinpei Todo

Toshiaki Tateishi

Kimie Imakawa

Tetsuya Kumada

Yoko Moriai

Keita Yoshimura

An aluminum alloy disc blank for a magnetic disc made of an aluminum alloy containing Fe: 0.005 to 1.800 mass % with the balance being Al and inevitable impurities, wherein a flatness change of the aluminum alloy disc blank for a magnetic disc when the aluminum alloy disc blank for a magnetic disc is held in the atmosphere at 50° C. or lower for 336 hours is 2.0 μm or less.

Aluminum alloy disc blank for magnetic disc and magnetic disc

This magnetic disk device is a 3.5-inch magnetic disk device equipped with magnetic disks formed from an aluminum alloy substrate. The magnetic disks arranged in a stacked manner have a thickness Td of 0.3 mm to 0.6 mm, the number N of magnetic disks involved is 10 to 16, and spacers disposed between the magnetic disks have an outside diameter 2 Rso of 35 mm to 65 mm. The outside diameter 2 Rso (mm) of the spacers satisfies 2 Rso≥−60 Td+70 and 2 Rso≤−0.5 N−+16.5 N−73.

Magnetic disk device

[Object] The present invention provides a joined conductor and a method for manufacturing a joined conductor that can improve electrical conductivity between conductors. [Solution] In a joined conductorincluding a joining portionin which a plurality of conductors exposed portionsarranged along a longitudinal direction X are fused and joined, the joining portionis configured to have a substantially rectangular shape in an orthogonal cross section orthogonal to the longitudinal direction X, and among a pair of side surfaces in width directionand a pair of side surfaces in up-down directionconfigured such that a first surfaceand a second surfacethat face each other in the orthogonal cross section, and a hornand a hornare paired, on each of the first surfaceand the second surfaceof the pair of side surfaces in width directionthat are at least one pair, a corrugated portionthat has a corrugated shape and in which a ridgeprotruding outward and a valleyrecessed inward are alternately continuously provided along the longitudinal direction X is formed.

Joined conductor, conductor joining device, method for manufacturing joined conductor, and conductor joining method

An aluminum alloy substrate () for magnetic disk satisfies at least two of three inequalities of an inequality group [A] and satisfies all of four inequalities of an inequality group [B], or satisfies at least two of the three inequalities of the inequality group [A] and satisfies all of four inequalities of an inequality group [C], when a plate thickness of the disk at a position (b1) is defined as t, a plate thickness at a position (b2) is defined as t, a plate thickness at a position (b3) is defined as t, a plate thickness at a position (a1) is defined as t, a plate thickness at a position (a2) is defined as t, and a plate thickness at a position (a3) is defined as t.

Aluminum alloy substrate for magnetic disk, disk drive device, method for manufacturing aluminum alloy substrate for magnetic disk, and method for measuring aluminum alloy substrate for magnetic disk

A conductor connection device for joining a plurality of conductors with ultrasonic welding, the conductor connection device comprising: a horn including a contact surface that is brought into contact with the conductors, the horn being configured to be ultrasonically vibrated; a pair of restricting portions configured to be brought into contact with the contact surface and to be relatively movable along the contact surface; and an anvil that is relatively moved toward and away from the contact surface, the horn and the pair of restricting portions being moved relative to the anvil to sandwich the anvil between the pair of restricting portions facing each other, and at least one of the pair of restricting portions being moved toward the other.

Conductor connection device and conductor connection method

In a heating drawing, a base material glass plate is heated and softened in a heating furnace, and drawn to a desired thickness to form a glass strip. In the heating drawing, the base material glass plate is heated so that the base material glass plate has a U-shaped temperature distribution in a width direction. Such process can be realized through heating by a heating element which has a non-heating portion at a position opposite to a central portion of the base material glass plate in the width direction and a heating portion on both sides of the non-heating portion. Thus provided is a method of manufacturing a glass strip, the method includes heating and softening the base material glass plate, and drawing the base material glass plate to a desirable thickness to form a glass strip, and is capable of manufacturing a thin, rod-like glass strip with an excellent flatness.

Process for producing glass bar

Speaker

There is provided a method of manufacturing a plate member including preparing a base plate member having main faces, and performing etching by immersing at least part of the base plate member in an etching liquid while controlling a lowering speed of a liquid surface of the etching liquid on the main faces of the base plate member to a desired lowering speed.

Method of manufacturing plate member and plate member

The linear semiconductor substrateorof the present invention comprises at least one desired thin filmformed on a linear substratehaving a length ten or more times greater than a width, thickness, or diameter of the linear substrate itself. Adopting semiconductor as the thin filmforms a linear semiconductor thin film. The linear semiconductor substrateorof the present invention is produced by utilizing a fiber-drawing technique which is a fabricating technique of optical fibers.

Linear semiconductor substrate, and device, device array and module, using the same

A method of continuously forming a thin film includes the step of: moving a glass substrate with a thin strip shape having a constant db/2(d+b), where d is a thickness thereof and b is a width thereof in a cross section thereof, within a range from 0.015 to 0.15 through a film depositing region in which a reaction gas is supplied and a temperature is controlled to be high so that the glass substrate is rapidly heated; and moving continuously the glass substrate, immediately after the film depositing region, to pass through a cooling region in which a temperature is lower than that of the film depositing region, so that the glass substrate is rapidly cooled and the thin film formed of a component of the reaction gas is formed on the glass substrate.

Method of forming continuous thin film and linear glass substrate with thin film

Video camera

A sheet glass that has a side surface with an average surface roughness equal to or less than 0.2 &#x3bc;m is provided. Furthermore, a method of manufacturing a sheet glass is provided that includes processing a base-material glass sheet to obtain a sheet glass that has a side surface with an average surface roughness equal to or less than 0.2 &#x3bc;m. Moreover, a method of manufacturing a sheet glass is provided that includes processing a base-material glass sheet so that an average surface roughness of a side surface becomes equal to or less than a predetermined value according to a section modulus of the sheet glass that is to be manufactured.

Sheet glass and method for manufacturing sheet glass

Growing community of inventors

Tokyo, Japan

Toshihiro Nakamura